Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 1/20 | 0.39 |
| ▸ | CNR2 | P34972 | 1/20 | 0.37 |
| ▸ | MME | P08473 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.35 |
| ▸ | OPRM1 | P35372 | 1/20 | 0.35 |
| ▸ | OPRD1 | P41143 | 1/20 | 0.35 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.35 |
| ▸ | OPRL1 | P41146 | 1/20 | 0.35 |
| ▸ | CYP17A1 | P05093 | 1/20 | 0.35 |
| ▸ | TSHR | P16473 | 1/20 | 0.34 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | NR5A2 | O00482 | 1/20 | 0.33 |
| ▸ | NR5A1 | Q13285 | 1/20 | 0.33 |
| ▸ | PCSK9 | Q8NBP7 | 1/20 | 0.33 |
| ▸ | CTSL | P07711 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8390429 | 0.92 | CSNK1E (0.38) | ALDH1A1MEN1MAPK1KMT2ASMN1; SMN2 | |
| SCHEMBL602433 | 0.86 | DNM1 (0.44) | POLBCNR2ALDH1A1KDM4EOPRM1 | |
| SCHEMBL8394104 | 0.82 | CSNK1E (0.39) | ALDH1A1MEN1MAPK1KMT2ASMN1; SMN2 | |
| SCHEMBL8390415 | 0.81 | ALDH1A1 (0.41) | ALDH1A1MEN1MAPK1KMT2ASMN1; SMN2 | |
| Butyltriphenylphosphonium SCHEMBL4389652 | 0.81 | HIF1A (0.50) | POLBCNR2ALDH1A1TSHRMEN1 | |
| SCHEMBL8390194 | 0.81 | ALDH1A1 (0.41) | ALDH1A1MEN1MAPK1KMT2ASMN1; SMN2 | |
| Octane SCHEMBL18395350 | 0.81 | DNM1 (0.44) | TSHRMEN1MAPK1KMT2ASMN1; SMN2 | |
| Octane SCHEMBL23754774 | 0.79 | DNM1 (0.42) | ALDH1A1MEN1MAPK1KMT2ASMN1; SMN2 | |
| SCHEMBL10434550 | 0.79 | LTA4H (0.39) | ALDH1A1TSHRMEN1MAPTMAPK1 | |
| SCHEMBL8390161 | 0.78 | DNM1 (0.52) | MEN1MAPK1KMT2ASMN1; SMN2CSNK1E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 111 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1651704-A1 | COATING COMPOSITIONS CONTAINING AMINOFUNCTIONAL SILICONE RESINS | Dow Corning Corporation (US) | 2006-05-03 | — | — | EP | claimed |
| WO-2005010078-A1 | COATING COMPOSITIONS CONTAINING AMINOFUNCTIONAL SILICONE RESINS | DOW CORNING CORPORATION (US) | 2005-02-03 | — | — | WO | claimed |
| EP-3756202-B1 | ELECTRICAL CIRCUIT INCLUDING A SUPERCAPACITOR WITH REDUCED LEAKAGE | KYOCERA AVX COMPONENTS CORP (US) | 2026-01-28 | — | — | EP | disclosed |
| US-20240194422-A1 | Encapsulated Supercapacitor Module having a High Voltage and Low Equivalent Series Resistance | KYOCERA AVX Components Corporation | 2024-06-13 | — | — | US | disclosed |
| US-11875942-B2 | Encapsulated supercapacitor module having a high voltage and low equivalent series resistance | KYOCERA AVX Components Corporation (US) | 2024-01-16 | — | — | US | disclosed |
| EP-4238116-A1 | SURFACE MOUNTABLE ULTRACAPACITOR DEVICE INCLUDING A RESIN LAYER HAVING VENTS | KYOCERA AVX Components Corporation (US) | 2023-09-06 | — | — | EP | disclosed |
| CN-116711043-A | Surface mountable supercapacitor device comprising a resin layer with vent holes | 京瓷AVX元器件公司 | 2023-09-05 | — | — | CN | disclosed |
| US-11688967-B2 | Wire termination device for coupling a wire to a feedthrough device and system including the same | KYOCERA AVX Components Corporation (US) | 2023-06-27 | — | — | US | disclosed |
| US-20220372208-A1 | THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE | SUMITOMO BAKELITE CO., LTD. (JP) | 2022-11-24 | — | — | US | disclosed |
| US-11387054-B2 | Electrical circuit including a supercapacitor with reduced leakage | KYOCERA AVX Components Corporation (US) | 2022-07-12 | — | — | US | disclosed |
| WO-2022093911-A1 | SURFACE MOUNTABLE ULTRACAPACITOR DEVICE INCLUDING A RESIN LAYER HAVING VENTS | KYOCERA AVX Components Corporation (US) | 2022-05-05 | — | — | WO | disclosed |
| US-6500891-B1 | ADHESIVE COMPOSITION FOR ENCAPSULATING ELECTRONIC PARTS; ALUMINA PARTICLES HAVING AN AVERAGE DIAMETER SUFFICIENTLY LOW TO MAINTAIN SUSPENSION; | LOCTITE CORPORATION | 2002-12-31 | — | — | US | disclosed |
| US-20020123602-A1 | Crystallized epoxy resins, their production method, and curable compositions comprising them | JAPAN EPOXY RESINS CO., LTD. (JP) | 2002-09-05 | — | — | US | disclosed |
| US-20020111439-A1 | Polymerizable compositions in non-flowable forms | LOCTITE CORPORATION | 2002-08-15 | — | — | US | disclosed |
| US-20020077422-A1 | Obtained by reacting 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl and an epihalohydrin in the presence of alkali metal compound; useful in electrical and electronic fields | JAPAN EPOXY RESINS CO., LTD. (JP) | 2002-06-20 | — | — | US | disclosed |
| US-6255365-B1 | RAPID CURABILITY AND FLUIDITY, SOLDER CRACK RESISTANCE | SHELL OIL COMPANY | 2001-07-03 | — | — | US | disclosed |
| US-6063876-A | CAN BE CRUSHED AT AN ORDINARY TEMPERATURE, FLUIDITY AND SOLDER CRACK RESISTANCE AFTER CURING; BLEND OF 4,4'-BIPHENOL TYPE EPOXY RESIN CRYSTALLINE AT AN ORDINARY TEMPERATURE, AND A NONCRYSTALLINE EPOXY RESIN HAVING A LOW SOFTENING POINT | SHELL OIL COMPANY (US) | 2000-05-16 | — | — | US | disclosed |
| US-5750631-A | CURABLE EPOXIDIZED PHENOLIC RESIN CONTAINING CHLORINE AND/OR BROMINE; FIREPROOFING, BY-PRODUCT INHIBITION | SHELL OIL COMPANY (US) | 1998-05-12 | — | — | US | disclosed |
| US-5739186-A | CURABLE MIXTURE OF A BISPHENOL F DIGLYCIDYL ETHER AND AN EPOXIDIZED NOVOLAK OR A BISPHENOL DIGLYCIDYL ETHER TYPE OF COMPOUND; LOW VISCOSITY; HEAT AND STRESS RESISTANCE; LOW MOISTURE ABSORPTION; NONCRACKING SOLDERING | SHELL OIL COMPANY (US) | 1998-04-14 | — | — | US | disclosed |
| EP-0705856-A2 | Epoxy resin composition for semiconductor encapsulation | SHELL INTERNATIONALE RESEARCHMAATSCHAPPIJ B.V. (NL) | 1996-04-10 | — | — | EP | disclosed |