Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 8/20 | 0.54 |
| ▸ | TSHR | P16473 | 5/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.40 |
| ▸ | TP53 | P04637 | 4/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.33 |
| ▸ | MAPT | P10636 | 2/20 | 0.32 |
| ▸ | HPGD | P15428 | 2/20 | 0.32 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | PPARG | P37231 | 1/20 | 0.32 |
| ▸ | GLA | P06280 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3124072 | 0.87 | ALDH1A1 (0.47) | ALDH1A1TSHRMAPK1TP53CYP3A4 | |
| SCHEMBL23256373 | 0.86 | TSHR (0.52) | ALDH1A1TSHRMAPK1TP53CYP3A4 | |
| SCHEMBL480723 | 0.84 | ALDH1A1 (0.44) | ALDH1A1TSHRMAPK1TP53CYP3A4 | |
| Bicarbonate SCHEMBL19178452 | 0.78 | ALDH1A1 (0.39) | ALDH1A1TSHRMAPK1TP53CYP3A4 | |
| SCHEMBL1192277 | 0.77 | ALDH1A1 (0.61) | ALDH1A1TSHRMAPK1TP53CYP3A4 | |
| SCHEMBL13898344 | 0.75 | ALDH1A1 (0.58) | ALDH1A1TSHRMAPK1TP53CYP3A4 | |
| SCHEMBL19971982 | 0.74 | ALDH1A1 (0.47) | ALDH1A1TSHRMAPK1TP53CYP3A4 | |
| SCHEMBL11322842 | 0.74 | ALDH1A1 (0.47) | ALDH1A1TSHRMAPK1TP53CYP3A4 | |
| SCHEMBL15256784 | 0.74 | ALDH1A1 (0.64) | ALDH1A1TSHRMAPK1TP53CYP3A4 | |
| SCHEMBL5598818 | 0.73 | ALDH1A1 (0.45) | ALDH1A1TSHRMAPK1TP53CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230350293-A1 | I-LINE NEGATIVE PHOTORESIST COMPOSITION FOR REDUCING HEIGHT DIFFERENCE BETWEEN CENTER AND EDGE AND REDUCING LER, AND I-LINE NEGATIVE PHOTORESIST COMPOSITION FOR IMPROVING PROCESS MARGIN | YOUNG CHANG CHEMICAL CO., LTD (KR) | 2023-11-02 | — | — | US | claimed |
| EP-4220301-A1 | I-LINE NEGATIVE PHOTORESIST COMPOSITION FOR REDUCING HEIGHT DIFFERENCE BETWEEN CENTER AND EDGE AND REDUCING LER, AND I-LINE NEGATIVE PHOTORESIST COMPOSITION FOR IMPROVING PROCESS MARGIN | Young Chang Chemical Co., Ltd. (KR) | 2023-08-02 | — | — | EP | claimed |
| CN-109154776-A | Chemical amplifying type negative photoresist composition | 荣昌化学制品株式会社 | 2019-01-04 | — | — | CN | claimed |
| CN-107924124-A | Negative photoresist composition for I-line with excellent etching resistance | 荣昌化学制品株式会社 | 2018-04-17 | — | — | CN | claimed |
| CN-107850841-A | Negative photoresist composition for KrF laser for forming semiconductor pattern | 荣昌化学制品株式会社 | 2018-03-27 | — | — | CN | claimed |
| US-6969919-B2 | Semiconductor package production method and semiconductor package | TEXAS INSTRUMENTS INCORPORATED (US) | 2005-11-29 | — | — | US | claimed |
| US-20050003577-A1 | Semiconductor package production method and semiconductor package | YAJIMA KIYOSHI (JP) | 2005-01-06 | — | — | US | claimed |
| US-6774496-B2 | Semiconductor package with a thermoset bond | TEXAS INSTRUMENTS INCORPORATED | 2004-08-10 | — | — | US | claimed |
| US-6716674-B2 | Method of forming a semiconductor package | TEXAS INSTRUMENTS INCORPORATED | 2004-04-06 | — | — | US | claimed |
| US-20230350293-A1 | I-LINE NEGATIVE PHOTORESIST COMPOSITION FOR REDUCING HEIGHT DIFFERENCE BETWEEN CENTER AND EDGE AND REDUCING LER, AND I-LINE NEGATIVE PHOTORESIST COMPOSITION FOR IMPROVING PROCESS MARGIN | YOUNG CHANG CHEMICAL CO., LTD (KR) | 2023-11-02 | — | — | US | disclosed |
| EP-4220301-A1 | I-LINE NEGATIVE PHOTORESIST COMPOSITION FOR REDUCING HEIGHT DIFFERENCE BETWEEN CENTER AND EDGE AND REDUCING LER, AND I-LINE NEGATIVE PHOTORESIST COMPOSITION FOR IMPROVING PROCESS MARGIN | Young Chang Chemical Co., Ltd. (KR) | 2023-08-02 | — | — | EP | disclosed |
| CN-109154776-A | Chemical amplifying type negative photoresist composition | 荣昌化学制品株式会社 | 2019-01-04 | — | — | CN | disclosed |
| CN-109073973-A | KrF laser negative photoresist composition with high-resolution and high aspect ratio | 荣昌化学制品株式会社 | 2018-12-21 | — | — | CN | disclosed |
| CN-107924124-A | Negative photoresist composition for I-line with excellent etching resistance | 荣昌化学制品株式会社 | 2018-04-17 | — | — | CN | disclosed |
| US-6969919-B2 | Semiconductor package production method and semiconductor package | TEXAS INSTRUMENTS INCORPORATED (US) | 2005-11-29 | — | — | US | disclosed |
| US-20050003577-A1 | Semiconductor package production method and semiconductor package | YAJIMA KIYOSHI (JP) | 2005-01-06 | — | — | US | disclosed |
| US-6774496-B2 | Semiconductor package with a thermoset bond | TEXAS INSTRUMENTS INCORPORATED | 2004-08-10 | — | — | US | disclosed |
| US-6716674-B2 | Method of forming a semiconductor package | TEXAS INSTRUMENTS INCORPORATED | 2004-04-06 | — | — | US | disclosed |
| US-20030153121-A1 | Semiconductor package production method and semiconductor package | TEXAS INSTRUMENTS INCORPORATED (US) | 2003-08-14 | — | — | US | disclosed |
| US-20030049883-A1 | Semiconductor package production method and semiconductor package | TEXAS INSTRUMENTS INCORPORATED | 2003-03-13 | — | — | US | disclosed |