SCHEMBL6462217

SCHEMBL6462217

OP(O)OCCCCCCCCCCc1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
SIGMAR1 Q99720 3/20 0.50
MAPT P10636 1/20 0.48
RXFP1 Q9HBX9 1/20 0.48
IDO1 P14902 1/20 0.47
FFAR1 O14842 1/20 0.46
HDAC1 Q13547 1/20 0.46
S1PR1 P21453 2/20 0.46
S1PR3 Q99500 1/20 0.46
S1PR5 Q9H228 1/20 0.46
MAOA P21397 1/20 0.45
TDP1 Q9NUW8 1/20 0.45
L3MBTL1 Q9Y468 1/20 0.45
LMNA P02545 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6743777 1.00 SIGMAR1 (0.50) SIGMAR1MAPTRXFP1IDO1FFAR1
SCHEMBL29036387 1.00 SIGMAR1 (0.50) SIGMAR1MAPTRXFP1IDO1FFAR1
SCHEMBL6561009 1.00 SIGMAR1 (0.50) SIGMAR1MAPTRXFP1IDO1FFAR1
SCHEMBL11880603 1.00 SIGMAR1 (0.50) SIGMAR1MAPTRXFP1IDO1FFAR1
SCHEMBL7107595 1.00 SIGMAR1 (0.50) SIGMAR1MAPTRXFP1IDO1FFAR1
SCHEMBL7341046 0.98 IDO1 (0.48) SIGMAR1MAPTRXFP1IDO1FFAR1
SCHEMBL11277519 0.92 IDO1 (0.55) SIGMAR1IDO1FFAR1HDAC1MAOA
SCHEMBL11255629 0.84 SIGMAR1 (0.53) SIGMAR1MAPTRXFP1IDO1MAOA
SCHEMBL11248744 0.84 SIGMAR1 (0.53) SIGMAR1MAPTRXFP1IDO1MAOA
SCHEMBL2129084 0.84 TDP1 (0.46) IDO1FFAR1TDP1L3MBTL1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3315301-B1 WAFER LAMINATE, METHOD FOR PRODUCTION THEREOF, AND ADHESIVE COMPOSITION FOR WAFER LAMINATE SHINETSU CHEMICAL CO (JP) 2024-08-07 EP disclosed
US-10658314-B2 Wafer laminate, method for production thereof, and adhesive composition for wafer laminate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-05-19 US disclosed
EP-3315301-A1 WAFER LAMINATE, METHOD FOR PRODUCTION THEREOF, AND ADHESIVE COMPOSITION FOR WAFER LAMINATE Shin-Etsu Chemical Co., Ltd. (JP) 2018-05-02 EP disclosed
US-20180102333-A1 WAFER LAMINATE, METHOD FOR PRODUCTION THEREOF, AND ADHESIVE COMPOSITION FOR WAFER LAMINATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-04-12 US disclosed
US-6887926-B1 Bonding compositions for chlorinated polymers and methods of using the same OATEY CO. (US) 2005-05-03 US disclosed
US-6790914-B2 TRANSPARENT (CROSSLINKED) RESIN FILM CAN BE USED AS A POLARIZING FILM, SURFACE PROTECTIVE FILM, RETARDATION FILM, TRANSPARENT CONDUCTIVE FILM, LIGHT DIFFUSION FILM, FILM FOR AN EL DISPLAY DEVICE, TRANSPARENT CONDUCTIVE COMPOSITE MATERIAL, JSR CORPORATION (JP) 2004-09-14 US disclosed
US-20040106740-A1 Resin film and applications thereof JSR CORPORATION (JP) 2004-06-03 US disclosed
EP-1195397-B1 Composition of cyclic olefin addition copolymer and cross-linked material JSR CORP (JP) 2004-04-14 EP disclosed
US-20020042461-A1 Composition of cyclic olefin addition copolymer and cross-linked material JSR CORPORATION (JP) 2002-04-11 US disclosed
EP-1195397-A1 Composition of cyclic olefin addition copolymer and cross-linked material JSR Corporation (JP) 2002-04-10 EP disclosed
US-4178282-A ALKALI OR ALKALINE EARTH METAL SOAPS OR PHENOLATES OR ZINC HALIDES IN ALCOHOLS OR ORGANOPHOSPHITES CLAREMONT POLYCHEMICAL CORPORATION (US) 1979-12-11 US disclosed
US-3969306-A POLYBUTADIENE GENERAL ELECTRIC COMPANY (US) 1976-07-13 US disclosed
US-3943081-A ALKALINE EARTH METAL SOAP OR PHENOLATE, ZINC CHLORIDE, HYDROXY COMPOUND, ORGANOPHOSPHITE CLAREMONT POLYCHEMICAL CORPORATION (US) 1976-03-09 US disclosed