SCHEMBL7680409

SCHEMBL7680409

[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.c1ccc([I+]c2ccccc2)cc1.c1ccc([I+]c2ccccc2)cc1.c1ccc([I+]c2ccccc2)cc1.c1ccc([I+]c2ccccc2)cc1.c1ccc([I+]c2ccccc2)cc1.c1ccc([I+]c2ccccc2)cc1.c1ccc([I+]c2ccccc2)cc1.c1ccc([I+]c2ccccc2)cc1.c1ccc([I+]c2ccccc2)cc1.c1ccc([I+]c2ccccc2)cc1.c1ccc([I+]c2ccccc2)cc1.c1ccc([I+]c2ccccc2)cc1

nearest known ligand 0.31

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
HTR2A P28223 2/20 0.31
HTR2C P28335 2/20 0.31
HTR2B P41595 2/20 0.31
RECQL P46063 1/20 0.31
CYP3A4 P08684 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL956498 1.00 HTR2A (0.31) HTR2AHTR2CHTR2BRECQLCYP3A4
SCHEMBL5556834 1.00 HTR2A (0.31) HTR2AHTR2CHTR2BRECQLCYP3A4
SCHEMBL1879917 1.00 HTR2A (0.31) HTR2AHTR2CHTR2BRECQLCYP3A4
SCHEMBL10939471 0.88 CYP3A4 (0.33) HTR2CCYP3A4TDP1
SCHEMBL11048802 0.88 CYP3A4 (0.33) HTR2CCYP3A4TDP1
SCHEMBL17200747 0.87 ACHE (0.40) CYP3A4TDP1
SCHEMBL10709566 0.83 TRPV6 (0.39) HTR2AHTR2CHTR2BTDP1
SCHEMBL10939481 0.83 CA4 (0.39) CYP3A4TDP1
SCHEMBL36560 0.82 ALDH1A1 (0.40) HTR2CCYP3A4TDP1
Boric Acid SCHEMBL11048797 0.81 CA4 (0.38) TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260077385-A1 FILM FORMING METHOD, CURABLE COMPOSITION, AND ARTICLE MANUFACTURING METHOD CANON KABUSHIKI KAISHA (JP) 2026-03-19 US disclosed
US-20260042932-A1 COMPOSITION, PATTERN FORMING METHOD, AND ARTICLE MANUFACTURING METHOD CANON KK (JP) 2026-02-12 US disclosed
US-20250282915-A1 METHOD FOR FORMING CURED FILM, METHOD FOR MANUFACTURING IMPRINT MOLD SUBSTRATE, METHOD FOR MANUFACTURING IMPRINT MOLD, METHOD FOR MANUFACTURING RELIEF STRUCTURE, METHOD FOR FORMING PATTERN, METHOD FOR FORMING HARD MASK, METHOD FOR FORMING INSULATING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE DAI NIPPON PRINTING CO., LTD. (JP) 2025-09-11 US disclosed
US-11787976-B2 Method of producing anisotropic conductive film and anisotropic conductive film DEXERIALS CORPORATION (JP) 2023-10-17 US disclosed
US-11784154-B2 Anisotropic conductive film and method of producing the same DEXERIALS CORPORATION (JP) 2023-10-10 US disclosed
WO-2023190168-A1 CURED FILM FORMING METHOD, METHOD FOR MANUFACTURING SUBSTRATE FOR IMPRINT MOLD, METHOD FOR MANUFACTURING IMPRINT MOLD, METHOD FOR MANUFACTURING UNEVEN STRUCTURE, PATTERN FORMING METHOD, HARD MASK FORMING METHOD, INSULATING FILM FORMING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 大日本印刷株式会社 2023-10-05 WO disclosed
CN-116323720-A Curable resin composition for silicon-containing resist, pattern forming method, method for producing imprint mold, and method for producing semiconductor device 大日本印刷株式会社 2023-06-23 CN disclosed
CN-109087900-B Anisotropic conductive film and method for producing same 迪睿合株式会社 2023-04-21 CN disclosed
CN-115702387-A Method for manufacturing light emitting element 中央硝子株式会社 2023-02-14 CN disclosed
CN-114975098-A Nanoimprint liquid material, method for producing pattern of cured product, and method for producing circuit board 佳能株式会社 2022-08-30 CN disclosed
US-9585247-B2 Anisotropic conductive film and method of producing the same DEXERIALS CORPORATION (JP) 2017-02-28 US disclosed
US-20160255724-A1 ELECTRICAL CONNECTION MATERIAL DEXERIALS CORPORATION (JP) 2016-09-01 US disclosed
WO-2016136240-A1 NANONIMPRINT LIQUID MATERIAL, METHOD FOR MANUFACTURING NANOIMPRINT LIQUID MATERIAL, METHOD FOR MANUFACTURING CURED PRODUCT PATTERN, METHOD FOR MANUFACTURING OPTICAL COMPONENT, AND METHOD FOR MANUFACTURING CIRCUIT BOARD CANON KABUSHIKI KAISHA (JP) 2016-09-01 WO disclosed
US-20160155717-A1 ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREFOR DEXERIALS CORPORATION (JP) 2016-06-02 US disclosed
US-20150271918-A1 ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME DEXERIALS CORPORATION (JP) 2015-09-24 US disclosed
US-20150231803-A1 METHOD OF PRODUCING ANISOTROPIC CONDUCTIVE FILM AND ANISOTROPIC CONDUCTIVE FILM DEXERIALS CORPORATION (JP) 2015-08-20 US disclosed
US-20150214176-A1 ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME DEXERIALS CORPORATION (JP) 2015-07-30 US disclosed
US-6406770-B1 MULTILAYER; CONTAINING CATIONIC POLYMER DAINIPPON INK AND CHEMICALS, INC. (JP) 2002-06-18 US disclosed
EP-1005037-A1 OPTICAL DISK AND METHOD OF MANUFACTURING OPTICAL DISK DAINIPPON INK AND CHEMICALS, INC. (JP) 2000-05-31 EP disclosed
US-4342673-A CURABLE EPOXY PREPOLYMERS AND AN IODONIUM SALT GENERAL ELECTRIC COMPANY (US) 1982-08-03 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260077385-A1 FILM FORMING METHOD, CURABLE COMPOSITION, AND ARTICLE MANUFACTURING METHOD EEF1D, RHOA, YWHAH HTR2A 1300/4885HTR2C 2284/4885HTR2B 2209/4885
US-20260042932-A1 COMPOSITION, PATTERN FORMING METHOD, AND ARTICLE MANUFACTURING METHOD SMCHD1, PIM1, PIM2 HTR2A 3052/4885HTR2C 3218/4885HTR2B 3634/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.