SCHEMBL649001

SCHEMBL649001

CCCOP(=O)(CCC)Oc1ccccc1

nearest known ligand 0.67

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.51
KMT2A Q03164 3/20 0.51
L3MBTL1 Q9Y468 3/20 0.46
PKM P14618 1/20 0.42
BTN3A1 O00481 1/20 0.41
SRC P12931 1/20 0.41
TDP1 Q9NUW8 1/20 0.40
LMNA P02545 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4454035 0.87 L3MBTL1 (0.53) MEN1KMT2AL3MBTL1BTN3A1SRC
SCHEMBL1296793 0.83 LTA4H (0.46)
SCHEMBL10943159 0.82 CETP (0.47)
SCHEMBL1295865 0.81 CETP (0.49)
SCHEMBL11490141 0.81 CETP (0.49)
SCHEMBL9260428 0.81 CETP (0.49)
SCHEMBL11818653 0.81 CETP (0.49)
SCHEMBL1726270 0.80 MEN1 (0.56) MEN1KMT2AL3MBTL1PKMSRC
SCHEMBL1726069 0.80 MEN1 (0.56) MEN1KMT2AL3MBTL1PKMSRC
SCHEMBL5945293 0.78 CCNT1 (0.48) MEN1KMT2AL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12583966-B2 Curable resin, cured product thereof, resin composition, and method for producing curable resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-03-24 US disclosed
US-20250163213-A1 CURABLE RESIN, CURED PRODUCT THEREOF, AND RESIN COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-05-22 US disclosed
US-20250136755-A1 CURABLE RESIN, CURED PRODUCT THEREOF, RESIN COMPOSITION, AND METHOD FOR PRODUCING CURABLE RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-05-01 US disclosed
EP-4480985-A1 CURABLE RESIN, CURED PRODUCT THEREOF, RESIN COMPOSITION, AND PRODUCTION METHOD FOR CURABLE RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-12-25 EP disclosed
EP-4480986-A1 CURABLE RESIN, CURED PRODUCT OF SAME, AND RESIN COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-12-25 EP disclosed
EP-3604440-B1 POLYCARBONATE RESIN COMPOSITION AND OPTICAL LENS USING SAME MITSUBISHI GAS CHEMICAL CO (JP) 2022-10-26 EP disclosed
WO-2022164084-A1 POLYCARBONATE AND METHOD FOR PREPARING SAME 주식회사 엘지화학 2022-08-04 WO disclosed
WO-2022164074-A1 POLYCARBONATE, AND METHOD FOR PREPARING SAME 주식회사 엘지화학 2022-08-04 WO disclosed
WO-2022164072-A1 POLYCARBONATE AND METHOD FOR PREPARING SAME 주식회사 엘지화학 2022-08-04 WO disclosed
US-10913848-B2 Polycarbonate resin composition and optical lens using same MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-02-09 US disclosed
CN-100549092-C Flame retardant epoxy prepregs, laminates, and printed wiring boards with enhanced thermal stability ALBEMARLE CORP (US) 2009-10-14 CN disclosed
US-20090186208-A1 LIGHT DIFFUSING RESIN COMPOSITION AND LIGHT DIFFUSING PLATE USING THE SAME IDEMITSU KOSAN CO., LTD. (JP) 2009-07-23 US disclosed
US-20090185363-A1 POLYCARBONATE RESIN COMPOSITION, OPTICAL MOLDED BODY USING THE SAME, AND ILLUMINATION UNIT IDEMITSU KOSAN CO., LTD. (JP) 2009-07-23 US disclosed
EP-2067809-A1 POLYCARBONATE AND METHOD FOR PRODUCING THE SAME Teijin Chemicals, Ltd. (JP) 2009-06-10 EP disclosed
US-7244804-B2 Having excellent light resistance, heat resistance and color stability, prepared from a 9,9-bis(4-hydroxyphenyl)fluorene and a bisphenol; may contain a benzoxazine ultraviolet absorber TEIJIN CHEMICALS, LTD. (JP) 2007-07-17 US disclosed
CN-1871300-A Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability ALBEMARLE CORP (US) 2006-11-29 CN disclosed
US-20050250930-A1 Polycarbonate copolymer, resin composition, and molded article TEIJIN CHEMICALS LTD. (JP) 2005-11-10 US disclosed
EP-1566396-A1 POLYCARBONATE COPOLYMER, RESIN COMPOSITION, AND MOLDED ARTICLE Teijin Chemicals, Ltd. (JP) 2005-08-24 EP disclosed
US-6110341-A AN AQUEOUS MEDIUM COMPRISING AN ACTIVE HYDROGEN GROUP-CONTAINING CATIONIC ELECTRODEPOSITABLE RESIN AND A CURING AGENT WITH LEAD-FREE; CORROSION-RESIST PROTECTIVE COATINGS FOR TREATING STEEL PPG INDUSTRIES OHIO, INC. (US) 2000-08-29 US disclosed
WO-2000023529-A1 ELECTRODEPOSITION BATHS CONTAINING ORGANIC PHOSPHOROUS-BASED COMPOUNDS PPG INDUSTRIES OHIO, INC. (US) 2000-04-27 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12583966-B2 Curable resin, cured product thereof, resin composition, and method for producing curable resin ARL1, ASH2L, SEM1 MEN1 4102/4885KMT2A 1098/4885L3MBTL1 1078/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.