SCHEMBL6427181

SCHEMBL6427181

CCCC[N]n1nnc2ccccc21

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC9A1 P19634 9/20 0.55
CYP4Z1 Q86W10 6/20 0.51
KEAP1 Q14145 1/20 0.44
ASAH1 Q13510 1/20 0.44
NPC1 O15118 1/20 0.43
TP53 P04637 1/20 0.43
RAB9A P51151 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
MGAM O43451 1/20 0.42
AMY1A P0DUB6 1/20 0.42
GAA P10253 1/20 0.42
SI P14410 1/20 0.42
MGAM2 Q2M2H8 1/20 0.42
POLB P06746 1/20 0.41
MAPK1 P28482 1/20 0.41
ATM Q13315 1/20 0.41
ALDH1A1 P00352 1/20 0.41
CYP1A2 P05177 1/20 0.41
CYP3A4 P08684 1/20 0.41
CYP2D6 P10635 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5694968 0.73 SLC9A1 (0.54) SLC9A1CYP4Z1KEAP1NPC1TP53
SCHEMBL15040780 0.72 SLC9A1 (0.53) SLC9A1CYP4Z1KEAP1NPC1TP53
SCHEMBL1834794 0.71 SLC9A1 (1.00) SLC9A1CYP4Z1KEAP1NPC1RAB9A
SCHEMBL2346310 0.70 SLC9A1 (0.97) SLC9A1CYP4Z1KEAP1NPC1RAB9A
SCHEMBL462848 0.70 SLC9A1 (1.00) SLC9A1CYP4Z1NPC1RAB9AMAPT
SCHEMBL19619922 0.70 SLC9A1 (0.50) SLC9A1CYP4Z1KEAP1NPC1TP53
SCHEMBL13604205 0.69 SLC9A1 (0.50) SLC9A1CYP4Z1KEAP1NPC1TP53
SCHEMBL535676 0.69 SLC9A1 (1.00) SLC9A1CYP4Z1NPC1RAB9AMAPT
SCHEMBL461412 0.69 SLC9A1 (1.00) SLC9A1CYP4Z1NPC1RAB9AMAPT
SCHEMBL8633983 0.69 SLC9A1 (1.00) SLC9A1CYP4Z1NPC1RAB9AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20050205522-A1 Chemical agent additives in copper CMP slurry CHARTERED SEMICONDUCTOR MANUFACTURING LTD. 2005-09-22 US claimed
US-20050205522-A1 Chemical agent additives in copper CMP slurry CHARTERED SEMICONDUCTOR MANUFACTURING LTD. 2005-09-22 US disclosed