SCHEMBL599064

SCHEMBL599064

Fc1c(F)c(F)c(S(c2c(F)c(F)c(F)c(F)c2F)(c2c(F)c(F)c(F)c(F)c2F)c2c(F)c(F)c(F)c(F)c2F)c(F)c1F.[O-]B(O)O.c1ccc([I+]c2ccccc2)cc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Boric Acid SCHEMBL16245157 0.95
SCHEMBL10939481 0.80 CA4 (0.39)
SCHEMBL598512 0.79
Boric Acid SCHEMBL11048797 0.78 CA4 (0.38)
SCHEMBL503663 0.74 CA1 (0.38)
Boric Acid SCHEMBL16245295 0.74
SCHEMBL7680409 0.71 HTR2A (0.31)
SCHEMBL956498 0.71 HTR2A (0.31)
SCHEMBL1879917 0.71 HTR2A (0.31)
SCHEMBL10709566 0.71 TRPV6 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8030425-B2 Photosensitive compositions based on polycyclic polymers for low stress, high temperature films PROMERUS LLC (US) 2011-10-04 US claimed
EP-1771491-B1 PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS PROMERUS LLC (US) 2009-11-18 EP claimed
US-20090189277-A1 PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS FOR LOW STRESS, HIGH TEMPERATURE FILMS PROMERUS LLC (US) 2009-07-30 US claimed
EP-1771491-A1 PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS Promerus, LLC (US) 2007-04-11 EP claimed
US-7022790-B2 Photosensitive compositions based on polycyclic polymers SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-04-04 US claimed
WO-2006016925-A1 PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS PROMERUS LLC (US) 2006-02-16 WO claimed
EP-1532486-A1 PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS SUMITOMO BAKELITE CO., LTD. (JP) 2005-05-25 EP claimed
US-20040039153-A1 Photosensitive compositions based on polycyclic polymers SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-02-26 US claimed
WO-2004006020-A1 PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-15 WO claimed
US-8816485-B2 Methods and materials useful for chip stacking, chip and wafer bonding SUMITOMO BAKELITE CO., LTD. (JP) 2014-08-26 US disclosed
US-20120175721-A1 Methods And Materials Useful For Chip Stacking, Chip And Wafer Bonding PROMERUS LLC (US) 2012-07-12 US disclosed
US-8120168-B2 Methods and materials useful for chip stacking, chip and wafer bonding PROMERUS LLC (US) 2012-02-21 US disclosed
US-8114948-B2 Photosensitive compositions based on polycyclic polymers SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-02-14 US disclosed
US-8030425-B2 Photosensitive compositions based on polycyclic polymers for low stress, high temperature films PROMERUS LLC (US) 2011-10-04 US disclosed
US-7022790-B2 Photosensitive compositions based on polycyclic polymers SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-04-04 US disclosed
WO-2006016925-A1 PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS PROMERUS LLC (US) 2006-02-16 WO disclosed
US-20060020068-A1 Photosensitive compositions based on polycyclic polymers for low stress, high temperature films PROMERUS, LLC 2006-01-26 US disclosed
EP-1532486-A1 PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS SUMITOMO BAKELITE CO., LTD. (JP) 2005-05-25 EP disclosed
US-20040039153-A1 Photosensitive compositions based on polycyclic polymers SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-02-26 US disclosed
WO-2004006020-A1 PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-15 WO disclosed