SCHEMBL64661

SCHEMBL64661

C=COCC(COC=C)(COC=C)COC=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13708124 0.91
SCHEMBL17483284 0.88
Oxirane SCHEMBL1956861 0.86
SCHEMBL63256 0.82 THRB (0.39)
SCHEMBL296631 0.82 ALDH1A1 (0.43)
SCHEMBL65264 0.82 ALDH1A1 (0.48)
SCHEMBL271312 0.82 ALDH1A1 (0.43)
SCHEMBL13998559 0.82
SCHEMBL23930414 0.80 ALDH1A1 (0.42)
SCHEMBL17126851 0.80 THRB (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2883 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4182375-B1 RELEASABLE COMPOSITIONS BASED ON POLYACETALS DELO INDUSTRIE KLEBSTOFFE GMBH & CO KGAA (DE) 2026-05-20 EP claimed
US-12565560-B2 Releasable compositions based on polyacetals DELO INDUSTRIE KLEBSTOFFE GMBH & CO. KGAA (DE) 2026-03-03 US claimed
US-20240254278-A1 RELEASABLE COMPOSITIONS BASED ON POLYACETALS DELO INDUSTRIE KLEBSTOFFE GMBH & CO. KGAA (DE) 2024-08-01 US claimed
CN-110515270-B Photosensitive resin composition, pattern forming method, and method for manufacturing optical semiconductor device 信越化学工业株式会社 2024-07-12 CN claimed
EP-4377373-A1 CURABLE, ONE-PART, DUAL-STAGE THIOL-ENE-EPOXY LIQUID ADHESIVES AND METHODS 3M Innovative Properties Company (US) 2024-06-05 EP claimed
CN-117813335-A Curable one-part two-stage thiol-ene-epoxy liquid adhesives and methods 3M创新有限公司 2024-04-02 CN claimed
EP-4321561-A1 PREPARATION METHOD OF SUPER ABSORBENT POLYMER AND SUPER ABSORBENT POLYMER LG Chem, Ltd. (KR) 2024-02-14 EP claimed
CN-117321120-A Method for producing superabsorbent polymer and superabsorbent polymer 株式会社LG化学 2023-12-29 CN claimed
US-20230242842-A1 TREATMENT COMPOSITIONS PROCTER & GAMBLE (US) 2023-08-03 US claimed
US-11693317-B2 Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-07-04 US claimed
US-7605209-B2 Coating compositions containing reactive diluents and methods VALSPAR SOURCING, INC. (US) 2009-10-20 US claimed
US-20080171807-A1 Two-component reaction resin and method of fastening using the resin HILTI AKTIENGESELLSCHAFT (LI) 2008-07-17 US claimed
US-6921454-B2 Elastomer toughened radiation curable adhesives HENKEL CORPORATION (US) 2005-07-26 US claimed
US-6916890-B1 Thermally reworkable epoxy resins and compositions based thereon HENKEL CORPORATION (US) 2005-07-12 US claimed
WO-2003031492-A1 THERMALLY REWORKABLE EPOXY RESINS AND COMPOSITIONS BASED THEREO N HENKEL CORPORATION (US) 2003-04-17 WO claimed
WO-1999064484-A1 POLYMERIZATION OF VINYL ETHERS MOLTECH CORPORATION (US) 1999-12-16 WO claimed
US-5939235-A PHOTOSENSITIVE CURING AGENTS HAVING AT LEAST TWO ENOL ETHER GROUPS; PERMITING THE USE OF LIGHT RAYS EXTENDING OVER A WIDE RANGE OF WAVELENGTH, PROVIDING CLEAR POSITIVE IMAGES AND A WIDE DEVELOPMENT LATITUDE FUJI PHOTO FILM CO., LTD. (JP) 1999-08-17 US claimed
US-5369164-A Adhesives BASF AKTIENGESELLSCHAFT (DE) 1994-11-29 US claimed
US-5364738-A Divinyl ethers, solubility in developers FUJI PHOTO FILM CO., LTD. (JP) 1994-11-15 US claimed
US-3933509-A Photo-polymerizable composition containing an acid salt of an indolinobenzospiropyran FUJI PHOTO FILM CO., LTD. (JA) 1976-01-20 US claimed