SCHEMBL6433976

SCHEMBL6433976

CO[Si](C)(OC)c1ccc(Br)cc1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP2A6 P11509 1/20 0.40
ALDH1A1 P00352 3/20 0.38
RAB9A P51151 4/20 0.33
MAPT P10636 3/20 0.33
RXFP1 Q9HBX9 3/20 0.33
HPGD P15428 3/20 0.33
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
NPSR1 Q6W5P4 2/20 0.33
MAPK1 P28482 2/20 0.33
TP53 P04637 2/20 0.33
LMNA P02545 1/20 0.33
ALOX15 P16050 2/20 0.32
GSK3B P49841 1/20 0.31
HSD17B10 Q99714 2/20 0.31
NPC1 O15118 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
KDM4E B2RXH2 1/20 0.31
CYP1A2 P05177 1/20 0.31
CYP2D6 P10635 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL397346 0.87 CA12 (0.30)
SCHEMBL17937757 0.80 CYP2A6 (0.40) CYP2A6ALDH1A1RAB9AMAPTRXFP1
SCHEMBL5421307 0.79
SCHEMBL6436993 0.79 ESR2 (0.32) KDM4E
SCHEMBL5421236 0.79
SCHEMBL10539487 0.78 CYP2A6 (0.38) CYP2A6ALDH1A1MAPK1ALOX15IDO1
SCHEMBL1115633 0.77 CYP2A6 (0.42) CYP2A6ALDH1A1RAB9AMAPTRXFP1
SCHEMBL5421459 0.77
SCHEMBL16062866 0.77
SCHEMBL384790 0.77 ACHE (0.42) ALDH1A1RAB9AMAPTHPGDMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105555901-A Polishing composition FUJIMI INC 2016-05-04 CN disclosed
EP-1276807-B1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS DOW CORNING (US) 2005-10-12 EP disclosed
US-6780471-B2 USING CROSSLINKER WITH NONFLEXIBLE LINKAGE INCLUDING AT LEAST ONE P-ARYLENE MOIETY FOR SPATIAL SEPARATION; FLEXURAL STRENGTH, FRACTURE TOUGHNESS, MODULUS AND/OR MECHANICAL DAMPING DOW CORNING CORPORATION 2004-08-24 US disclosed
US-20030130389-A1 Curable silicone resin composition and reactive silicon compounds DOW CORNING LIMITED (GB) 2003-07-10 US disclosed
EP-1276807-A1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS Dow Corning Corporation (US) 2003-01-22 EP disclosed
WO-2001083608-A1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS DOW CORNING CORPORATION (US) 2001-11-08 WO disclosed