SCHEMBL6049871

SCHEMBL6049871

O=C1C2=CC=CC(=O)C2Oc2ccccc21

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 3/20 0.38
PKM P14618 1/20 0.37
TSHR P16473 1/20 0.37
NPSR1 Q6W5P4 2/20 0.36
MAPT P10636 2/20 0.36
ADORA3 P0DMS8 3/20 0.35
MAOB P27338 3/20 0.35
AR P10275 2/20 0.35
KDM4E B2RXH2 1/20 0.35
HSD17B10 Q99714 1/20 0.35
LMNA P02545 1/20 0.34
CYP1A2 P05177 1/20 0.34
CYP2C9 P11712 1/20 0.34
CYP2C19 P33261 1/20 0.34
TTK P33981 1/20 0.33
MAPK8 P45983 1/20 0.33
MAPK9 P45984 1/20 0.33
MAPK10 P53779 1/20 0.33
PARP1 P09874 1/20 0.33
STK17B O94768 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4619988 0.90 CYP19A1 (0.37) CYP19A1PKMTSHRNPSR1MAPT
SCHEMBL6662779 0.84 CYP19A1 (0.36) CYP19A1PKMTSHRNPSR1MAPT
SCHEMBL8663560 0.70 KDM4E (0.30) CYP19A1ADORA3MAOBARKDM4E
SCHEMBL3274379 0.68 MAPT (0.42) TSHRNPSR1MAPTKDM4ELMNA
SCHEMBL7101024 0.68 TDP1 (0.32) PKMTSHRKDM4ECYP1A2STK17B
SCHEMBL5969253 0.67 MAPT (0.41) TSHRNPSR1MAPTKDM4ELMNA
SCHEMBL4621136 0.67 RET (0.31) RETKDR
SCHEMBL29411755 0.66 CYP19A1 (0.55) CYP19A1PKMTSHRNPSR1MAPT
SCHEMBL8858887 0.66 CYP19A1 (0.55) CYP19A1PKMTSHRNPSR1MAPT
SCHEMBL6712909 0.65 TTK (0.33) TSHRNPSR1MAPTMAOBKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1354918-B1 Curable resin composition, method for manufacture of laminate using the composition, transfer material, method for manufacture thereof and transferred product KURARAY CO (JP) 2006-03-08 EP disclosed
US-20050222293-A1 Curable resin composition, method for manufacture of laminate using the composition, transfer material, method for manufacture thereof and transferred product KURARAY CO., LTD. (JP) 2005-10-06 US disclosed
US-20030236318-A1 Curable resin composition, method for manufacture of laminate using the composition, transfer material, method for manufacture thereof and transferred product KURARAY CO., LTD. (JP) 2003-12-25 US disclosed
EP-1354918-A1 Curable resin composition, method for manufacture of laminate using the composition, transfer material, method for manufacture thereof and transferred product KURARAY CO., LTD. (JP) 2003-10-22 EP disclosed