SCHEMBL6355801

SCHEMBL6355801

C=COC(=O)OCCOCC

nearest known ligand 0.52

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 8/20 0.52
TSHR P16473 5/20 0.52
THRB P10828 2/20 0.50
HSD17B10 Q99714 5/20 0.42
TP53 P04637 2/20 0.42
HIF1A Q16665 2/20 0.42
HPGD P15428 1/20 0.34
SOAT1 P35610 1/20 0.33
USP2 O75604 1/20 0.31
POLB P06746 1/20 0.31
MAPT P10636 1/20 0.31
ALOX15 P16050 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL284310 0.87 TSHR (0.54) ALDH1A1TSHRTHRBHSD17B10TP53
SCHEMBL13248945 0.86 ALDH1A1 (0.54) ALDH1A1TSHRTHRBHSD17B10TP53
SCHEMBL284797 0.85 TSHR (0.42) ALDH1A1TSHRTHRBHSD17B10TP53
SCHEMBL12542192 0.83 THRB (0.59) ALDH1A1TSHRTHRBHSD17B10TP53
SCHEMBL21985904 0.82 MEN1 (0.44) ALDH1A1TSHRTHRBHSD17B10TP53
SCHEMBL6346837 0.82 ALDH1A1 (0.37) ALDH1A1TSHRTHRBHSD17B10TP53
SCHEMBL9298820 0.82 ALDH1A1 (0.54) ALDH1A1TSHRTHRBHSD17B10TP53
SCHEMBL167897 0.81
SCHEMBL166975 0.81
SCHEMBL938633 0.80 ALDH1A1 (0.68) ALDH1A1TSHRTHRBHSD17B10TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6974658-B2 HIGH MOLECULAR COMPOUND, MONOMER COMPOUNDS AND PHOTOSENSITIVE COMPOSITION FOR PHOTORESIST, PATTERN FORMING METHOD UTILIZING PHOTOSENSITIVE COMPOSITION, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENTS KABUSHIKI KAISHA TOSHIBA (JP) 2005-12-13 US disclosed
US-20030235781-A1 High molecular compound, monomer compounds and photosensitive composition for photoresist, pattern forming method utilizing photosensitive composition, and method of manufacturing electronic components KABUSHIKI KAISHA TOSHIBA (JP) 2003-12-25 US disclosed