SCHEMBL600607

SCHEMBL600607

CCOc1ccc(-c2c3ccccc3nc3ccccc23)cc1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 5/20 0.61
MAPT P10636 4/20 0.61
KMT2A Q03164 3/20 0.61
POLB P06746 1/20 0.61
OPRM1 P35372 1/20 0.61
OPRD1 P41143 1/20 0.61
RAD52 P43351 1/20 0.61
NPSR1 Q6W5P4 1/20 0.61
L3MBTL1 Q9Y468 1/20 0.61
SLC2A1 P11166 1/20 0.60
RAB9A P51151 7/20 0.59
NPC1 O15118 6/20 0.59
ALDH1A1 P00352 4/20 0.59
SMN1; SMN2 Q16637 3/20 0.59
TP53 P04637 2/20 0.59
GUSB P08236 1/20 0.59
HPGD P15428 3/20 0.57
LMNA P02545 1/20 0.57
GAA P10253 1/20 0.55
ESR1 P03372 2/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29488297 1.00 KDM4E (0.61) KDM4EMAPTKMT2APOLBOPRM1
SCHEMBL29042705 0.88 ESR1 (0.58) KDM4EMAPTKMT2APOLBOPRM1
SCHEMBL601983 0.87 MAPT (0.63) KDM4EMAPTPOLBNPSR1L3MBTL1
SCHEMBL29834186 0.87 MAPT (0.63) KDM4EMAPTPOLBNPSR1L3MBTL1
SCHEMBL30662422 0.86 SMN1; SMN2 (0.57) KDM4EMAPTKMT2APOLBOPRM1
SCHEMBL15200921 0.86 NQO1 (0.58) KDM4EMAPTKMT2APOLBOPRM1
SCHEMBL23439583 0.83 MAPT (0.51) KDM4EMAPTKMT2APOLBOPRM1
SCHEMBL29587729 0.83 SMN1; SMN2 (0.62) KDM4EMAPTKMT2APOLBOPRM1
SCHEMBL602200 0.83 SMN1; SMN2 (0.62) KDM4EMAPTKMT2APOLBOPRM1
SCHEMBL304562 0.81 KDM4E (0.61) KDM4EMAPTKMT2APOLBRAD52

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN claimed
CN-108241259-B Resist composition with good hole masking function and capable of directly depicting, exposing and imaging 杭州福斯特电子材料有限公司 2021-08-10 CN claimed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US claimed
US-12353130-B2 Photosensitive resin composition and photosensitive resin multilayer body ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-07-08 US disclosed
WO-2025018412-A1 PHOTOSENSITIVE ELEMENT, PHOTOSENSITIVE ELEMENT ROLL, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING CONDUCTOR PATTERN 旭化成株式会社 2025-01-23 WO disclosed
US-20240408595-A1 STRUCTURE COMPRISING MICROCHANNEL, PRODUCTION METHOD FOR SAID STRUCTURE, AND MICROCHANNEL DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-12-12 US disclosed
US-12032286-B2 Method for producing multi-layered type microchannel device using photosensitive resin laminate ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-07-09 US disclosed
CN-118119565-A Structure having micro-channel, method for manufacturing same, and micro-channel device 旭化成株式会社 2024-05-31 CN disclosed
CN-113156764-B Photosensitive resin composition and resist laminate 杭州福斯特电子材料有限公司 2024-04-26 CN disclosed
US-20240059803-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY AND METHOD FOR PRODUCING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-02-22 US disclosed
US-20230375930-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-11-23 US disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
CN-1945429-B Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K 2010-06-09 CN disclosed
CN-101568882-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2009-10-28 CN disclosed
CN-101449208-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2009-06-03 CN disclosed
CN-101438208-A Photosensitive resin composition ASAHI KASEI EMD CORP (JP) 2009-05-20 CN disclosed
CN-1945429-A Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K (JP) 2007-04-11 CN disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US disclosed