SCHEMBL6437435

SCHEMBL6437435

[CH2]COC(CC)CCCCCCC

nearest known ligand 0.41

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.38
DNM1 Q05193 3/20 0.38
TSHR P16473 1/20 0.36
THRB P10828 1/20 0.36
OPRM1 P35372 1/20 0.36
SMPD1 P17405 3/20 0.35
GPR84 Q9NQS5 3/20 0.34
FDPS P14324 3/20 0.34
SPHK1 Q9NYA1 1/20 0.34
FFAR1 O14842 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6437566 1.00 LMNA (0.38) LMNADNM1TSHRTHRBOPRM1
SCHEMBL6435200 1.00 LMNA (0.38) LMNADNM1TSHRTHRBOPRM1
SCHEMBL6434337 1.00 LMNA (0.38) LMNADNM1TSHRTHRBOPRM1
SCHEMBL6434456 1.00 LMNA (0.38) LMNADNM1TSHRTHRBOPRM1
SCHEMBL4870171 0.98 OPRM1 (0.37) LMNADNM1TSHRTHRBOPRM1
SCHEMBL6751915 0.91 LMNA (0.41) LMNADNM1TSHRTHRBOPRM1
SCHEMBL6433513 0.91 LMNA (0.41) LMNADNM1TSHRTHRBOPRM1
SCHEMBL18688671 0.91 LMNA (0.41) LMNADNM1TSHRTHRBOPRM1
SCHEMBL5819882 0.91 LMNA (0.41) LMNADNM1TSHRTHRBOPRM1
SCHEMBL6432976 0.88 DNM1 (0.44) LMNADNM1TSHRTHRBOPRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020196362-A1 MULTILAYER BODY, COMPOSITION, AND KIT FOR FORMING MULTILAYER BODY 富士フイルム株式会社 2020-10-01 WO disclosed
WO-2020195995-A1 MULTILAYER BODY, COMPOSITION, AND KIT FOR FORMING MULTILAYER BODY 富士フイルム株式会社 2020-10-01 WO disclosed
WO-2019163859-A1 PHOTOSENSITIVE LAYER, LAMINATE, PHOTOSENSITIVE RESIN COMPOSITION, KIT, AND PRODUCTION METHOD FOR PHOTOSENSITIVE RESIN COMPOSITION 富士フイルム株式会社 2019-08-29 WO disclosed
EP-1172400-B1 THERMOPLASTIC RESIN FILM WITH SATISFACTORY PRINTABILITY YUPO CORP (JP) 2005-12-28 EP disclosed
US-6586106-B2 Ink transfer, adhesion and aging stability, and being satisfactory in back ghost when offset printing using oxidation polymerization type ink is performed on both faces YUPO CORPORATION (JP) 2003-07-01 US disclosed
US-20020054991-A1 Thermoplastic resin film satisfactory in printability YUPO CORPORATION (JP) 2002-05-09 US disclosed
EP-1172400-A1 THERMOPLASTIC RESIN FILM WITH SATISFACTORY PRINTABILITY Yupo Corporation (JP) 2002-01-16 EP disclosed