SCHEMBL606150

SCHEMBL606150

C=C(CCCOC1CC2CCC1(C)C2(C)C)C(=O)O

nearest known ligand 0.48

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
LMNA P02545 5/20 0.48
HTT P42858 4/20 0.48
KMT2A Q03164 4/20 0.48
KDM4E B2RXH2 2/20 0.48
MAPT P10636 3/20 0.47
MEN1 O00255 3/20 0.47
NPSR1 Q6W5P4 2/20 0.47
PLA2G1B P04054 1/20 0.47
MAPK1 P28482 1/20 0.47
RAD52 P43351 1/20 0.47
ATG4B Q9Y4P1 1/20 0.47
ALDH1A1 P00352 2/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10820967 0.96 LMNA (0.46) LMNAHTTKMT2AKDM4EMAPT
SCHEMBL10820838 0.95 LMNA (0.50) LMNAHTTKMT2AKDM4EMAPT
SCHEMBL10820937 0.95 LMNA (0.50) LMNAHTTKMT2AKDM4EMAPT
SCHEMBL10821102 0.92 KMT2A (0.50) LMNAHTTKMT2AKDM4EMAPT
SCHEMBL2909233 0.87 LMNA (0.52) LMNAHTTKMT2AKDM4EMAPT
SCHEMBL6907199 0.85 LMNA (0.50) LMNAHTTKMT2AKDM4EMAPT
SCHEMBL7029708 0.84 ALDH1A1 (0.53) LMNAALDH1A1
SCHEMBL10820997 0.81 KMT2A (0.52) LMNAHTTKMT2AKDM4EMAPT
SCHEMBL10820857 0.81 KMT2A (0.52) LMNAHTTKMT2AKDM4EMAPT
SCHEMBL17630047 0.78 LMNA (0.50) LMNAHTTKMT2AKDM4EMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160272791-A1 PHOTO-CURABLE RESIN COMPOSITION AND METHOD FOR FORMING A FINE PATTERN USING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2016-09-22 US claimed
US-9939568-B2 Photosensitive resin composition for color filter and application of the same CHI MEI CORPORATION (TW) 2018-04-10 US disclosed
US-9676899-B2 Radiation curable resin composition and rapid three dimensional imaging process using the same DSM IP ASSETS B.V. (NL) 2017-06-13 US disclosed
US-9631068-B2 Photo-curable resin composition and method for forming a fine pattern using the same SAMSUNG DISPLAY CO., LTD. (KR) 2017-04-25 US disclosed
US-9557443-B2 Photosensitive resin composition, black matrix, color filter, and liquid crystal display device CHI MEI CORPORATION (TW) 2017-01-31 US disclosed
US-9557444-B2 Alkali-soluble resin, photosensitive resin composition, color filter, method for manufacturing the same, and liquid crystal display apparatus CHI MEI CORPORATION (TW) 2017-01-31 US disclosed
US-20170003586-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2017-01-05 US disclosed
US-9519208-B2 Photosensitive resin composition for color filters and uses thereof CHI MEI CORPORATION (TW) 2016-12-13 US disclosed
US-20160327863-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR COLOR FILTER AND APPLICATION OF THE SAME CHI MEI CORPORATION (TW) 2016-11-10 US disclosed
US-20160313639-A1 PHOTOSENSITIVE RESIN COMPOSITION, PIXEL LAYER, PROTECTIVE FILM, SPACER, THIN-FILM TRANSISTOR, COLOR FILTER, AND LIQUID CRYSTAL DISPLAY APPARATUS CHI MEI CORPORATION (TW) 2016-10-27 US disclosed
US-20080064780-A1 Radiation curable resin composition and rapid prototyping process using the same DSM IP ASSETS B.V. (NL) 2008-03-13 US disclosed
US-20070238047-A1 Photosensitive resin composition for color filters CHI-MEI CORPORATION 2007-10-11 US disclosed
US-20070232713-A1 Radiation Curable Liquid Resin Composition for Optical Three-Dimensional Molding and Optical Molded Article Obtained by Photocuring Same JSR CORPORATION (JP) 2007-10-04 US disclosed
US-20070228614-A1 Cationic compositions and methods of making and using the same DSM IP ASSETS B.V. (NL) 2007-10-04 US disclosed
US-20070043138-A1 Resin composition for photofabrication of three dimensional objects YAMAMURA TETSUYA 2007-02-22 US disclosed
US-20050287470-A1 Curable compositions and rapid prototyping process using the same DSM IP ASSETS B.V. (NL) 2005-12-29 US disclosed
US-20050175930-A1 Photosensitive resin composition for black matrix CHI MEI CORPORATION (TW) 2005-08-11 US disclosed
US-20050171255-A1 Resin composition for photofabrication of three dimensional objects YAMAMURA TETSUYA (JP) 2005-08-04 US disclosed
US-20050158659-A1 Photosensitive resin composition for black matrix CHI MEI CORPORATION (TW) 2005-07-21 US disclosed
US-4620028-A Esters of hydroxyalkyl ethers of bornane SCM CORPORATION (US) 1986-10-28 US disclosed