SCHEMBL603134

SCHEMBL603134

Clc1cccc(-c2c3ccccc3nc3ccccc23)c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 5/20 0.56
ESR2 Q92731 5/20 0.56
NR1I3 Q14994 1/20 0.55
KDM4E B2RXH2 1/20 0.54
LMNA P02545 1/20 0.54
HTT P42858 1/20 0.54
PDE5A O76074 3/20 0.50
ABCG2 Q9UNQ0 2/20 0.50
MAOA P21397 1/20 0.50
MAOB P27338 1/20 0.50
TGFBR1 P36897 1/20 0.49
NPC1 O15118 1/20 0.47
TP53 P04637 1/20 0.47
TSHR P16473 1/20 0.47
NFKB1 P19838 1/20 0.47
RAB9A P51151 1/20 0.47
NFKB2 Q00653 1/20 0.47
RELA Q04206 1/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
ADORA2A P29274 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29446753 1.00 ESR1 (0.56) ESR1ESR2NR1I3KDM4ELMNA
SCHEMBL10937700 0.87 ADORA2A (0.54) ESR1ESR2NR1I3KDM4ELMNA
SCHEMBL18371188 0.84 PTGS1 (0.49) ESR1ESR2NR1I3KDM4ELMNA
SCHEMBL29059116 0.84 ESR1 (0.67) ESR1ESR2KDM4ELMNAHTT
SCHEMBL29274261 0.82 ESR1 (0.61) ESR1ESR2KDM4ELMNAHTT
SCHEMBL5948518 0.82 GABRP (0.46) ESR2NR1I3KDM4ELMNAHTT
SCHEMBL18371197 0.81 PTGS1 (0.46) ESR1ESR2NR1I3KDM4ELMNA
SCHEMBL2087364 0.81 ALOX5 (0.52) ESR1ESR2NR1I3KDM4ELMNA
SCHEMBL5947994 0.80 ALOX5 (0.48) ESR2NR1I3MAOBNPC1TP53
SCHEMBL24447857 0.80 NR1I3 (0.54) ESR1ESR2NR1I3KDM4ELMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN claimed
CN-108241259-B Resist composition with good hole masking function and capable of directly depicting, exposing and imaging 杭州福斯特电子材料有限公司 2021-08-10 CN claimed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
WO-2026105768-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN 株式会社レゾナック 2026-05-21 WO disclosed
US-12560867-B2 Photosensitive element and method for producing photosensitive element RESONAC CORPORATION (JP) 2026-02-24 US disclosed
EP-4067998-B1 EO/PO MODIFIED 9-PHENYLACRIDINE PHOTOSENSITIZERS FOR USE IN PHOTOSENSITIVE RESINS IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS CHANGZHOU TRONLY NEW ELECTRONIC MAT CO LTD (CN) 2025-11-12 EP disclosed
US-20250306461-A1 PHOTOSENSITIVE ELEMENT AND METHOD FOR FORMING RESIST PATTERN RESONAC CORPORATION (JP) 2025-10-02 US disclosed
US-20250278024-A1 PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD RESONAC CORPORATION (JP) 2025-09-04 US disclosed
US-12353130-B2 Photosensitive resin composition and photosensitive resin multilayer body ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-07-08 US disclosed
US-20240408595-A1 STRUCTURE COMPRISING MICROCHANNEL, PRODUCTION METHOD FOR SAID STRUCTURE, AND MICROCHANNEL DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-12-12 US disclosed
US-20240392048-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN RESONAC CORP (JP) 2024-11-28 US disclosed
EP-2284611-B1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD HITACHI CHEMICAL CO LTD (JP) 2013-11-20 EP disclosed
US-8460853-B2 Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-06-11 US disclosed
US-20120040290-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD EACH UTILIZING SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-02-16 US disclosed
CN-102144189-A Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern, conductive pattern, printed wiring board, lead frame, base, and method for manufacturing semiconductor package ASAHI KASEI E MATERIALS CORP 2011-08-03 CN disclosed
US-20110081616-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-04-07 US disclosed
EP-2284611-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD Hitachi Chemical Company, Ltd. (JP) 2011-02-16 EP disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12560867-B2 Photosensitive element and method for producing photosensitive element TERB1, PRDM9, PRPF8 ESR1 401/4885ESR2 1189/4885NR1I3 3530/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.