Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD11B1 | P28845 | 2/20 | 0.36 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.36 |
| ▸ | EPHX2 | P34913 | 2/20 | 0.31 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6346999 | 0.73 | HSD11B1 (0.38) | HSD11B1CYP2C9EPHX2L3MBTL1 | |
| SCHEMBL1727171 | 0.72 | HSD11B1 (0.45) | HSD11B1CYP2C9EPHX2L3MBTL1 | |
| SCHEMBL5416503 | 0.71 | CYP2C9 (0.45) | HSD11B1CYP2C9EPHX2L3MBTL1 | |
| SCHEMBL6349275 | 0.68 | HSD11B1 (0.34) | HSD11B1CYP2C9 | |
| SCHEMBL12765489 | 0.67 | CYP2C9 (0.41) | HSD11B1CYP2C9EPHX2 | |
| SCHEMBL5401965 | 0.66 | HSD11B1 (0.48) | HSD11B1CYP2C9EPHX2L3MBTL1 | |
| SCHEMBL6437294 | 0.64 | HSD11B1 (0.38) | HSD11B1CYP2C9L3MBTL1 | |
| SCHEMBL16698251 | 0.64 | HSD11B1 (0.48) | HSD11B1CYP2C9L3MBTL1 | |
| SCHEMBL2181379 | 0.64 | HSD11B1 (0.46) | HSD11B1CYP2C9EPHX2L3MBTL1 | |
| SCHEMBL19859959 | 0.64 | HSD11B1 (0.48) | HSD11B1CYP2C9L3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6974658-B2 | HIGH MOLECULAR COMPOUND, MONOMER COMPOUNDS AND PHOTOSENSITIVE COMPOSITION FOR PHOTORESIST, PATTERN FORMING METHOD UTILIZING PHOTOSENSITIVE COMPOSITION, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENTS | KABUSHIKI KAISHA TOSHIBA (JP) | 2005-12-13 | — | — | US | disclosed |
| US-20030235781-A1 | High molecular compound, monomer compounds and photosensitive composition for photoresist, pattern forming method utilizing photosensitive composition, and method of manufacturing electronic components | KABUSHIKI KAISHA TOSHIBA (JP) | 2003-12-25 | — | — | US | disclosed |