SCHEMBL6351189

SCHEMBL6351189

Sc1cccc(C2CCCCC2)c1C1CCCCC1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTR1A P08908 1/20 0.38
HTR7 P34969 1/20 0.38
ABCB1 P08183 2/20 0.38
CEL P19835 2/20 0.37
PTGDR2 Q9Y5Y4 1/20 0.36
PTGS2 P35354 1/20 0.35
CHRNB2 P17787 2/20 0.33
CHRNA4 P43681 2/20 0.33
PDCD1 Q15116 1/20 0.33
CD274 Q9NZQ7 1/20 0.33
ADRA2A P08913 1/20 0.33
ADRA2B P18089 1/20 0.33
ADRA2C P18825 1/20 0.33
KMO O15229 1/20 0.33
PTPRC P08575 1/20 0.33
PTPRF P10586 1/20 0.33
PTPN1 P18031 1/20 0.33
CDC25B P30305 1/20 0.33
CYP11B2 P19099 1/20 0.32
CYP19A1 P11511 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfuric Acid SCHEMBL15345296 0.86 PTGS2 (0.40) HTR1AHTR7ABCB1CELPTGDR2
SCHEMBL239469 0.85 ABCB1 (0.43) HTR1AHTR7ABCB1CELPTGDR2
Trifluoromethanesulfonic Acid SCHEMBL7846491 0.83 PTGS2 (0.38) ABCB1PTGDR2PTGS2CHRNB2CHRNA4
SCHEMBL14353365 0.83 ABCB1 (0.42) HTR1AHTR7ABCB1CELPTGDR2
SCHEMBL777873 0.83 CEL (0.41) HTR1AHTR7ABCB1CELPTGDR2
SCHEMBL6346792 0.82 HTR1A (0.39) HTR1AHTR7CELPTGDR2PTGS2
SCHEMBL23735529 0.81 PTGDR2 (0.42) HTR1AHTR7PTGDR2PTGS2ADRA2A
SCHEMBL5887373 0.81 PTGDR2 (0.42) HTR1AHTR7PTGDR2PTGS2ADRA2A
SCHEMBL6349737 0.79 HTR1A (0.40) HTR1AHTR7CELPTGDR2PTGS2
SCHEMBL7847920 0.79 PTGS2 (0.40) PTGS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111198480-B Photosensitive resin composition, pattern forming method and antireflection film 信越化学工业株式会社 2025-02-11 CN disclosed
CN-109976091-B Photosensitive resin composition, pattern forming method, and manufacture of optoelectronic semiconductor device 信越化学工业株式会社 2024-09-27 CN disclosed
EP-3266759-B1 COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING COMPOUND OR RESIN MITSUBISHI GAS CHEMICAL CO (JP) 2023-09-13 EP disclosed
WO-2023053877-A1 PHOTOACID GENERATOR, RESIST COMPOSITION, AND METHOD FOR PRODUCING DEVICE USING SAID RESIST COMPOSITION 東洋合成工業株式会社 2023-04-06 WO disclosed
EP-3495434-B1 NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS SHINETSU CHEMICAL CO (JP) 2020-12-30 EP disclosed
EP-2080750-B1 RADIATION-SENSITIVE COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2020-07-29 EP disclosed
EP-3495434-A1 NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS Shin-Etsu Chemical Co., Ltd. (JP) 2019-06-12 EP disclosed
EP-2955175-B1 USE OF 9-[1,1'-BIPHENYL]-4-YL-9H-XANTHENE-2,7-DIOL AND SIMILAR COMPOUNDS FOR FORMING RESINS FOR USE IN UNDERLAYER FILMS FOR LITHOGRAPHY AND IN PATTERN FORMING METHODS MITSUBISHI GAS CHEMICAL CO (JP) 2018-04-04 EP disclosed
EP-3266759-A1 COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING COMPOUND OR RESIN Mitsubishi Gas Chemical Company, Inc. (JP) 2018-01-10 EP disclosed
EP-2955175-A1 COMPOUND, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMATION METHOD Mitsubishi Gas Chemical Company, Inc. (JP) 2015-12-16 EP disclosed
US-6878508-B2 Resist patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-04-12 US disclosed
US-6048661-A POLYMER WITH HYDROXY AND CARBOXY GROUPS AND ETHER ESTER GROUPS FOR PHOTORESISTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-04-11 US disclosed