SCHEMBL6356580

SCHEMBL6356580

C=C(C)C1CCC(C)(C)OC1=O

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8942920 0.74 CCR5 (0.32) KDM4E
SCHEMBL27364252 0.70
SCHEMBL14275665 0.68 KDM4E (0.30) KDM4E
SCHEMBL8943039 0.68 KDM4E (0.37) KDM4E
SCHEMBL6342823 0.68 CYP19A1 (0.31)
SCHEMBL18105691 0.68 MAPT (0.36) KDM4E
Hydrochloric Acid SCHEMBL9068147 0.67
Hydrochloric Acid SCHEMBL9068149 0.67
SCHEMBL11307797 0.66 GPBAR1 (0.33)
SCHEMBL10449251 0.64 LMNA (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6974658-B2 HIGH MOLECULAR COMPOUND, MONOMER COMPOUNDS AND PHOTOSENSITIVE COMPOSITION FOR PHOTORESIST, PATTERN FORMING METHOD UTILIZING PHOTOSENSITIVE COMPOSITION, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENTS KABUSHIKI KAISHA TOSHIBA (JP) 2005-12-13 US disclosed
US-20030235781-A1 High molecular compound, monomer compounds and photosensitive composition for photoresist, pattern forming method utilizing photosensitive composition, and method of manufacturing electronic components KABUSHIKI KAISHA TOSHIBA (JP) 2003-12-25 US disclosed