SCHEMBL6342118

SCHEMBL6342118

CNC(=O)C(C)[SiH3].CNC(C)=O.CNC(C)=O

nearest known ligand 0.32

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.32
CA2 P00918 1/20 0.32
PTGS1 P23219 1/20 0.32
MMP12 P39900 1/20 0.32
FFAR2 O15552 1/20 0.31
NFKB1 P19838 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20629123 0.92
Isopropyl Alcohol SCHEMBL11113896 0.74
SCHEMBL6655029 0.73 TSHR (0.33)
SCHEMBL9700755 0.73 ALDH1A1 (0.32)
SCHEMBL9715563 0.73
SCHEMBL2401765 0.72 KDM4E (0.54) KDM4ECA2PTGS1MMP12NFKB1
SCHEMBL18510170 0.72
SCHEMBL20411614 0.72
SCHEMBL4397 0.72
Ammonia Solution, Strong SCHEMBL10746719 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023068244-A1 MEMBRANE FORMATION COMPOSITION, AND GAS PERMEATION MEMBRANE 日産化学株式会社 2023-04-27 WO disclosed
US-20220002592-A1 SILICONE ADHESIVE TONSAN ADHESIVE, INC (CN) 2022-01-06 US disclosed
EP-3401366-B1 SILICONE COMPOSITION BASED ON BOTH CONDENSATION CURING REACTION AND ORGANIC-PEROXIDE CURING REACTION SHINETSU CHEMICAL CO (JP) 2020-08-26 EP disclosed
US-10689515-B2 Silicone composition based on both condensation/curing reaction and organic-peroxide curing reaction SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-06-23 US disclosed
US-20190010294-A1 SILICONE COMPOSITION BASED ON BOTH CONDENSATION/CURING REACTION AND ORGANIC-PEROXIDE CURING REACTION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-01-10 US disclosed
EP-3401366-A1 SILICONE COMPOSITION BASED ON BOTH CONDENSATION/CURING REACTION AND ORGANIC-PEROXIDE CURING REACTION Shin-Etsu Chemical Co., Ltd. (JP) 2018-11-14 EP disclosed
US-6875806-B2 Room temperature curable organopolysiloxane composition and part using the same as adhesive SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-04-05 US disclosed
EP-1031611-B1 Room temperature fast curable silicone composition SHINETSU CHEMICAL CO (JP) 2004-07-21 EP disclosed
US-20030211339-A1 Room temperature curable organopolysiloxane composition and part using the same as adhesive SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-11-13 US disclosed
US-6306998-B1 POLYSILOXANES WITH BLOCKED HYDROXY GROUPS AND HYDROLYZABLE SILANE KETOXIME, ALKOXY, ACYLOXY, AMIDE AND AMINE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-23 US disclosed
EP-1031611-A1 Room temperature fast curable silicone composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-08-30 EP disclosed
US-5093454-A Moisture and hot water-resistant adhesives and seals TOSHIBA SILICONE CO., LTD. (JP) 1992-03-03 US disclosed
US-4853313-A Printing plate TORAY INDUSTRIES, INC. (JP) 1989-08-01 US disclosed
EP-0242143-A2 Printing plate TORAY INDUSTRIES, INC. (JP) 1987-10-21 EP disclosed
US-4247442-A Mold and mildew resistant organopolysiloxane compositions TORAY SILICONE COMPANY, LTD. (JP) 1981-01-27 US disclosed
US-4156674-A PLATINUM OR COMPOUND THEREOF, CARBON BLACK AND A TRIAZOLE FOR SELF-EXTINGUISHING CHARACTER, CURING CATALYST AND A SILICON CONTAINING CROSSLINKER TORAY SILICONE COMPANY, LTD. (JP) 1979-05-29 US disclosed