SCHEMBL6346239

SCHEMBL6346239

CCC(O)(C12CC3CC(CC(C3)C1)C2)C12CC3CC(CC(C3)C1)C2

nearest known ligand 0.56

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 2/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
ALDH1A1 P00352 2/20 0.32
GRIN2D O15399 3/20 0.32
GRIN3B O60391 3/20 0.32
GRIN1 Q05586 3/20 0.32
GRIN2A Q12879 3/20 0.32
GRIN2B Q13224 3/20 0.32
GRIN2C Q14957 3/20 0.32
GRIN3A Q8TCU5 3/20 0.32
EPHX2 P34913 1/20 0.32
MEN1 O00255 1/20 0.32
HSD11B1 P28845 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6740182 0.81 KMT2A (0.33) KMT2ASMN1; SMN2ALDH1A1GRIN2DGRIN3B
SCHEMBL5195656 0.79 KMT2A (0.33) KMT2ASMN1; SMN2ALDH1A1GRIN2DGRIN3B
SCHEMBL7459463 0.74 SLC22A2 (0.34) KMT2ASMN1; SMN2ALDH1A1MEN1
SCHEMBL28206894 0.73 KMT2A (0.34) KMT2ASMN1; SMN2GRIN2DGRIN3BGRIN1
SCHEMBL7462026 0.73 KMT2A (0.33) KMT2ASMN1; SMN2ALDH1A1EPHX2MEN1
SCHEMBL7457485 0.73 GRIN2D (0.35) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL871816 0.72 GRIN2D (0.36) KMT2ASMN1; SMN2GRIN2DGRIN3BGRIN1
SCHEMBL23956811 0.71 GRIN2D (0.32) KMT2AGRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL15922449 0.71 GRIN2D (0.37) SMN1; SMN2GRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL15922721 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6974658-B2 HIGH MOLECULAR COMPOUND, MONOMER COMPOUNDS AND PHOTOSENSITIVE COMPOSITION FOR PHOTORESIST, PATTERN FORMING METHOD UTILIZING PHOTOSENSITIVE COMPOSITION, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENTS KABUSHIKI KAISHA TOSHIBA (JP) 2005-12-13 US disclosed
US-20030235781-A1 High molecular compound, monomer compounds and photosensitive composition for photoresist, pattern forming method utilizing photosensitive composition, and method of manufacturing electronic components KABUSHIKI KAISHA TOSHIBA (JP) 2003-12-25 US disclosed