SCHEMBL634872

SCHEMBL634872

CCCCCCCCCCCCn1ccnc1C

nearest known ligand 0.85

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.85
KMT2A Q03164 2/20 0.85
POLB P06746 1/20 0.85
TLR8 Q9NR97 2/20 0.62
CA12 O43570 1/20 0.51
CA1 P00915 1/20 0.51
CA2 P00918 1/20 0.51
CA9 Q16790 1/20 0.51
TSHR P16473 1/20 0.47
P2RX7 Q99572 1/20 0.47
KDM4E B2RXH2 1/20 0.45
HTT P42858 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
TDP1 Q9NUW8 1/20 0.44
TBXAS1 P24557 1/20 0.43
CYP1A2 P05177 1/20 0.42
CYP3A4 P08684 1/20 0.42
CYP2D6 P10635 1/20 0.42
CYP19A1 P11511 1/20 0.42
CYP2C9 P11712 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4070067 1.00 ALDH1A1 (0.85) ALDH1A1KMT2APOLBTLR8CA12
SCHEMBL4068798 1.00 ALDH1A1 (0.85) ALDH1A1KMT2APOLBTLR8CA12
SCHEMBL5287541 1.00 ALDH1A1 (0.85) ALDH1A1KMT2APOLBTLR8CA12
SCHEMBL363481 1.00 ALDH1A1 (0.85) ALDH1A1KMT2APOLBTLR8CA12
SCHEMBL25267924 1.00 ALDH1A1 (0.85) ALDH1A1KMT2APOLBTLR8CA12
SCHEMBL1137200 1.00 ALDH1A1 (0.85) ALDH1A1KMT2APOLBTLR8CA12
SCHEMBL25270261 1.00 ALDH1A1 (0.85) ALDH1A1KMT2APOLBTLR8CA12
SCHEMBL25240227 1.00 ALDH1A1 (0.85) ALDH1A1KMT2APOLBTLR8CA12
SCHEMBL25267373 1.00 ALDH1A1 (0.85) ALDH1A1KMT2APOLBTLR8CA12
SCHEMBL2328687 1.00 ALDH1A1 (0.85) ALDH1A1KMT2APOLBTLR8CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 221 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250163261-A1 LOW-DIELECTRIC RESIN COMPOSITION NAN YA PLASTICS CORPORATION (TW) 2025-05-22 US claimed
US-11845830-B2 Method for producing a composition comprising a polyurethane with NCO end groups BOSTIK SA (FR) 2023-12-19 US claimed
CN-107835841-B Crystallization-retarded polymer composition, additive composition influencing crystallization behavior and use, method for reducing crystallization point 弗劳恩霍弗应用研究促进协会 2021-01-05 CN claimed
US-10851201-B2 Curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering HUNTSMAN INTERNATIONAL LLC (US) 2020-12-01 US claimed
CN-107636039-B Curing agent for thermosetting epoxy resins and method for producing insulation systems for electronic engineering 亨斯迈先进材料许可(瑞士)有限公司 2020-11-24 CN claimed
EP-3728386-A1 METHOD FOR PRODUCING A COMPOSITION COMPRISING A POLYURETHANE WITH NCO END GROUPS BOSTIK SA (FR) 2020-10-28 EP claimed
CN-111757901-A Process for preparing compositions comprising polyurethanes with NCO end groups 博斯蒂克股份公司 2020-10-09 CN claimed
US-20200308337-A1 METHOD FOR PRODUCING A COMPOSITION COMPRISING A POLYURETHANE WITH NCO END GROUPS BOSTIK SA (FR) 2020-10-01 US claimed
EP-3298061-B1 A CURING AGENT FOR THERMOSETTING EPOXY RESINS, AND A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING HUNTSMAN ADVANCED MAT LICENSING (SWITZERLAND) GMBH (CH) 2020-09-09 EP claimed
CN-111117220-A Polyamide composition with permanent static dissipation function and application thereof 会通新材料(上海)有限公司 2020-05-08 CN claimed
US-20180142058-A1 A Curing Agent For Thermosetting Epoxy Resins, and a Process for the Preparation of Insulation Systems for Electrical Engineering HUNTSMAN INTERNATIONAL LLC (US) 2018-05-24 US claimed
EP-3298061-A1 A CURING AGENT FOR THERMOSETTING EPOXY RESINS, AND A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING Huntsmann Advanced Materials Licensing (Switzerland) GmbH (CH) 2018-03-28 EP claimed
CN-107636039-A Curing agent and the method for preparing insulation system for electronic engineering for thermosetting epoxy resin 亨斯迈先进材料许可(瑞士)有限公司 2018-01-26 CN claimed
WO-2016184749-A1 A CURING AGENT FOR THERMOSETTING EPOXY RESINS, AND A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) 2016-11-24 WO claimed
WO-2007149842-A2 METHOD OF PREPARING IMIDAZOLIUM SURFACTANTS BRIDGESTONE CORPORATION (JP) 2007-12-27 WO claimed
US-20070293684-A1 Method of preparing imidazolium surfactants BRIDGESTONE CORPORATION 2007-12-20 US claimed
US-5527876-A REACTING ISOCYANATE COMPOUND WITH CARBOXYLIC ACID COMPOUND IN PRESENCE OF TERTIARY AMINE HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 1996-06-18 US claimed
EP-0362787-A2 Modified amino curing agents for epoxy resins HENKEL RESEARCH CORPORATION (US) 1990-04-11 EP claimed
EP-4747293-A1 OPTICAL MATERIAL DERIVED FROM A POLYMERIZABLE COMPOSITION CONTAINING A TERMINAL DIALKYNE COMPOUND ESSILOR INTERNATIONAL (FR) 2026-05-27 EP disclosed
US-4062965-A Quaternary imidazole compounds as microbicides TH. GOLDSCHMIDT AG (DT) 1977-12-13 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20070293684-A1 Method of preparing imidazolium surfactants SMARCC2, SMARCC1, ITPR3 ALDH1A1 4774/4885KMT2A 4645/4885POLB 1460/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.