SCHEMBL648680

SCHEMBL648680

CCO[Si](C)(OCC)[Si](OCC)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5672630 0.84
SCHEMBL648046 0.82
SCHEMBL249241 0.79
SCHEMBL646648 0.78 CA1 (0.30)
SCHEMBL249445 0.76
SCHEMBL248851 0.73
SCHEMBL647684 0.73
SCHEMBL10887830 0.72
SCHEMBL26667621 0.71
SCHEMBL26667651 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 215 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8298965-B2 Volatile precursors for deposition of C-linked SiCOH dielectrics AMERICAN AIR LIQUIDE, INC. (US) 2012-10-30 US claimed
US-8026035-B2 Organosilicon polymer containing chromogen; antireflactivity coating for lithography CHEIL INDUSTRIES, INC. (KR) 2011-09-27 US claimed
EP-1756123-B1 PROCESS FOR MAKING HALOORGANOALKOXYSILANES MOMENTIVE PERFORMANCE MAT INC (US) 2010-07-28 EP claimed
US-20100052115-A1 Volatile Precursors for Deposition of C-Linked SiCOH Dielectrics AMERICAN AIR LIQUIDE, INC. (US) 2010-03-04 US claimed
US-20080241748-A1 Etch-resistant disilane and saturated hydrocarbon bridged silicon-containing polymers, method of making the same, and method of using the same CHEIL INDUSTRIES, INC. (KR) 2008-10-02 US claimed
EP-1756123-A1 PROCESS FOR MAKING HALOORGANOALKOXYSILANES GENERAL ELECTRIC COMPANY (US) 2007-02-28 EP claimed
WO-2005118598-A1 PROCESS FOR MAKING HALOORGANOALKOXYSILANES GENERAL ELECTRIC COMPANY (US) 2005-12-15 WO claimed
US-6872845-B2 Process for making haloorganoalkoxysilanes GENERAL ELECTRIC COMPANY (US) 2005-03-29 US claimed
US-20040176627-A1 Process for making haloorganoalkoxysilanes CROMPTON CORPORATION 2004-09-09 US claimed
US-20040092759-A1 Process for making haloalkylalkoxysilanes MOMENTIVE PERFORMANCE MATERIALS INC. 2004-05-13 US claimed
US-12346026-B2 Composition for forming underlayer film, resist pattern forming method, and manufacturing method of electronic device FUJIFILM CORPORATION (JP) 2025-07-01 US disclosed
US-20220252985-A1 COMPOSITION FOR FORMING UNDERLAYER FILM, RESIST PATTERN FORMING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2022-08-11 US disclosed
CN-114269567-A Polymer composition, crosslinked polymer, and tire JSR株式会社 2022-04-01 CN disclosed
EP-1520891-B1 FILM FORMING COMPOSITION, PROCESS FOR PRODUCING FILM FORMING COMPOSITION, INSULATING FILM FORMING MATERIAL, PROCESS FOR FORMING FILM, AND SILICA-BASED FILM JSR CORP (JP) 2019-05-01 EP disclosed
US-10025188-B2 Resist pattern-forming method JSR CORPORATION (JP) 2018-07-17 US disclosed
EP-1045290-A2 Composition for resist underlayer film and method for producing the same JSR Corporation (JP) 2000-10-18 EP disclosed
US-5250646-A Reacting disilane with organometallic compound WACKER-CHEMIE GMBH (DE) 1993-10-05 US disclosed
US-5166287-A Reaction of a disilane to form polysiloxanes WACKER-CHEMIE GMBH (DE) 1992-11-24 US disclosed
EP-0486946-A2 Process for the production of metallopolysilanes and their use Wacker-Chemie GmbH (DE) 1992-05-27 EP disclosed
EP-0463624-A2 Process for preparing organopolysilanes WACKER-CHEMIE GMBH (DE) 1992-01-02 EP disclosed