SCHEMBL6356468

SCHEMBL6356468

C=C(C)C12CC3CC(CC(O)(C3)C1)C2

nearest known ligand 0.46

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 2/20 0.46
PKM P14618 1/20 0.45
ALDH1A1 P00352 3/20 0.39
CNR2 P34972 3/20 0.36
CNR1 P21554 2/20 0.35
ABL1 P00519 1/20 0.35
TSHR P16473 1/20 0.35
RIN1 Q13671 1/20 0.35
KDM4E B2RXH2 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
THRB P10828 1/20 0.33
DPP4 P27487 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL678337 0.83 HSD11B1 (0.49) HSD11B1PKMALDH1A1CNR2CNR1
SCHEMBL3878155 0.83 HSD11B1 (0.49) HSD11B1PKMALDH1A1CNR2CNR1
SCHEMBL587576 0.81 HSD11B1 (0.49) HSD11B1PKMALDH1A1CNR2CNR1
SCHEMBL5346781 0.79 HSD11B1 (0.54) HSD11B1PKMALDH1A1CNR2CNR1
SCHEMBL6451090 0.77 ALDH1A1 (0.39) HSD11B1ALDH1A1TSHRSMN1; SMN2L3MBTL1
SCHEMBL6388362 0.75 HSD11B1 (0.50) HSD11B1PKMALDH1A1CNR2CNR1
SCHEMBL4142469 0.75 HSD11B1 (0.50) HSD11B1PKMALDH1A1CNR2CNR1
SCHEMBL27763496 0.74 HSD11B1 (0.58) HSD11B1PKMALDH1A1CNR2CNR1
SCHEMBL14791285 0.74 PKM (0.64) HSD11B1PKMALDH1A1CNR2DPP4
SCHEMBL1150706 0.74 PKM (0.64) HSD11B1PKMALDH1A1CNR2DPP4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6974658-B2 HIGH MOLECULAR COMPOUND, MONOMER COMPOUNDS AND PHOTOSENSITIVE COMPOSITION FOR PHOTORESIST, PATTERN FORMING METHOD UTILIZING PHOTOSENSITIVE COMPOSITION, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENTS KABUSHIKI KAISHA TOSHIBA (JP) 2005-12-13 US disclosed
US-20030235781-A1 High molecular compound, monomer compounds and photosensitive composition for photoresist, pattern forming method utilizing photosensitive composition, and method of manufacturing electronic components KABUSHIKI KAISHA TOSHIBA (JP) 2003-12-25 US disclosed