Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | RORC | P51449 | 1/20 | 0.37 |
| ▸ | POLB | P06746 | 2/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.33 |
| ▸ | CASP1 | P29466 | 1/20 | 0.33 |
| ▸ | RECQL | P46063 | 1/20 | 0.33 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | CA1 | P00915 | 1/20 | 0.31 |
| ▸ | CA2 | P00918 | 1/20 | 0.31 |
| ▸ | GAA | P10253 | 1/20 | 0.31 |
| ▸ | GFER | P55789 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6861064 | 0.89 | POLB (0.45) | RORCPOLBALDH1A1CYP3A4HPGD | |
| SCHEMBL16451462 | 0.88 | ESR1 (0.44) | RORCCYP3A4HPGDTSHRHIF1A | |
| SCHEMBL8845943 | 0.88 | ESR1 (0.42) | RORCALDH1A1CYP3A4 | |
| SCHEMBL8845408 | 0.86 | POLB (0.50) | POLBGAA | |
| SCHEMBL11022582 | 0.80 | ESR1 (0.39) | RORCPOLBALDH1A1CYP3A4 | |
| SCHEMBL9861275 | 0.79 | PDE2A (0.36) | ALDH1A1TSHR | |
| SCHEMBL9618626 | 0.77 | SHBG (0.38) | ALDH1A1CYP3A4ALOX15CASP1HIF1A | |
| SCHEMBL299993 | 0.76 | CA1 (0.58) | RORCALDH1A1CYP3A4HPGDALOX15 | |
| SCHEMBL7641269 | 0.76 | RORC (0.46) | RORCPOLBALDH1A1CYP3A4HPGD | |
| SCHEMBL9684264 | 0.76 | POLB (0.61) | POLBALDH1A1CYP3A4TSHRTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20130165603-A1 | Adhesive Composition And Adhesive Film Comprising The Same | CHEIL INDUSTRIES, INC. (KR) | 2013-06-27 | — | — | US | claimed |
| US-20250326948-A1 | COATING KIT AND METHOD FOR REPAIR AND/OR RECONSTITUTION OF RUBBER AND/OR METAL WORN AREAS | BERTECH PANAMA S A (PA) | 2025-10-23 | — | — | US | disclosed |
| WO-2024052724-A1 | COATING KIT AND METHOD FOR REPAIR AND/OR RECONSTITUTION OF RUBBER AND/OR METAL WORN AREAS | BERTECH PANAMÁ S.A. (PA) | 2024-03-14 | — | — | WO | disclosed |
| US-9957425-B2 | Adhesive composition for semiconductor and adhesive film including the same | CHEIL INDUSTRIES, INC. (KR) | 2018-05-01 | — | — | US | disclosed |
| US-9169425-B2 | Adhesive film and electronic device including the same | CHEIL INDUSTRIES, INC. (KR) | 2015-10-27 | — | — | US | disclosed |
| US-9109147-B2 | Adhesive composition for semiconductor and adhesive film comprising the same | CHEIL INDUSTRIES, INC. (KR) | 2015-08-18 | — | — | US | disclosed |
| US-8946343-B2 | Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film | CHEIL INDUSTRIES, INC. (KR) | 2015-02-03 | — | — | US | disclosed |
| US-20140194555-A1 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM INCLUDING THE SAME | CHEIL INDUSTRIES, INC. (KR) | 2014-07-10 | — | — | US | disclosed |
| US-20140186607-A1 | ADHESIVE COMPOSITION FOR A SEMICONDUCTOR, ADHESIVE FILM PREPARED FROM THE COMPOSITION, AND SEMICONDUCTOR DEVICE CONNECTED BY THE FILM | CHEIL INDUSTRIES, INC. (KR) | 2014-07-03 | — | — | US | disclosed |
| US-20130281559-A1 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME | CHEIL INDUSTRIES, INC. (KR) | 2013-10-24 | — | — | US | disclosed |
| US-6046072-A | BONDING A SEMICONDUCTOR CHIP TO A LEAD FRAME WITH ADHESIVE MEMBER HAVING LOW MOISTURE ABSORBING, LOW FLOW ADHESIVE AND ENCAPSULATING PACKAGE WITH SEALANT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-04-04 | — | — | US | disclosed |
| EP-0618614-B1 | Heat-resistant adhesive for the fabrication of a semiconductor package | HITACHI CHEMICAL CO LTD (JP) | 1999-01-07 | — | — | EP | disclosed |
| EP-0862205-A1 | Heat-resistant adhesive | HITACHI CHEMICAL CO., LTD. (JP) | 1998-09-02 | — | — | EP | disclosed |
| EP-0538850-B1 | New polyurea resins and their preparation and use | IHARA CHEMICAL IND CO (JP) | 1997-01-22 | — | — | EP | disclosed |
| EP-0618614-A2 | Heat-resistant adhesive for the fabrication of a semiconductor package | Hitachi Chemical Co., Ltd. (JP) | 1994-10-05 | — | — | EP | disclosed |
| US-5319058-A | Improved heat resistance when polyisocyanate component is a combination of an aliphatic diisocyanate and a cyclic trimer of an aliphatic polyisocyanate | IHARA CHEMICAL INDUSTRY CO., LTD. (JP) | 1994-06-07 | — | — | US | disclosed |
| EP-0279376-B1 | Process for producing polyurea resin | IHARA CHEMICAL IND CO (JP) | 1993-11-03 | — | — | EP | disclosed |
| EP-0538850-A2 | New polyurea resins and their preparation and use | IHARA CHEMICAL INDUSTRY Co., Ltd. (JP) | 1993-04-28 | — | — | EP | disclosed |
| US-5086153-A | Reacting aromatic polyamine, specific aminobenzoate derivative and polyisocyanate | IHARA CHEMICAL INDUSTRY CO., LTD. (JP) | 1992-02-04 | — | — | US | disclosed |
| US-5039775-A | Process for producing polyurea resin | IHARA CHEMICAL INDUSTRY CO., LTD. (JP) | 1991-08-13 | — | — | US | disclosed |