SCHEMBL628831

SCHEMBL628831

CO[Si](C)(OC)O[Si](C)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL834079 0.96
SCHEMBL2958335 0.96
SCHEMBL2956974 0.96
SCHEMBL26953021 0.92
SCHEMBL14865745 0.86
SCHEMBL1639013 0.84
SCHEMBL11291008 0.84
SCHEMBL2950549 0.83
SCHEMBL16980579 0.81
SCHEMBL649382 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 489 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025264567-A1 LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT APPLIED MATERIALS, INC. (US) 2025-12-26 WO claimed
US-20250391656-A1 LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT APPLIED MATERIALS INC (US) 2025-12-25 US claimed
US-20250357107-A1 RF PULSING ASSISTED LOW-K MATERIAL DEPOSITION WITH HIGH DENSITY APPLIED MATERIALS, INC. (US) 2025-11-20 US claimed
US-12331164-B2 Curable siloxane resin composition KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2025-06-17 US claimed
US-20250157825-A1 ETCHING METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2025-05-15 US claimed
US-20250143307-A1 GRAFTABLE BIOCIDAL LINKERS AND POLYMERS AND USES THEREOF DEBOGY MOLECULAR, INC. (US) 2025-05-08 US claimed
US-20250069884-A1 METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH APPLIED MATERIALS, INC. (US) 2025-02-27 US claimed
US-20250054749-A1 RF PULSING ASSISTED LOW-K FILM DEPOSITION WITH HIGH MECHANICAL STRENGTH APPLIED MATERIALS, INC. (US) 2025-02-13 US claimed
US-12203022-B2 Formulations for high selective silicon nitride etch ENTEGRIS, INC. (US) 2025-01-21 US claimed
US-20240401204-A1 METHOD AND COMPOSITION FOR ADJUSTING HYDROPHILICITY OF METAL USING A POLYPHENOL AND A SILANE MODIFIED NANO PARTICULATE OR AMINO ACID AMND SILICA Bulk Chemicals (US) 2024-12-05 US claimed
US-20040235683-A1 Mold release composition and process therewith E.I. DU PONT DE NEMOURS AND COMPANY 2004-11-25 US claimed
EP-1238024-B1 CURABLE INKJET PRINTABLE INK COMPOSITIONS 3M INNOVATIVE PROPERTIES CO (US) 2004-04-28 EP claimed
US-6719422-B2 Curable inkjet printable ink compositions 3M INNOVATIVE PROPERTIES COMPANY 2004-04-13 US claimed
US-6461419-B1 Curable inkjet printable ink compositions 3M INNOVATIVE PROPERTIES COMPANY 2002-10-08 US claimed
EP-1238024-A1 CURABLE INKJET PRINTABLE INK COMPOSITIONS 3M Innovative Properties Company (US) 2002-09-11 EP claimed
WO-2001032789-A1 CURABLE INKJET PRINTABLE INK COMPOSITIONS 3M INNOVATIVE PROPERTIES COMPANY (US) 2001-05-10 WO claimed
WO-1999063003-A1 LOW-OUTGASSING, ROOM TEMPERATURE VULCANIZING SILICONE COMPOSITIONS LOCTITE CORPORATION (US) 1999-12-09 WO claimed
US-5391677-A Acrylic-functional organopolysiloxane and method for the preparation thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 1995-02-21 US claimed
US-4485025-A Polyalkylpolyalkoxypolysiloxane stabilizers for inorganic silicates in antifreeze/coolant formulations TEXACO INC. (US) 1984-11-27 US claimed
US-4309557-A Process for the preparation of alkyl and aryl substituted oligosiloxanes suitable for use as diffusion pump oils NUSIL RESEARCH (US) 1982-01-05 US claimed