Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.47 |
| ▸ | CYP1A2 | P05177 | 4/20 | 0.47 |
| ▸ | CYP2C19 | P33261 | 3/20 | 0.47 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.47 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.44 |
| ▸ | HPGD | P15428 | 3/20 | 0.42 |
| ▸ | HTT | P42858 | 1/20 | 0.42 |
| ▸ | ACP3 | P15309 | 1/20 | 0.42 |
| ▸ | MAOB | P27338 | 1/20 | 0.41 |
| ▸ | SIGMAR1 | Q99720 | 2/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.41 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.41 |
| ▸ | CTNNB1 | P35222 | 1/20 | 0.40 |
| ▸ | FFAR1 | O14842 | 1/20 | 0.40 |
| ▸ | AKR1B1 | P15121 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5830944 | 0.90 | CYP2C19 (0.56) | TDP1CYP1A2CYP2C19CYP2C9CYP2D6 | |
| SCHEMBL10750285 | 0.85 | MAOB (0.58) | TDP1CYP1A2CYP2C19CYP2C9CYP2D6 | |
| SCHEMBL3741222 | 0.84 | GPR52 (0.47) | TDP1CYP1A2CYP2C19CYP2C9CYP2D6 | |
| SCHEMBL5551802 | 0.82 | MC5R (0.58) | TDP1CYP1A2CYP2C19CYP2C9CYP2D6 | |
| SCHEMBL7415238 | 0.82 | ALDH1A1 (0.46) | CYP1A2CYP2C19CYP2C9CYP2D6HPGD | |
| SCHEMBL5252496 | 0.78 | CYP2C19 (0.50) | TDP1CYP1A2CYP2C19CYP2C9CYP2D6 | |
| SCHEMBL74275 | 0.76 | MAOB (0.67) | TDP1HPGDMAOBALDH1A1SMN1; SMN2 | |
| SCHEMBL18242791 | 0.76 | CYP2C19 (0.47) | TDP1CYP1A2CYP2C19CYP2C9CYP2D6 | |
| SCHEMBL147085 | 0.75 | CYP2C19 (0.54) | TDP1CYP1A2CYP2C19CYP2C9CYP2D6 | |
| SCHEMBL31738884 | 0.75 | CYP2C19 (0.54) | TDP1CYP1A2CYP2C19CYP2C9CYP2D6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4725601-A | Certain imidazo[1,2-a]pyridines useful in the treatment of ulcers | FUJISAWA PHARMACEUTICAL CO., LTD. (JP) | 1988-02-16 | — | — | US | claimed |
| CN-107548385-B | Olefin oligomerization process using catalyst comprising chromium complex with phosphacycle-containing ligand | 陶氏环球技术有限责任公司 | 2022-01-21 | — | — | CN | disclosed |
| CN-113896607-A | Olefin oligomerization process using catalyst comprising chromium complex with phosphacycle-containing ligand | 陶氏环球技术有限责任公司 | 2022-01-07 | — | — | CN | disclosed |
| CN-107592863-B | Chromium complexes with ligands containing phosphacycles and olefin oligomerization catalysts therefrom | 陶氏环球技术有限责任公司 | 2021-09-10 | — | — | CN | disclosed |
| CN-107567355-B | Phosphacycle-containing ligands for chromium complexes and olefin oligomerization catalysts therefrom | 陶氏环球技术有限责任公司 | 2021-07-23 | — | — | CN | disclosed |
| US-9263416-B2 | Methods and materials useful for chip stacking, chip and wafer bonding | SUMITOMO BAKELITE CO., LTD. (JP) | 2016-02-16 | — | — | US | disclosed |
| US-20140349446-A1 | METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING | PROMERUS, LLC (US) | 2014-11-27 | — | — | US | disclosed |
| US-8816485-B2 | Methods and materials useful for chip stacking, chip and wafer bonding | SUMITOMO BAKELITE CO., LTD. (JP) | 2014-08-26 | — | — | US | disclosed |
| CN-101432867-B | Methods and materials useful for chip stacking, chip and wafer bonding | PROMERUS LLC | 2013-10-23 | — | — | CN | disclosed |
| CN-103311208-A | Methods and materials useful for chip stacking, chip and wafer bonding | PROMERUS LLC | 2013-09-18 | — | — | CN | disclosed |
| US-7932161-B2 | Methods and materials useful for chip stacking, chip and wafer bonding | PROMERUS LLC (US) | 2011-04-26 | — | — | US | disclosed |
| EP-1771491-B1 | PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS | PROMERUS LLC (US) | 2009-11-18 | — | — | EP | disclosed |
| US-20090189277-A1 | PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS FOR LOW STRESS, HIGH TEMPERATURE FILMS | PROMERUS LLC (US) | 2009-07-30 | — | — | US | disclosed |
| CN-101432867-A | Methods and materials useful for chip stacking, chip and wafer bonding | PROMERUS LLC (US) | 2009-05-13 | — | — | CN | disclosed |
| US-20080073741-A1 | provide strong bonds while also being readily removed with little or no residues; reworkable; semiconductor; norbornene-type polymer derived from phenethyl norbornene, or glycidyl methyl ether norbornene or decyl norbornene | PROMERUS LLC (US) | 2008-03-27 | — | — | US | disclosed |
| US-20070232026-A1 | Methods and materials useful for chip stacking, chip and wafer bonding | PROMERUS LLC (US) | 2007-10-04 | — | — | US | disclosed |
| CN-101044185-A | Photosensitive compositions based on polycyclic polymers | PROMERUS LLC (US) | 2007-09-26 | — | — | CN | disclosed |
| EP-1771491-A1 | PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS | Promerus, LLC (US) | 2007-04-11 | — | — | EP | disclosed |
| WO-2006016925-A1 | PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS | PROMERUS LLC (US) | 2006-02-16 | — | — | WO | disclosed |
| US-20060020068-A1 | Photosensitive compositions based on polycyclic polymers for low stress, high temperature films | PROMERUS, LLC | 2006-01-26 | — | — | US | disclosed |