SCHEMBL609397

SCHEMBL609397

[CH2]c1ccc(C(=C)C)cc1

nearest known ligand 0.57

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.33
HTT P42858 1/20 0.33
GFER P55789 1/20 0.33
HSD17B10 Q99714 1/20 0.33
GPR55 Q9Y2T6 1/20 0.33
ALDH1A1 P00352 2/20 0.32
LMNA P02545 1/20 0.32
CES2 O00748 1/20 0.32
CES1 P23141 1/20 0.32
TSHR P16473 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
GRIK2 Q13002 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL56361 0.87 MAPT (0.40) MAPTHTTGFERHSD17B10GPR55
SCHEMBL28660752 0.84 MAPT (0.38) MAPTHTTGFERHSD17B10GPR55
SCHEMBL7596929 0.84 MAPT (0.38) MAPTHTTGFERHSD17B10GPR55
SCHEMBL9516265 0.79 MAPT (0.44) MAPTHTTGFERHSD17B10GPR55
SCHEMBL27521677 0.79 ESR1 (0.31) ALDH1A1
SCHEMBL5546082 0.79 MAPT (0.35) MAPTHTTGFERHSD17B10GPR55
SCHEMBL94501 0.79 ALDH1A1 (0.52) MAPTHTTALDH1A1LMNACES2
SCHEMBL135213 0.77 MAPT (0.60) MAPTHTTGFERHSD17B10GPR55
SCHEMBL27816800 0.77 ALDH1A1 (0.32) MAPTALDH1A1TSHRSMN1; SMN2
SCHEMBL609815 0.76 KMT2A (0.39) HSD17B10ALDH1A1LMNATSHRSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118339220-A Resin fiber sheet, prepreg, and method for producing prepreg 旭化成株式会社 2024-07-12 CN disclosed
CN-118185233-A Resin composition 味之素株式会社 2024-06-14 CN disclosed
CN-117903364-A Conjugated diene copolymer, resin composition, cured product, resin film, prepreg, laminate, and electronic circuit board material 旭化成株式会社 2024-04-19 CN disclosed
CN-117487320-A Resin composition, cured product, resin film, prepreg, laminate, and material for electronic circuit board 旭化成株式会社 2024-02-02 CN disclosed
CN-117487319-A Resin composition, cured product, resin film, prepreg, laminate, and material for electronic circuit board 旭化成株式会社 2024-02-02 CN disclosed
CN-117487321-A Resin composition, cured product, resin film, prepreg, laminate, and material for electronic circuit board 旭化成株式会社 2024-02-02 CN disclosed
CN-116891557-A Modified conjugated diene polymer, resin composition containing the same, and product 旭化成株式会社 2023-10-17 CN disclosed
EP-4039728-B1 POLYPHENYLENE ETHER COMPOSITION ASAHI CHEMICAL IND (JP) 2023-10-11 EP disclosed
WO-2023189949-A1 MULTIFUNCTIONAL VINYL AROMATIC COPOLYMER 旭化成株式会社 2023-10-05 WO disclosed
CN-111592751-B Polyphenylene ether-containing resin composition 旭化成株式会社 2023-09-29 CN disclosed
US-5558803-A ADDITION-CONDENSATION GRAFT COPOLYMERS FOR DIELECTRIC PARTICLES AND INSULATING LIQUIDS NIPPON SHOKUBAI CO., LTD. (JP) 1996-09-24 US disclosed
EP-0636683-A1 Electrorheological fluid NIPPON SHOKUBAI CO., LTD. (JP) 1995-02-01 EP disclosed
US-5376294-A A dielectric particle and a polysiloxane/acrylic ester additive in a dielectric dispersant medium; large shear stress and low current density; stability; nonsettling NIPPON SHOKUBAI CO., LTD. (JP) 1994-12-27 US disclosed
US-5281625-A Benzyl substituted guanidine derivatives, salts, and metal complexes BASF AKTIENGESELLSCHAFT (DE) 1994-01-25 US disclosed
EP-0534501-A2 Fungicidal guanidines BASF Aktiengesellschaft (DE) 1993-03-31 EP disclosed
EP-0529166-A1 Electrorheological fluids NIPPON SHOKUBAI CO., LTD. (JP) 1993-03-03 EP disclosed
US-5126374-A For plants, seeds, soils, effective at low concentrations BASF AKTIENGESELLSCHAFT (DE) 1992-06-30 US disclosed
EP-0250090-B1 STORAGE STABLE LATENTLY CURABLE ACRYLIC FORMULATIONS EMPLOYING POLYMERIC HYDROPEROXIDES LOCTITE CORPORATION (US) 1992-01-29 EP disclosed
EP-0406699-A2 Fungicidal guanidines BASF Aktiengesellschaft (DE) 1991-01-09 EP disclosed
EP-0250090-A2 Storage stable latently curable acrylic formulations employing polymeric hydroperoxides LOCTITE CORPORATION (US) 1987-12-23 EP disclosed