SCHEMBL63648

SCHEMBL63648

Cc1ccc(S)cc1S

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29507711 1.00 — —
SCHEMBL8417971 0.97 ALDH1A1 (0.41) —
SCHEMBL1158048 0.97 ALDH1A1 (0.41) —
SCHEMBL91378 0.79 — —
SCHEMBL29767277 0.79 — —
SCHEMBL330857 0.79 — —
SCHEMBL3185677 0.77 ALDH1A1 (0.34) —
SCHEMBL29438518 0.77 — —
SCHEMBL394229 0.77 — —
SCHEMBL7741335 0.77 ALDH1A1 (0.43) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 723 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12187851-B2 Network polymers and methods of making and using same THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE (US) 2025-01-07 — — US claimed
US-12054607-B2 Tough, healable composites displaying stress relaxation at the resin-filler interface THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE (US) 2024-08-06 — — US claimed
US-11726386-B2 Plasmon coupling materials, methods of making plasmon coupling materials, methods of using plasmon coupling materials and systems and devices that include plasmon coupling materials VANDERBILT UNIVERSITY (US) 2023-08-15 — — US claimed
US-20230119934-A1 NETWORK POLYMERS AND METHODS OF MAKING AND USING SAME UNIV COLORADO REGENTS (US) 2023-04-20 — — US claimed
US-20210311370-A1 PLASMON COUPLING MATERIALS, METHODS OF MAKING PLASMON COUPLING MATERIALS, METHODS OF USING PLASMON COUPLING MATERIALS AND SYSTEMS AND DEVICES THAT INCLUDE PLASMON COUPLING MATERIALS VANDERBILT UNIVERSITY 2021-10-07 — — US claimed
US-20210292482-A1 NETWORK POLYMERS AND METHODS OF MAKING AND USING SAME THE REGENTS OF THE UNIV OF COLORADO A BODY CORPORTATE (US) 2021-09-23 — — US claimed
EP-3829307-A1 BISMUTH-THIOL COMPOSITIONS AND METHODS OF USE Microbion Corporation (US) 2021-06-09 — — EP claimed
CN-112804878-A Bismuth-thiol compositions and methods of use 微生物公司 2021-05-14 — — CN claimed
US-20210002469-A1 TOUGH, HEALABLE COMPOSITES DISPLAYING STRESS RELAXATION AT THE RESIN-FILLER INTERFACE NATIONAL INSTITUTES OF HEALTH (NIH), U.S. DEPT. OF HEALTH AND HUMAN SERVICES (DHHS), U.S. GOVERNMENT 2021-01-07 — — US claimed
US-20200046650-A1 BISMUTH-THIOL COMPOSITIONS AND METHODS OF USE MICROBION CORPORATION 2020-02-13 — — US claimed
US-6391286-B1 CURABLE DENTAL COMPOSITION COMPRISING PREFORMED METAL COMPLEX AS FLUORIDE RELEASING MATERIAL 3M INNOVATIVE PROPERTIES COMPANY 2002-05-21 — — US claimed
EP-0803504-B1 The process of producing polythiol oligomer HOYA CORP (JP) 2001-09-19 — — EP claimed
US-5961889-A REACTING 2,5-DIMERCAPTOMETHYL-1,4-DITHIANE (DMMD) WITH SULFUR IN A MOLAR RATIO 2:1 OR 3:2 IN THE PRESENCE OF A BASIC CATALYST HOYA CORPORATION (JP) 1999-10-05 — — US claimed
EP-0803504-A2 The process of producing polythiol oligomer HOYA CORPORATION (JP) 1997-10-29 — — EP claimed
EP-0268896-B1 PROCESS FOR MAKING A HIGH-REFRACTIVITY PLASTIC LENS RESIN MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-02-03 — — EP claimed
US-5093389-A Epoxy-Terminated Polysiloxane, Silanol-Terminated Polysiloxane Aminoxysilicon Compound TOSHIBA SILICONE CO., LTD. (JP) 1992-03-03 — — US claimed
US-5061739-A SEALANTS FOR CONSTRUCTION TOSHIBA SILICONE CO., LTD. (JP) 1991-10-29 — — US claimed
US-5019483-A Aqueous developable photoresist containing weak alkali soluble or dispersible thiol compounds 501 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 1991-05-28 — — US claimed
US-4847357-A WEATHERPROOFING, HEAT RESISTANT SEALS TOSHIBA SILICONE CO., LTD. (JP) 1989-07-11 — — US claimed
US-4587313-A Radiation curable pressure-sensitive adhesive composition HITACHI CHEMICAL COMPANY, LTD. (JP) 1986-05-06 — — US claimed
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