Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TRPA1 | O75762 | 1/20 | 0.34 |
| ▸ | POLB | P06746 | 1/20 | 0.34 |
| ▸ | POLA1 | P09884 | 1/20 | 0.34 |
| ▸ | PPARG | P37231 | 2/20 | 0.30 |
| ▸ | PPARA | Q07869 | 2/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27660106 | 0.84 | — | — | |
| SCHEMBL1306313 | 0.84 | POLB (0.33) | TRPA1POLBPOLA1 | |
| SCHEMBL724849 | 0.81 | POLB (0.36) | TRPA1POLBPOLA1 | |
| SCHEMBL2400469 | 0.81 | TSHR (0.35) | POLBPOLA1 | |
| SCHEMBL954405 | 0.80 | TSHR (0.40) | — | |
| SCHEMBL960509 | 0.79 | POLB (0.34) | TRPA1POLBPOLA1 | |
| SCHEMBL1081176 | 0.76 | APEX1 (0.39) | — | |
| SCHEMBL37109 | 0.76 | ATM (0.47) | — | |
| SCHEMBL565538 | 0.75 | TRPA1 (0.35) | TRPA1POLBPOLA1PPARGPPARA | |
| SCHEMBL7936281 | 0.75 | ALOX15 (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 128 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023097383-A1 | OMNIPHILIC HYBRID RESIN COMPOSITION FOR ADDITIVE MANUFACTURE OF MEDICAL DEVICES, METHOD FOR PRODUCING SAID RESIN AND USE THEREOF | UNIVERSIDADE ESTADUAL DE CAMPINAS (BR) | 2023-06-08 | — | — | WO | claimed |
| US-10326162-B2 | Composite solid electrolyte comprising silane compound and lithium battery comprising the composite solid electrolyte | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2019-06-18 | — | — | US | claimed |
| US-10283660-B2 | Photovoltaic devices comprising an anti-reflective layer containing dispersed objects having areas with different refractive indices | POLYRISE (FR) | 2019-05-07 | — | — | US | claimed |
| US-20180351202-A1 | COMPOSITE SOLID ELECTROLYTE COMPRISING SILANE COMPOUND AND LITHIUM BATTERY COMPRISING THE COMPOSITE SOLID ELECTROLYTE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2018-12-06 | — | — | US | claimed |
| EP-2157139-B1 | A METHOD FOR MODIFYING NORMAL CLAY AND A METHOD FOR PRODUCING COMPOSITE ELASTOMER FROM THE CLAY | SHI LEI (CN) | 2014-03-26 | — | — | EP | claimed |
| WO-2024150597-A1 | THERMOSETTING RESIN COMPOSITION, CURED FILM, SUBSTRATE, AND ELECTRONIC COMPONENT | JNC株式会社 | 2024-07-18 | — | — | WO | disclosed |
| CN-117957494-A | Resin composition, light-shielding film, and substrate with partition wall | 东丽株式会社 | 2024-04-30 | — | — | CN | disclosed |
| CN-117858927-A | Silicone resin composition for forming cured film, and method for producing polysiloxane | 东丽株式会社 | 2024-04-09 | — | — | CN | disclosed |
| EP-2809695-B1 | SILANE-CONTAINING ETHYLENE INTERPOLYMER FORMULATION INCLUDING FILMS AND ELECTRONIC DEVICE MODULE COMPRISING SAME | DOW GLOBAL TECHNOLOGIES LLC (US) | 2024-03-13 | — | — | EP | disclosed |
| CN-115427514-B | Resin composition, light-shielding film, and substrate with partition wall | 东丽株式会社 | 2024-01-02 | — | — | CN | disclosed |
| CN-110573964-B | Negative photosensitive resin composition and cured film | 东丽株式会社 | 2023-11-03 | — | — | CN | disclosed |
| WO-2023182263-A1 | PRODUCTION METHOD FOR LED-MOUNTED SUBSTRATE WITH CURED FILM | 東レ株式会社 | 2023-09-28 | — | — | WO | disclosed |
| US-6303268-B1 | SENSITIVITY TO RADIATION | SHOWA DENKO K.K. (JP) | 2001-10-16 | — | — | US | disclosed |
| US-20010017639-A1 | Polymer film, polymeric compound for forming the same, method of manufacturing such polymeric compound, liquid-repellency treatment solution using such polymeric compound, surface-modifying method using such treatment solution and surface-modified article | CANON KABUSHIKI KAISHA (JP) | 2001-08-30 | — | — | US | disclosed |
| EP-1108761-A2 | Polymer film, and polymeric compound for the production thereof | CANON KABUSHIKI KAISHA (JP) | 2001-06-20 | — | — | EP | disclosed |
| US-6096476-A | DIRECTLY IMAGEABLE RAW PLATE HAVING A HEAT INSULATING LAYER, HEAT SENSITIVE LAYER COMPRISING A LIGHT TO HEAT CONVERTING MATERIAL AND INK REPLELLENT LAYER IN THIS ORDER ON SUBSTRATE; PLATE HAS SPECIFIED ELASTIC MODULUS AND TENSILE PROPERTIES | TORAY INDUSTRIES, INC. (JP) | 2000-08-01 | — | — | US | disclosed |
| EP-1004936-A1 | RESIST RESIN, RESIST RESIN COMPOSITION, AND PROCESS FOR PATTERNING THEREWITH | Showa Denko K K (JP) | 2000-05-31 | — | — | EP | disclosed |
| EP-0802067-A1 | DIRECT DRAWING TYPE WATERLESS PLANOGRAPHIC ORIGINAL FORM PLATE | TORAY INDUSTRIES, INC. (JP) | 1997-10-22 | — | — | EP | disclosed |
| US-4528353-A | Adhesion promoters for one-component RTV silicone compositions | GENERAL ELECTRIC COMPANY (US) | 1985-07-09 | — | — | US | disclosed |
| US-4483973-A | Adhesion promoters for one-component RTV silicone compositions | GENERAL ELECTRIC COMPANY (US) | 1984-11-20 | — | — | US | disclosed |