SCHEMBL6324930

SCHEMBL6324930

CCCCN(CCCC)C(=Cc1ccccc1)C1=CC(=C(C#N)C#N)C=C(C)O1

nearest known ligand 0.35

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.35
KDM4E B2RXH2 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
POLB P06746 1/20 0.31
LMNA P02545 1/20 0.31
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3745638 0.96 ALDH1A1 (0.36) ALDH1A1KDM4ESMN1; SMN2POLBLMNA
SCHEMBL28980724 0.83 ALDH1A1 (0.34) ALDH1A1SMN1; SMN2POLB
SCHEMBL74731 0.83 ALDH1A1 (0.34) ALDH1A1SMN1; SMN2POLB
Iodide SCHEMBL29042229 0.82 ALDH1A1 (0.33) ALDH1A1POLB
SCHEMBL1462636 0.75 ALDH1A1 (0.37) ALDH1A1SMN1; SMN2POLBLMNA
Coumarin SCHEMBL1049521 0.71 CA12 (0.37) ALDH1A1SMN1; SMN2LMNATDP1
SCHEMBL6090753 0.70 HPGD (0.45) ALDH1A1LMNATDP1
SCHEMBL6379933 0.70 HPGD (0.45) ALDH1A1LMNATDP1
SCHEMBL3725629 0.70 ALDH1A1 (0.33) ALDH1A1
SCHEMBL990257 0.68 ALDH1A1 (0.32) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6899999-B2 Method of manufacturing composite member, photosensitive composition, porous base material, insulating body and composite member KABUSHIKI KAISHA TOSHIBA (JP) 2005-05-31 US disclosed
US-6835889-B2 Passive element component and substrate with built-in passive element KABUSHIKI KAISHA TOSHIBA (JP) 2004-12-28 US disclosed
US-20030107465-A1 Passive element component and substrate with built-in passive element KABUSHIKI KAISHA TOSHIBA (JP) 2003-06-12 US disclosed
US-20030022102-A1 Method of manufacturing composite member, photosensitive composition, porous base material, insulating body and composite member KABUSHIKI KAISHA TOSHIBA (JP) 2003-01-30 US disclosed