SCHEMBL647523

SCHEMBL647523

CCCCOCc1ccc(COCCCC)cc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 3/20 0.49
TDP1 Q9NUW8 2/20 0.49
TSHR P16473 3/20 0.42
LTA4H P09960 1/20 0.42
NR5A1 Q13285 1/20 0.42
PLA2G4B P0C869 1/20 0.42
NAAA Q02083 2/20 0.41
ALDH1A1 P00352 2/20 0.41
CYP3A4 P08684 2/20 0.41
MAPK1 P28482 1/20 0.41
ESR1 P03372 2/20 0.40
ADRA2A P08913 2/20 0.40
ADORA3 P0DMS8 2/20 0.40
TACR2 P21452 2/20 0.40
SLC6A2 P23975 2/20 0.40
SLC6A4 P31645 2/20 0.40
SLC6A3 Q01959 2/20 0.40
KDM4E B2RXH2 1/20 0.40
LMNA P02545 1/20 0.40
SHBG P04278 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL196575 0.93 NAAA (0.47) L3MBTL1TDP1PLA2G4BNAAACYP3A4
SCHEMBL9750481 0.93 L3MBTL1 (0.45) L3MBTL1TDP1TSHRLTA4HNR5A1
SCHEMBL9073374 0.91 AGXT (0.48) L3MBTL1TDP1PLA2G4B
SCHEMBL1839898 0.91 LTA4H (0.55) L3MBTL1TDP1TSHRLTA4HNR5A1
SCHEMBL509255 0.89 IDO1 (0.47) L3MBTL1TDP1TSHRALDH1A1CYP3A4
SCHEMBL9517762 0.89 TDP1 (0.42) L3MBTL1TDP1TSHRPLA2G4BALDH1A1
SCHEMBL197178 0.89 KCNH2 (0.50) L3MBTL1TDP1ALDH1A1KDM4E
SCHEMBL509685 0.89 L3MBTL1 (0.42) L3MBTL1TDP1TSHRLTA4HNR5A1
SCHEMBL11800474 0.89 L3MBTL1 (0.42) L3MBTL1TDP1TSHRLTA4HNR5A1
SCHEMBL511274 0.89 MAOB (0.46) L3MBTL1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022255321-A1 INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 昭和電工マテリアルズ株式会社 2022-12-08 WO disclosed
WO-2022255322-A1 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM 昭和電工マテリアルズ株式会社 2022-12-08 WO disclosed
US-20220216114-A1 METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2022-07-07 US disclosed
US-20140332984-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL CO LTD (JP) 2014-11-13 US disclosed
US-8200059-B2 Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-06-12 US disclosed
US-20120080808-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE INADA TEIICHI (JP) 2012-04-05 US disclosed
US-8119737-B2 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-02-21 US disclosed
US-8053378-B2 Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition MITSUI CHEMICALS, INC. (JP) 2011-11-08 US disclosed
US-20110187006-A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE INADA TEIICHI 2011-08-04 US disclosed
US-7947779-B2 Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-05-24 US disclosed
EP-0233450-B1 LINEAR SALICYLIC ACID COPOLYMERS AND THEIR METAL SALTS, PRODUCTION PROCESS THEREOF, COLOR-DEVELOPING AGENTS COMPRISING METAL-RESINS OF THE COPOLYMERS, AND COLOR-DEVELOPING SHEETS EMPLOYING THE AGENTS MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-03-11 EP disclosed
US-5051494-A A bismaleimide and an amino resin MITSUI TOATSU CHEMICALS, INC. (JP) 1991-09-24 US disclosed
US-4966961-A REACTING AROMATIC AMINE/POLYAMINE WITH MALEIC ANHYDRIDE; HEAT RESISTANCE COMPOSITES, THERMOSETTING RESINS MITSUI TOATSU CHEMICALS, INC. (JP) 1990-10-30 US disclosed
US-4959443-A HIGH STRENGTH, REACTION OF ARALKYL ALCOHOL AND AROMATIC AMINE MITSUI TOATSU CHEMICALS, INC. (JP) 1990-09-25 US disclosed
US-4937318-A Aromatic amine resins MITSUI TOATSU CHEMICALS, INC. (JP) 1990-06-26 US disclosed
EP-0342989-A2 Polymaleimide compounds and process for the preparation thereof MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-23 EP disclosed
EP-0342943-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-23 EP disclosed
EP-0311387-A2 Aromatic amine resins, their production process and thermosetting resin compositions making use of the same MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-04-12 EP disclosed
US-4783521-A Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1988-11-08 US disclosed
EP-0233450-A2 Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers, and color-developing sheets employing the agents MITSUI TOATSU CHEMICALS, Inc. (JP) 1987-08-26 EP disclosed