SCHEMBL609398

SCHEMBL609398

COC(=O)c1ccc2c(OC)c3ccccc3c(OC)c2c1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KIF11 P52732 1/20 0.58
PARP1 P09874 1/20 0.54
ALDH1A1 P00352 5/20 0.52
KDM4E B2RXH2 5/20 0.52
MAPK1 P28482 1/20 0.52
SMN1; SMN2 Q16637 1/20 0.52
HPGD P15428 3/20 0.50
TSHR P16473 1/20 0.50
NPSR1 Q6W5P4 1/20 0.50
GPR84 Q9NQS5 1/20 0.49
CA1 P00915 3/20 0.49
CA2 P00918 3/20 0.49
CA12 O43570 2/20 0.49
CA7 P43166 2/20 0.49
CA9 Q16790 2/20 0.49
CA14 Q9ULX7 2/20 0.49
XDH P47989 1/20 0.49
LMNA P02545 1/20 0.48
LCK P06239 1/20 0.47
MAPT P10636 3/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30044523 1.00 KIF11 (0.58) KIF11PARP1ALDH1A1KDM4EMAPK1
SCHEMBL601845 0.84 KDM4E (0.54) PARP1ALDH1A1KDM4EMAPK1SMN1; SMN2
SCHEMBL6782090 0.82 POLB (0.60) KIF11ALDH1A1KDM4EHPGDTSHR
SCHEMBL976725 0.81 KIF11 (0.59) KIF11PARP1ALDH1A1KDM4ESMN1; SMN2
SCHEMBL27729823 0.79 KIF11 (0.58) KIF11PARP1ALDH1A1KDM4ESMN1; SMN2
SCHEMBL2527811 0.78 KIF11 (0.56) KIF11PARP1ALDH1A1KDM4EHPGD
SCHEMBL15855070 0.78 MAPT (0.49) KIF11ALDH1A1KDM4EHPGDCA1
SCHEMBL15855047 0.78 MAPT (0.49) KIF11ALDH1A1KDM4EHPGDCA1
SCHEMBL7936413 0.77 KIF11 (0.55) KIF11PARP1ALDH1A1KDM4EHPGD
SCHEMBL10901105 0.77 KIF11 (0.55) KIF11PARP1ALDH1A1KDM4EHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 95 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11635688-B2 Photoimageable compositions and processes for fabrication of relief patterns on low surface energy substrates KAYAKU ADVANCED MATERIALS, INC. (US) 2023-04-25 US claimed
US-20150024326-A1 PHOTOIMAGEABLE COMPOSITIONS AND PROCESSES FOR FABRICATION OF RELIEF PATTERNS ON LOW SURFACE ENERGY SUBSTRATES KAYAKU ADVANCED MATERIALS, INC. 2015-01-22 US claimed
WO-2013134104-A2 PHOTOIMAGEABLE COMPOSITIONS AND PROCESSES FOR FABRICATION OF RELIEF PATTERNS ON LOW SURFACE ENERGY SUBSTRATES MICROCHEM CORP. (US) 2013-09-12 WO claimed
WO-2025041519-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT OF SAME 日本化薬株式会社 2025-02-27 WO disclosed
US-12189291-B2 Epoxy formulations and processes for fabrication of relief patterns on low surface energy substrates KAYAKU ADVANCED MATERIALS, INC. (US) 2025-01-07 US disclosed
US-20240168380-A1 Photosensitive Resin Composition And Cured Product Therefrom NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2024-05-23 US disclosed
CN-117950266-A Photosensitive resin composition and cured product thereof 日本化药株式会社 2024-04-30 CN disclosed
CN-111406233-B Photosensitive resin composition, dry film resist and cured product thereof 日本化药株式会社 2023-12-26 CN disclosed
US-11809078-B2 Photosensitive resin composition, dry film resist, and cured objects obtained therefrom NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2023-11-07 US disclosed
EP-2980058-B1 COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND TOKYO OHKA KOGYO CO LTD (JP) 2023-05-03 EP disclosed
US-11635688-B2 Photoimageable compositions and processes for fabrication of relief patterns on low surface energy substrates KAYAKU ADVANCED MATERIALS, INC. (US) 2023-04-25 US disclosed
CN-1934498-A Permanent resist composition, cured product thereof, and use thereof MICROCHEM CORP (US) 2007-03-21 CN disclosed
CN-1914561-A Photoresist compositions and processess of use MICROCHEM CORP (US) 2007-02-14 CN disclosed
EP-1730592-A2 PERMANENT RESIST COMPOSITION, CURED PRODUCT THEREOF, AND USE THEREOF MicroChem Corp. (US) 2006-12-13 EP disclosed
WO-2006124552-A2 METHOD OF FORMING A PHOTORESIST ELEMENT MICROCHEM CORP. (US) 2006-11-23 WO disclosed
US-20060257785-A1 Method of forming a photoresist element MICROCHEM CORP. 2006-11-16 US disclosed
WO-2005119364-A2 PHOTOIMAGEABLE COATING COMPOSITION AND COMPOSITE ARTICLE THEREOF MICROCHEM CORP. (US) 2005-12-15 WO disclosed
US-20050266335-A1 Photoimageable coating composition and composite article thereof MicroChem Corp., a corporation 2005-12-01 US disclosed
WO-2005079330-A2 PERMANENT RESIST COMPOSITION, CURED PRODUCT THEREOF, AND USE THEREOF MICROCHEM CORP. (US) 2005-09-01 WO disclosed
US-20050147918-A1 Photoresist compositions, hardened forms thereof, hardened patterns thereof and metal patterns formed using them MicroChem Corp. a corporation of the state of Massachusetts, US 2005-07-07 US disclosed