Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 8/20 | 0.50 |
| ▸ | TP53 | P04637 | 4/20 | 0.50 |
| ▸ | HIF1A | Q16665 | 3/20 | 0.50 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.50 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.50 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.50 |
| ▸ | TSHR | P16473 | 8/20 | 0.43 |
| ▸ | THRB | P10828 | 1/20 | 0.43 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.38 |
| ▸ | MGLL | Q99685 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21373880 | 1.00 | ALDH1A1 (0.50) | ALDH1A1TP53HIF1ACYP3A4MAPK1 | |
| SCHEMBL10417515 | 0.88 | ALDH1A1 (0.53) | ALDH1A1TP53HIF1ACYP3A4MAPK1 | |
| SCHEMBL21647280 | 0.87 | THRB (0.54) | ALDH1A1TP53HIF1ACYP3A4MAPK1 | |
| SCHEMBL24899844 | 0.85 | THRB (0.37) | ALDH1A1TP53HIF1ACYP3A4MAPK1 | |
| SCHEMBL24899647 | 0.85 | THRB (0.37) | ALDH1A1TP53HIF1ACYP3A4MAPK1 | |
| SCHEMBL28210908 | 0.82 | ALDH1A1 (0.50) | ALDH1A1TP53HIF1ACYP3A4MAPK1 | |
| SCHEMBL673210 | 0.80 | ALDH1A1 (0.48) | ALDH1A1TP53HIF1ACYP3A4MAPK1 | |
| SCHEMBL15082542 | 0.79 | — | — | |
| SCHEMBL29850839 | 0.79 | ALDH1A1 (0.53) | ALDH1A1TP53HIF1ACYP3A4MAPK1 | |
| SCHEMBL17692 | 0.79 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024038761-A1 | CURED PRODUCT, ARTICLE PROVIDED WITH CURED PRODUCT, AND METHOD FOR LESSENING INTERNAL STRESS OF CURED PRODUCT | 株式会社カネカ | 2024-02-22 | — | — | WO | disclosed |
| CN-117043675-A | Photosensitive resin composition | 株式会社田村制作所 | 2023-11-10 | — | — | CN | disclosed |
| CN-116602060-A | Photosensitive resin composition | 株式会社田村制作所 | 2023-08-15 | — | — | CN | disclosed |
| CN-109254498-B | Photosensitive resin composition | 株式会社田村制作所 | 2023-07-14 | — | — | CN | disclosed |
| CN-115729041-A | Photosensitive resin composition, photo-cured product of photosensitive resin composition, and printed wiring board coated with photosensitive resin composition | 株式会社田村制作所 | 2023-03-03 | — | — | CN | disclosed |
| CN-115708016-A | Photosensitive resin composition, photocured product of the composition, and printed wiring board having photocured film of the composition | 株式会社田村制作所 | 2023-02-21 | — | — | CN | disclosed |
| WO-2022202979-A1 | PHOTOSENSITIVE RESIN COMPOSITION | 株式会社タムラ製作所 | 2022-09-29 | — | — | WO | disclosed |
| CN-107870514-B | Photosensitive resin composition | 株式会社田村制作所 | 2022-09-16 | — | — | CN | disclosed |
| CN-107801316-B | Printed circuit board and method for manufacturing printed circuit board | 株式会社田村制作所 | 2022-06-10 | — | — | CN | disclosed |
| CN-114253070-A | Photosensitive resin composition, cured product and electronic circuit board | 株式会社田村制作所 | 2022-03-29 | — | — | CN | disclosed |
| EP-1455227-A2 | Photosensitive resin composition and printed wiring board | Tamura Kaken Corporation (JP) | 2004-09-08 | — | — | EP | disclosed |
| US-6756166-B2 | ACTIVE ENERGY RAY-CURABLE RESIN HAVING AT LEAST TWO UNSATURATED BONDS; ACID SALT OF N-SUBSTITUTED MELAMINE OR GUANAMINE COMPOUND; PHOTOINITIATOR; DILUENT; AND THERMOSETTING COMPOUND. | TAMURAKAKEN CORPORATION (JP) | 2004-06-29 | — | — | US | disclosed |
| EP-1413926-A2 | Photosensitive resin composition and printed wiring board | Tamura Kaken Corporation (JP) | 2004-04-28 | — | — | EP | disclosed |
| US-20040001961-A1 | Curable resin composition useful for coating, multi-layer printed wiring board, printed wiring board and dry film | TAMURA KAKEN CORPORATION (JP) | 2004-01-01 | — | — | US | disclosed |
| US-20030068567-A1 | Photosensitive resin composition and printed wiring board | TAMURA KAKEN CORPORATION (JP) | 2003-04-10 | — | — | US | disclosed |
| US-20030064304-A1 | Photosensitive resin composition and printed wiring board | TAMURAKAKEN CORPORATION (JP) | 2003-04-03 | — | — | US | disclosed |
| US-20030064305-A1 | For use as solder resist, which is free from anti-tackiness and excellent in flexibility, adhesiveness, and heat resistance without sacrificing other film properties | TAMURAKAKEN CORPORATION (JP) | 2003-04-03 | — | — | US | disclosed |
| EP-1296188-A2 | Photosensitive resin composition and printed wiring board | Tamura Kaken Corporation (JP) | 2003-03-26 | — | — | EP | disclosed |
| EP-1296189-A2 | Photosensitive resin composition and printed wiring board | Tamura Kaken Corporation (JP) | 2003-03-26 | — | — | EP | disclosed |
| US-20020115739-A1 | Active energy beam curable composition and printed wiring board | TAMURA KAKEN CORPORATION (JP) | 2002-08-22 | — | — | US | disclosed |