SCHEMBL6152732

SCHEMBL6152732

CO[Ti](OC)(c1ccccc1)c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA4 P22748 2/20 0.41
CA12 O43570 1/20 0.36
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
CA7 P43166 1/20 0.36
CA9 Q16790 1/20 0.36
CA14 Q9ULX7 1/20 0.36
LTA4H P09960 3/20 0.35
TSHR P16473 4/20 0.33
SMN1; SMN2 Q16637 2/20 0.33
MAPK1 P28482 2/20 0.33
ALDH1A1 P00352 2/20 0.33
LMNA P02545 1/20 0.33
ALOX12 P18054 1/20 0.33
ACHE P22303 1/20 0.33
KDM4E B2RXH2 1/20 0.33
PDE4B Q07343 1/20 0.31
TRPA1 O75762 1/20 0.31
POLB P06746 1/20 0.31
IDO1 P14902 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6152339 0.77 CA4 (0.41) CA4CA12CA1CA2CA7
SCHEMBL482784 0.77 CA4 (0.41) CA4CA12CA1CA2CA7
SCHEMBL5531675 0.74 CA1 (0.41) CA4CA12CA1CA2CA7
SCHEMBL29167891 0.72 CA4 (0.38) CA4CA12CA1CA2CA7
SCHEMBL6156243 0.65 TSHR (0.39) CA4CA12CA1CA2CA7
SCHEMBL6151849 0.65 TSHR (0.39) CA4CA12CA1CA2CA7
SCHEMBL392642 0.63 ALDH1A1 (0.40) CA4CA12CA1CA2CA7
SCHEMBL11393230 0.61 CA4 (0.50) CA4CA12CA1CA2CA7
Biphenyl SCHEMBL3908169 0.60 ALDH1A1 (0.69) CA4CA12CA1CA2CA7
Biphenyl SCHEMBL28881047 0.60 ALDH1A1 (0.69) CA4CA12CA1CA2CA7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11692093-B2 Resin composition, method for producing three-dimensional molding using same, and three-dimensional molding Konica Minolta, Inc. (JP) 2023-07-04 US disclosed
WO-2021029422-A1 RADIATION-SENSITIVE COMPOSITION AND METHOD FOR FORMING RESIST PATTERN JSR株式会社 2021-02-18 WO disclosed
CN-104049464-B Gate insulating film, radiation-sensitive composition, cured film, semiconductor element, method for manufacturing semiconductor element, and display device JSR株式会社 2020-10-30 CN disclosed
US-20200333707-A1 RESIST PATTERN-FORMING METHOD, AND RADIATION-SENSITIVE COMPOSITION AND PRODUCTION METHOD THEREOF JSR CORPORATION (JP) 2020-10-22 US disclosed
US-20200263023-A1 RESIN COMPOSITION, METHOD FOR PRODUCING THREE-DIMENSIONAL MOLDING USING SAME, AND THREE-DIMENSIONAL MOLDING Konica Minolta, Inc. (JP) 2020-08-20 US disclosed
WO-2019193961-A1 RESIN COMPOSITION, METHOD FOR MANUFACTURING THREE-DIMENSIONALLY SHAPED ARTICLE USING SAME, AND THREE-DIMENSIONALLY SHAPED ARTICLE コニカミノルタ株式会社 2019-10-10 WO disclosed
US-20170362412-A1 COMPOSITION FOR FILM FORMATION, AND PATTERN-FORMING METHOD JSR CORPORATION (JP) 2017-12-21 US disclosed
US-9809489-B2 Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device JSR CORPORATION (JP) 2017-11-07 US disclosed
CN-103688221-B Photosensitive resin composition, cured product and spacer 三洋化成工业株式会社 2016-08-17 CN disclosed
US-20160081189-A1 COMPOSITION FOR FORMING A CONDUCTIVE FILM, A CONDUCTIVE FILM, A METHOD FOR PRODUCING A PLATING FILM, A PLATING FILM, AND AN ELECTRONIC DEVICE JSR CORPORATION (JP) 2016-03-17 US disclosed
US-20150296646-A1 PROTECTIVE PLATE AND DISPLAY DEVICE SHARP KABUSHIKI KAISHA (JP) 2015-10-15 US disclosed
US-20150284539-A1 COMPOSITION FOR FILM FORMATION, AND PATTERN-FORMING METHOD JSR CORPORATION (JP) 2015-10-08 US disclosed
CN-104049464-A Grid insulation membrane, radiation sensitivity composition, hardened membrane, semiconductor element, manufacturing method of semiconductor element, and display device JSR CORP 2014-09-17 CN disclosed
CN-103688221-A Photosensitive resin composition, cured product and spacer SANYO CHEMICAL IND LTD 2014-03-26 CN disclosed
CN-102156387-B Radiation-sensitive composition and cured film JSR CORP 2014-01-15 CN disclosed
CN-102413597-A Light-emitting element and composition for forming particle-containing layer JSR CORP 2012-04-11 CN disclosed
CN-102156387-A Radiation-sensitive composition and cured film JSR CORP 2011-08-17 CN disclosed
US-20050153145-A1 Makes adhesion, printing, coating, or the like on the solid surface easy without directly using a flame treatment YAMASHITA MIKIO (JP) 2005-07-14 US disclosed
EP-1538234-A2 Method of modifying solid surface and product obtained Yasuhiro, Mori (JP) 2005-06-08 EP disclosed