SCHEMBL6325254

SCHEMBL6325254

CCN(CC)C(=O)c1ccc(N(c2cccc(O)c2)C2CCN(Cc3cccc(F)c3)CC2)cc1

nearest known ligand 0.84

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
OPRD1 P41143 20/20 0.84
OPRM1 P35372 17/20 0.84
OPRK1 P41145 17/20 0.84

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6326841 0.92 OPRD1 (0.84) OPRD1OPRM1OPRK1
SCHEMBL6326767 0.88 OPRD1 (0.83) OPRD1OPRM1OPRK1
SCHEMBL6334592 0.87 OPRD1 (0.86) OPRD1OPRM1OPRK1
SCHEMBL6327345 0.87 OPRD1 (0.86) OPRD1OPRM1OPRK1
SCHEMBL6329511 0.86 OPRD1 (0.84) OPRD1OPRM1OPRK1
SCHEMBL6328161 0.86 OPRD1 (0.84) OPRD1OPRM1OPRK1
SCHEMBL6325512 0.86 OPRD1 (0.84) OPRD1OPRM1OPRK1
SCHEMBL7248855 0.86 OPRD1 (0.64) OPRD1OPRM1OPRK1
SCHEMBL6330319 0.86 OPRD1 (0.84) OPRD1OPRM1OPRK1
SCHEMBL6329792 0.85 OPRD1 (0.84) OPRD1OPRM1OPRK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6875777-B2 Compounds ASTRAZENECA AB (SE) 2005-04-05 US claimed
US-20040102020-A1 Method for bonding and debonding films using a high-temperature polymer ROBERDS BRIAN (US) 2004-05-27 US claimed
EP-1242406-B1 NOVEL COMPOUNDS ASTRAZENECA AB (SE) 2004-03-17 EP claimed
US-6638835-B2 Method for bonding and debonding films using a high-temperature polymer INTEL CORPORATION 2003-10-28 US claimed
US-20030170424-A1 Method for bonding and debonding films using a high-temperature polymer ROBERDS BRIAN (US) 2003-09-11 US claimed
US-20030108715-A1 Method for bonding and debonding films using a high-temperature polymer INTEL CORPORATION 2003-06-12 US claimed
US-20230106050-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-04-06 US disclosed
EP-4112294-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE BOARD, RESIN SHEET, AND PRINTED CIRCUIT BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-01-04 EP disclosed
US-6878796-B2 Solvent systems for polymeric dielectric materials HONEYWELL INTERNATIONAL INC. (US) 2005-04-12 US disclosed
US-6875777-B2 Compounds ASTRAZENECA AB (SE) 2005-04-05 US disclosed
US-20040102020-A1 Method for bonding and debonding films using a high-temperature polymer ROBERDS BRIAN (US) 2004-05-27 US disclosed
EP-1242406-B1 NOVEL COMPOUNDS ASTRAZENECA AB (SE) 2004-03-17 EP disclosed
US-6638835-B2 Method for bonding and debonding films using a high-temperature polymer INTEL CORPORATION 2003-10-28 US disclosed
US-6524657-B2 Using aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, as clean-up solvent or as part of a coating solution for polymeric dielectric materials; microelectronics HONEYWELL INTERNATIONAL INC. 2003-02-25 US disclosed
US-20030036552-A1 Novel compounds ASTRAZENECA AB (SE) 2003-02-20 US disclosed
US-20020183476-A1 Solvent systems for polymeric dielectric materials HONEYWELL INTERNATIONAL INC. 2002-12-05 US disclosed
US-6413202-B1 USING AROMATIC ETHER SOLVENT ALLIEDSIGNAL, INC. 2002-07-02 US disclosed
US-6291628-B1 USED FOR FORMING A DIELECTRIC FILM ON A SUBSTRATE BY SPIN-COATING; IN MICROELECTRONIC DEVICES ALLIED SIGNAL INC. 2001-09-18 US disclosed
WO-2000043836-A1 SOLVENT SYSTEMS FOR POLYMERIC DIELECTRIC MATERIALS ALLIEDSIGNAL INC. (US) 2000-07-27 WO disclosed
WO-1999038910-A1 SOLVENT SYSTEMS FOR LOW DIELECTRIC CONSTANT POLYMERIC MATERIALS ALLIEDSIGNAL, INC. (US) 1999-08-05 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20030036552-A1 Novel compounds ARRB1, OPRK1, OPRM1 OPRD1 4/4885OPRM1 3/4885OPRK1 2/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.