SCHEMBL6436040

SCHEMBL6436040

CO[Si](C)(OC)c1ccc(/C=C/c2ccc([Si](C)(OC)OC)cc2)cc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 4/20 0.42
KDM4E B2RXH2 3/20 0.42
HPGD P15428 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
CYP3A4 P08684 2/20 0.42
NPC1 O15118 1/20 0.42
CYP2D6 P10635 1/20 0.42
CYP2C9 P11712 1/20 0.42
CYP2C19 P33261 1/20 0.42
RAB9A P51151 1/20 0.42
TRPA1 O75762 1/20 0.40
RELA Q04206 1/20 0.40
MAPT P10636 2/20 0.39
CYP1A1 P04798 4/20 0.39
CYP1B1 Q16678 4/20 0.39
ESR1 P03372 2/20 0.39
PTGS2 P35354 2/20 0.39
NQO2 P16083 2/20 0.39
AHR P35869 2/20 0.39
ABL1 P00519 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6434123 1.00 CYP1A2 (0.42) CYP1A2KDM4EHPGDSMN1; SMN2CYP3A4
SCHEMBL397346 0.84 CA12 (0.30)
SCHEMBL1448787 0.82 ALDH1A1 (0.48) TRPA1ALDH1A1TP53TSHR
SCHEMBL3350857 0.78 CYP1A2 (0.43) CYP1A2KDM4EHPGDSMN1; SMN2CYP3A4
SCHEMBL3350851 0.78 CYP1A2 (0.43) CYP1A2KDM4EHPGDSMN1; SMN2CYP3A4
SCHEMBL5421236 0.77
SCHEMBL6436993 0.77 ESR2 (0.32) KDM4E
SCHEMBL5421307 0.77
SCHEMBL5421459 0.75
SCHEMBL16062866 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1276807-B1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS DOW CORNING (US) 2005-10-12 EP disclosed
US-6780471-B2 USING CROSSLINKER WITH NONFLEXIBLE LINKAGE INCLUDING AT LEAST ONE P-ARYLENE MOIETY FOR SPATIAL SEPARATION; FLEXURAL STRENGTH, FRACTURE TOUGHNESS, MODULUS AND/OR MECHANICAL DAMPING DOW CORNING CORPORATION 2004-08-24 US disclosed
US-20030130389-A1 Curable silicone resin composition and reactive silicon compounds DOW CORNING LIMITED (GB) 2003-07-10 US disclosed