Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.39 |
| ▸ | THRB | P10828 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL322652 | 0.88 | TSHR (0.41) | TSHRALDH1A1THRB | |
| SCHEMBL952948 | 0.88 | TSHR (0.41) | TSHRALDH1A1THRB | |
| SCHEMBL2866951 | 0.86 | TSHR (0.38) | TSHRALDH1A1THRB | |
| SCHEMBL65534 | 0.85 | TSHR (0.42) | TSHRALDH1A1THRB | |
| SCHEMBL538063 | 0.82 | TSHR (0.50) | TSHRALDH1A1THRB | |
| SCHEMBL4207433 | 0.81 | TSHR (0.40) | TSHRALDH1A1THRB | |
| SCHEMBL2028634 | 0.81 | TSHR (0.36) | TSHRALDH1A1 | |
| SCHEMBL9559905 | 0.80 | ALDH1A1 (0.41) | TSHRALDH1A1 | |
| SCHEMBL9560048 | 0.80 | ALDH1A1 (0.41) | TSHRALDH1A1 | |
| SCHEMBL6904341 | 0.80 | TSHR (0.48) | TSHRALDH1A1THRB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 84 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-60053514-A | — | — | None | — | — | JP | disclosed |
| US-12319814-B2 | Polyamideimide resin, resin composition, and semiconductor device | RESONAC CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| EP-4303250-A1 | POLY(AMIDE-IMIDE) RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | Resonac Corporation (JP) | 2024-01-10 | — | — | EP | disclosed |
| EP-4026867-B1 | POLYAMIDEIMIDE RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | RESONAC CORP (JP) | 2023-12-06 | — | — | EP | disclosed |
| EP-3730536-B1 | POLYAMIDE IMIDE RESIN, POLYAMIDE IMIDE RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE USING POLYAMIDE IMIDE RESIN AND POLYAMIDE IMIDE RESIN COMPOSITION | RESONAC CORP (JP) | 2023-09-13 | — | — | EP | disclosed |
| US-20220332947-A1 | POLYAMIDEIMIDE RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2022-10-20 | — | — | US | disclosed |
| WO-2022185718-A1 | POLY(AMIDE-IMIDE) RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-09-09 | — | — | WO | disclosed |
| EP-4026867-A1 | POLYAMIDE IMIDE RESIN, RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | Showa Denko Materials Co., Ltd. (JP) | 2022-07-13 | — | — | EP | disclosed |
| EP-3730536-A1 | POLYAMIDE IMIDE RESIN, POLYAMIDE IMIDE RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE USING POLYAMIDE IMIDE RESIN AND POLYAMIDE IMIDE RESIN COMPOSITION | Hitachi Chemical Company, Ltd. (JP) | 2020-10-28 | — | — | EP | disclosed |
| US-10808150-B2 | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-10-20 | — | — | US | disclosed |
| US-6400492-B1 | Electrophoretic display liquid, and electrophoretic display medium, method and device using the liquid | RICOH COMPANY LIMITED (JP) | 2002-06-04 | — | — | US | disclosed |
| US-20020032250-A1 | Photocuring resin compositions, photocuring sheets and molded article using the same, and processes of production thereof | MITSUBISHI RAYON CO., LTD. (JP) | 2002-03-14 | — | — | US | disclosed |
| EP-1170109-A1 | Photocuring resin compositions, photocuring sheets and molded article using the same and processes of production thereof | Mitsubishi Rayon Co., Ltd. (JP) | 2002-01-09 | — | — | EP | disclosed |
| US-6136886-A | RUBBER | KABUSHIKI KAISHA SHOFU (JP) | 2000-10-24 | — | — | US | disclosed |
| US-6063830-A | SILICA AND URETHANEACRYLATE | KABUSHIKI KAISHA SHOFU (JP) | 2000-05-16 | — | — | US | disclosed |
| EP-0534753-B1 | Composite composition having high transparency and process for producing same | MITSUBISHI RAYON CO (JP) | 1996-12-18 | — | — | EP | disclosed |
| US-5385988-A | A curable blends consisting of an additional polymer and a polysilicates, polysiloxanes or polysilsesquioxanes in a dispersion system of colloidal silica to form rigid, tough interpenetrating polymer networks | MITSUBISHI RAYON CO., LTD. (JP) | 1995-01-31 | — | — | US | disclosed |
| EP-0534753-A1 | Composite composition having high transparency and process for producing same | MITSUBISHI RAYON CO., LTD. (JP) | 1993-03-31 | — | — | EP | disclosed |
| JP-S6053514-A | RESIN COMPOSITION | HITACHI CHEM CO LTD | 1985-03-27 | — | — | JP | disclosed |
| JP-S0653514-A | — | — | 0001-01-01 | — | — | JP | disclosed |