SCHEMBL602200

SCHEMBL602200

CCOc1cccc(-c2c3ccccc3nc3ccccc23)c1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 4/20 0.62
TP53 P04637 3/20 0.62
BRD4 O60885 1/20 0.52
BRD2 P25440 1/20 0.52
CREBBP Q92793 1/20 0.52
ESR1 P03372 2/20 0.51
ESR2 Q92731 2/20 0.51
KMT2A Q03164 6/20 0.50
MAPT P10636 5/20 0.50
MEN1 O00255 5/20 0.50
HPGD P15428 4/20 0.50
KDM4E B2RXH2 4/20 0.50
NPSR1 Q6W5P4 2/20 0.50
TDP1 Q9NUW8 2/20 0.50
ALOX12 P18054 1/20 0.50
POLB P06746 1/20 0.50
OPRM1 P35372 1/20 0.50
OPRD1 P41143 1/20 0.50
RAD52 P43351 1/20 0.50
L3MBTL1 Q9Y468 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29587729 1.00 SMN1; SMN2 (0.62) SMN1; SMN2TP53BRD4BRD2CREBBP
SCHEMBL600195 0.88 MAPT (0.64) SMN1; SMN2TP53ESR1ESR2KMT2A
SCHEMBL29834187 0.88 MAPT (0.64) SMN1; SMN2TP53ESR1ESR2KMT2A
SCHEMBL29042705 0.87 ESR1 (0.58) SMN1; SMN2TP53ESR1ESR2KMT2A
SCHEMBL29587463 0.83 CYP1A2 (0.64) SMN1; SMN2TP53ESR1ESR2KMT2A
SCHEMBL601233 0.83 CYP1A2 (0.64) SMN1; SMN2TP53ESR1ESR2KMT2A
SCHEMBL29488297 0.83 KDM4E (0.61) SMN1; SMN2TP53ESR1ESR2KMT2A
SCHEMBL600607 0.83 KDM4E (0.61) SMN1; SMN2TP53ESR1ESR2KMT2A
SCHEMBL27847547 0.82 FGFR1 (0.50) SMN1; SMN2TP53BRD4BRD2CREBBP
SCHEMBL30338775 0.78 RXRA (0.70) SMN1; SMN2TP53BRD4BRD2CREBBP

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN claimed
CN-108241259-B Resist composition with good hole masking function and capable of directly depicting, exposing and imaging 杭州福斯特电子材料有限公司 2021-08-10 CN claimed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US claimed
CN-113156764-B Photosensitive resin composition and resist laminate 杭州福斯特电子材料有限公司 2024-04-26 CN disclosed
US-20230016182-A1 EO/PO-MODIFIED 9-PHENYLACRIDINE PHOTOSENSITIZERS AND APPLICATION THEREOF CHANGZHOU TRONLY ADVANCED ELECTRONIC MATERIALS CO., LTD. (CN) 2023-01-19 US disclosed
CN-115047714-A Resist composition and laminate thereof 杭州福斯特电子材料有限公司 2022-09-13 CN disclosed
CN-110114376-B Curable composition, method for producing cured product, cured product thereof, and adhesive using same 株式会社ADEKA 2022-06-14 CN disclosed
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN disclosed
EP-3339331-B1 COMPOSITION ADEKA CORP (JP) 2022-02-16 EP disclosed
CN-108419438-B Coloring composition 株式会社艾迪科 2021-10-01 CN disclosed
CN-108241259-B Resist composition with good hole masking function and capable of directly depicting, exposing and imaging 杭州福斯特电子材料有限公司 2021-08-10 CN disclosed
CN-112154167-A Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2020-12-29 CN disclosed
CN-111566173-A Coating composition, method for curing the composition, barrier film, and method for producing cured product 株式会社艾迪科 2020-08-21 CN disclosed
CN-111221215-A Photosensitive resin composition and application thereof 常州强力先端电子材料有限公司 2020-06-02 CN disclosed
WO-2020021969-A1 COMPOSITION, CURED PRODUCT, OPTICAL FILTER, AND PRODUCTION METHOD FOR CURED PRODUCT 株式会社ADEKA 2020-01-30 WO disclosed
EP-3339331-A1 COMPOSITION Adeka Corporation (JP) 2018-06-27 EP disclosed
US-20120040290-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD EACH UTILIZING SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-02-16 US disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed