SCHEMBL6295286

SCHEMBL6295286

C=CC(=O)ON=C(c1ccccc1)c1ccccc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AKT1 P31749 1/20 0.48
MAPT P10636 5/20 0.45
NPC1 O15118 1/20 0.45
NFKB1 P19838 1/20 0.45
RAB9A P51151 1/20 0.45
NFKB2 Q00653 1/20 0.45
RELA Q04206 1/20 0.45
ALDH1A1 P00352 9/20 0.44
KMT2A Q03164 5/20 0.44
POLB P06746 3/20 0.44
SMN1; SMN2 Q16637 1/20 0.43
NPSR1 Q6W5P4 1/20 0.43
MAPK1 P28482 1/20 0.42
THRB P10828 1/20 0.41
MEN1 O00255 1/20 0.40
PLA2G7 Q13093 1/20 0.40
KDM4E B2RXH2 2/20 0.39
CYP3A4 P08684 1/20 0.39
PARP1 P09874 1/20 0.39
TSHR P16473 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6295276 0.82 MAPT (0.53) AKT1MAPTNPC1NFKB1RAB9A
SCHEMBL14370691 0.81 AKT1 (0.44) AKT1MAPTNPC1NFKB1RAB9A
SCHEMBL776030 0.78 AKT1 (0.42) AKT1MAPTNPC1NFKB1RAB9A
(Diphenylmethylidene)Amino Benzoate SCHEMBL92010 0.76 ALDH1A1 (0.66) MAPTNPC1RAB9AALDH1A1KMT2A
SCHEMBL28532356 0.75 MAPT (0.47) MAPTNPC1NFKB1RAB9ANFKB2
SCHEMBL213829 0.75 ALDH1A1 (0.51) MAPTALDH1A1KMT2APOLBSMN1; SMN2
SCHEMBL11333722 0.75 ALDH1A1 (0.50) MAPTNPC1NFKB1RAB9ANFKB2
SCHEMBL28848475 0.73 CES2 (0.50) MAPTALDH1A1KMT2APOLBSMN1; SMN2
SCHEMBL28909286 0.73 MAPT (0.44) MAPTNPC1NFKB1RAB9ANFKB2
SCHEMBL22268377 0.72 ALDH1A1 (0.50) MAPTALDH1A1KMT2APOLBSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6936401-B2 Pattern formation material and pattern formation method MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2005-08-30 US claimed
US-20040013978-A1 Pattern formation material and pattern formation method MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2004-01-22 US claimed
WO-2025034474-A1 3D PRINTED POROUS SUPRAMOLECULAR SORBENTS BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (US) 2025-02-13 WO disclosed
US-20240199854-A1 COMPOSITION, CURED FILM, STRUCTURAL BODY, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD OF CURED FILM FUJIFLIM CORPORATION (JP) 2024-06-20 US disclosed
WO-2024057999-A1 COLORING COMPOSITION, CURED FILM, COLOR FILTER, DISPLAY DEVICE AND METHOD FOR PRODUCING CURED FILM 富士フイルム株式会社 2024-03-21 WO disclosed
WO-2023032746-A1 COMPOSITION, CURED FILM, STRUCTURE, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND METHOD FOR PRODUCING CURED FILM 富士フイルム株式会社 2023-03-09 WO disclosed
CN-110095941-B Photosensitive resin composition and method for producing semiconductor element 东丽株式会社 2023-02-17 CN disclosed
CN-107077070-B Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device 东丽株式会社 2020-06-16 CN disclosed
EP-3203320-B9 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES (JP) 2020-05-06 EP disclosed
EP-3203320-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES (JP) 2019-10-23 EP disclosed
US-10409163-B2 Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-09-10 US disclosed
EP-2799928-B1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT TORAY INDUSTRIES (JP) 2019-05-22 EP disclosed
US-20170285477-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-05 US disclosed
EP-3203320-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Toray Industries, Inc. (JP) 2017-08-09 EP disclosed
US-9704724-B2 Photosensitive resin composition and method for producing semiconductor device TORAY INDUSTRIES, INC. (JP) 2017-07-11 US disclosed
EP-2799928-A1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT Toray Industries, Inc. (JP) 2014-11-05 EP disclosed
US-20140242787-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2014-08-28 US disclosed
US-6936401-B2 Pattern formation material and pattern formation method MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2005-08-30 US disclosed
US-20040013978-A1 Pattern formation material and pattern formation method MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2004-01-22 US disclosed