SCHEMBL6138567

SCHEMBL6138567

CCCOCC(=O)C(OCCC)(OCCC)C(=O)OCC.[Ti]

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 2/20 0.38
CYP4F2 P78329 3/20 0.36
CYP4A11 Q02928 3/20 0.36
TSHR P16473 2/20 0.32
ALDH1A1 P00352 2/20 0.32
PIN1 Q13526 1/20 0.32
MEN1 O00255 2/20 0.31
KMT2A Q03164 2/20 0.31
PKM P14618 2/20 0.31
KDM4E B2RXH2 1/20 0.31
POLB P06746 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31
MAPT P10636 1/20 0.30
ATM Q13315 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30
ABCB11 O95342 1/20 0.30
CYP1A2 P05177 1/20 0.30
CYP3A4 P08684 1/20 0.30
HTR2A P28223 1/20 0.30
PMP22 Q01453 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16320556 0.97 CES2 (0.38) CES2CYP4F2CYP4A11TSHRALDH1A1
SCHEMBL16320641 0.87 CES2 (0.46) CES2CYP4F2CYP4A11TSHRALDH1A1
SCHEMBL4534558 0.84 CES2 (0.46) CES2CYP4F2CYP4A11TSHRALDH1A1
SCHEMBL15793631 0.81 CYP4F2 (0.36) CYP4F2CYP4A11TSHRALDH1A1PIN1
SCHEMBL28344100 0.79 CES2 (0.42) CES2
SCHEMBL15793893 0.77 CYP4F2 (0.36) CES2CYP4F2CYP4A11TSHRALDH1A1
SCHEMBL4622979 0.76 CES2 (0.40) CES2
SCHEMBL14960350 0.69 CYP4F2 (0.61) CYP4F2CYP4A11TSHRALDH1A1PIN1
SCHEMBL16320318 0.68 CYP4F2 (0.34) CYP4F2CYP4A11TSHRALDH1A1MEN1
SCHEMBL1053009 0.68 GAA (0.50) CES2TSHRALDH1A1KMT2ANPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11884839-B2 Acetal-protected silanol group-containing polysiloxane composition NISSAN CHEMICAL CORPORATION (JP) 2024-01-30 US disclosed
US-10838303-B2 Resist underlayer film forming composition for lithography containing hydrolyzable silane having carbonate skeleton NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-11-17 US disclosed
US-10558119-B2 Composition for coating resist pattern NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2020-02-11 US disclosed
US-10372040-B2 Resist underlayer film forming composition for lithography containing hydrolyzable silane having halogen-containing carboxylic acid amide group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2019-08-06 US disclosed
US-20190185707-A1 ACETAL-PROTECTED SILANOL GROUP-CONTAINING POLYSILOXANE COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2019-06-20 US disclosed
US-10139729-B2 Coating composition for pattern reversal on soc pattern NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-11-27 US disclosed
US-20180239250-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION FOR LITHOGRAPHY CONTAINING HYDROLYZABLE SILANE HAVING CARBONATE SKELETON NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-08-23 US disclosed
US-20180149977-A1 COMPOSITION FOR COATING RESIST PATTERN NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-05-31 US disclosed
US-20170322491-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION FOR LITHOGRAPHY CONTAINING HYDROLYZABLE SILANE HAVING HALOGEN-CONTAINING CARBOXYLIC ACID AMIDE GROUP NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-11-09 US disclosed
US-20170271151-A1 COATING COMPOSITION FOR PATTERN REVERSAL ON SOC PATTERN NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-09-21 US disclosed
US-20140377957-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION FOR SOLVENT DEVELOPMENT NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2014-12-25 US disclosed
EP-1117102-B1 Method of manufacturing material for forming insulating film JSR CORP (JP) 2005-08-10 EP disclosed
US-6642352-B2 Providing a silicon inorganic polymer compound or polyarylenes or polyphenylene ether organic polymer compound, treating the polymeric compound with a zeta-potential producing filter material, and producing curable polymer compound JSR CORPORATION (JP) 2003-11-04 US disclosed
US-20010009936-A1 Method of manufacturing material for forming insulating film JSR CORPORATION (JP) 2001-07-26 US disclosed
EP-1117102-A2 Method of manufacturing material for forming insulating film JSR Corporation (JP) 2001-07-18 EP disclosed