SCHEMBL63648

SCHEMBL63648

Cc1ccc(S)cc1S

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29507711 1.00
SCHEMBL8417971 0.97 ALDH1A1 (0.41)
SCHEMBL1158048 0.97 ALDH1A1 (0.41)
SCHEMBL29767277 0.79
SCHEMBL330857 0.79
SCHEMBL91378 0.79
SCHEMBL3185677 0.77 ALDH1A1 (0.34)
SCHEMBL29438518 0.77
SCHEMBL394229 0.77
SCHEMBL7741335 0.77 ALDH1A1 (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 723 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12187851-B2 Network polymers and methods of making and using same THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE (US) 2025-01-07 US claimed
US-12054607-B2 Tough, healable composites displaying stress relaxation at the resin-filler interface THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE (US) 2024-08-06 US claimed
US-11726386-B2 Plasmon coupling materials, methods of making plasmon coupling materials, methods of using plasmon coupling materials and systems and devices that include plasmon coupling materials VANDERBILT UNIVERSITY (US) 2023-08-15 US claimed
US-20230119934-A1 NETWORK POLYMERS AND METHODS OF MAKING AND USING SAME UNIV COLORADO REGENTS (US) 2023-04-20 US claimed
US-20210311370-A1 PLASMON COUPLING MATERIALS, METHODS OF MAKING PLASMON COUPLING MATERIALS, METHODS OF USING PLASMON COUPLING MATERIALS AND SYSTEMS AND DEVICES THAT INCLUDE PLASMON COUPLING MATERIALS VANDERBILT UNIVERSITY 2021-10-07 US claimed
US-20210292482-A1 NETWORK POLYMERS AND METHODS OF MAKING AND USING SAME THE REGENTS OF THE UNIV OF COLORADO A BODY CORPORTATE (US) 2021-09-23 US claimed
EP-3829307-A1 BISMUTH-THIOL COMPOSITIONS AND METHODS OF USE Microbion Corporation (US) 2021-06-09 EP claimed
CN-112804878-A Bismuth-thiol compositions and methods of use 微生物公司 2021-05-14 CN claimed
US-20210002469-A1 TOUGH, HEALABLE COMPOSITES DISPLAYING STRESS RELAXATION AT THE RESIN-FILLER INTERFACE NATIONAL INSTITUTES OF HEALTH (NIH), U.S. DEPT. OF HEALTH AND HUMAN SERVICES (DHHS), U.S. GOVERNMENT 2021-01-07 US claimed
US-20200046650-A1 BISMUTH-THIOL COMPOSITIONS AND METHODS OF USE MICROBION CORPORATION 2020-02-13 US claimed
US-6391286-B1 CURABLE DENTAL COMPOSITION COMPRISING PREFORMED METAL COMPLEX AS FLUORIDE RELEASING MATERIAL 3M INNOVATIVE PROPERTIES COMPANY 2002-05-21 US claimed
EP-0803504-B1 The process of producing polythiol oligomer HOYA CORP (JP) 2001-09-19 EP claimed
US-5961889-A REACTING 2,5-DIMERCAPTOMETHYL-1,4-DITHIANE (DMMD) WITH SULFUR IN A MOLAR RATIO 2:1 OR 3:2 IN THE PRESENCE OF A BASIC CATALYST HOYA CORPORATION (JP) 1999-10-05 US claimed
EP-0803504-A2 The process of producing polythiol oligomer HOYA CORPORATION (JP) 1997-10-29 EP claimed
EP-0268896-B1 PROCESS FOR MAKING A HIGH-REFRACTIVITY PLASTIC LENS RESIN MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-02-03 EP claimed
US-5093389-A Epoxy-Terminated Polysiloxane, Silanol-Terminated Polysiloxane Aminoxysilicon Compound TOSHIBA SILICONE CO., LTD. (JP) 1992-03-03 US claimed
US-5061739-A SEALANTS FOR CONSTRUCTION TOSHIBA SILICONE CO., LTD. (JP) 1991-10-29 US claimed
US-5019483-A Aqueous developable photoresist containing weak alkali soluble or dispersible thiol compounds 501 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 1991-05-28 US claimed
US-4847357-A WEATHERPROOFING, HEAT RESISTANT SEALS TOSHIBA SILICONE CO., LTD. (JP) 1989-07-11 US claimed
US-4587313-A Radiation curable pressure-sensitive adhesive composition HITACHI CHEMICAL COMPANY, LTD. (JP) 1986-05-06 US claimed