SCHEMBL6152339

SCHEMBL6152339

CO[Ti](c1ccccc1)(c1ccccc1)c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA4 P22748 2/20 0.41
CA12 O43570 1/20 0.36
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
CA7 P43166 1/20 0.36
CA9 Q16790 1/20 0.36
CA14 Q9ULX7 1/20 0.36
LTA4H P09960 3/20 0.35
ALDH1A1 P00352 5/20 0.33
TSHR P16473 4/20 0.33
MAPK1 P28482 2/20 0.33
KDM4E B2RXH2 2/20 0.33
SMN1; SMN2 Q16637 2/20 0.33
LMNA P02545 1/20 0.33
ALOX12 P18054 1/20 0.33
ACHE P22303 1/20 0.33
ALOX15 P16050 1/20 0.33
PDE4B Q07343 1/20 0.31
TRPA1 O75762 1/20 0.31
POLB P06746 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6152732 0.77 CA4 (0.41) CA4CA12CA1CA2CA7
SCHEMBL482784 0.77 CA4 (0.41) CA4CA12CA1CA2CA7
SCHEMBL9745533 0.75 TSHR (0.35) CA4CA12CA1CA2CA7
SCHEMBL5531675 0.74 CA1 (0.41) CA4CA12CA1CA2CA7
SCHEMBL29167891 0.72 CA4 (0.38) CA4CA12CA1CA2CA7
SCHEMBL9747987 0.66 ALDH1A1 (0.35) ALDH1A1MAPK1ALOX15
SCHEMBL9745908 0.66
SCHEMBL6151849 0.65 TSHR (0.39) CA4CA12CA1CA2CA7
SCHEMBL6156243 0.65 TSHR (0.39) CA4CA12CA1CA2CA7
SCHEMBL392642 0.63 ALDH1A1 (0.40) CA4CA12CA1CA2CA7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021029422-A1 RADIATION-SENSITIVE COMPOSITION AND METHOD FOR FORMING RESIST PATTERN JSR株式会社 2021-02-18 WO disclosed
US-20200333707-A1 RESIST PATTERN-FORMING METHOD, AND RADIATION-SENSITIVE COMPOSITION AND PRODUCTION METHOD THEREOF JSR CORPORATION (JP) 2020-10-22 US disclosed
US-20170362412-A1 COMPOSITION FOR FILM FORMATION, AND PATTERN-FORMING METHOD JSR CORPORATION (JP) 2017-12-21 US disclosed
US-9809489-B2 Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device JSR CORPORATION (JP) 2017-11-07 US disclosed
US-20160081189-A1 COMPOSITION FOR FORMING A CONDUCTIVE FILM, A CONDUCTIVE FILM, A METHOD FOR PRODUCING A PLATING FILM, A PLATING FILM, AND AN ELECTRONIC DEVICE JSR CORPORATION (JP) 2016-03-17 US disclosed
US-20150284539-A1 COMPOSITION FOR FILM FORMATION, AND PATTERN-FORMING METHOD JSR CORPORATION (JP) 2015-10-08 US disclosed
US-20050153145-A1 Makes adhesion, printing, coating, or the like on the solid surface easy without directly using a flame treatment YAMASHITA MIKIO (JP) 2005-07-14 US disclosed
EP-1538234-A2 Method of modifying solid surface and product obtained Yasuhiro, Mori (JP) 2005-06-08 EP disclosed