SCHEMBL653256

SCHEMBL653256

Nc1ccccc1Oc1ccc(C(c2ccc(Oc3ccccc3N)cc2)(C(F)(F)F)C(F)(F)F)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 2/20 0.50
RCE1 Q9Y256 1/20 0.50
IKBKB O14920 2/20 0.47
BRAF P15056 1/20 0.47
L3MBTL1 Q9Y468 4/20 0.46
RAB9A P51151 1/20 0.46
MAPT P10636 3/20 0.46
KDM4E B2RXH2 1/20 0.46
CRHBP P24387 1/20 0.46
CRHR2 Q13324 1/20 0.46
ALDH1A1 P00352 4/20 0.44
LMNA P02545 1/20 0.43
ATM Q13315 1/20 0.43
LTA4H P09960 1/20 0.42
CYP1A2 P05177 3/20 0.41
CYP2C19 P33261 3/20 0.41
CYP3A4 P08684 2/20 0.41
TLR4 O00206 1/20 0.41
NPSR1 Q6W5P4 1/20 0.40
ADRA2B P18089 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6407132 0.94 MAOA (0.46) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL9651496 0.94 MAOA (0.46) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL6402981 0.87 MAOB (0.51) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL31105162 0.87 MAOB (0.51) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL641043 0.86 L3MBTL1 (0.57) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL31544628 0.84 L3MBTL1 (0.42) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL6558853 0.84 L3MBTL1 (0.42) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL6682790 0.83 GAA (0.47) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL2285909 0.81 GAA (0.69) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL19056222 0.81 GAA (0.45) GAARCE1IKBKBBRAFL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 498 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113677755-B Substrate for heat-resistant electronic device 株式会社LG化学 2023-06-16 CN claimed
US-20220195118-A1 SUBSTRATE FOR HEAT-RESISTANT ELECTRONIC DEVICE LG CHEM, LTD. (KR) 2022-06-23 US claimed
CN-113677755-A Substrate for heat-resistant electronic device 株式会社LG化学 2021-11-19 CN claimed
EP-3150655-B1 POLYIMIDE-BASED LIQUID AND POLYIMIDE-BASED FILM PRODUCED USING SAME LG CHEMICAL LTD (KR) 2021-05-05 EP claimed
CN-107722270-B Polyimide-based liquid and polyimide-based film prepared using the same 株式会社LG化学 2021-04-20 CN claimed
WO-2020204513-A1 SUBSTRATE FOR HEAT-RESISTANT ELECTRONIC DEVICE 주식회사 엘지화학 2020-10-08 WO claimed
US-10647883-B2 Polyimide-based solution and polyimide-based film produced using same LG CHEM. LTD. (KR) 2020-05-12 US claimed
US-10144847-B2 Polyimide-based solution and polyimide-based film produced using same LG CHEM, LTD. (KR) 2018-12-04 US claimed
EP-3150655-A1 POLYIMIDE-BASED LIQUID AND POLYIMIDE-BASED FILM PRODUCED USING SAME LG Chem, Ltd. (KR) 2017-04-05 EP claimed
US-20160251545-A1 POLYIMIDE-BASED SOLUTION AND POLYIMIDE-BASED FILM PRODUCED USING SAME LG CHEM, LTD. (KR) 2016-09-01 US claimed
US-4996254-A From 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane and a 2,2-bis(4-aminophenoxyphenyl)hexafluoropropane, cycloaliphatic keto ne solvent, preventing precipitation during spin coating under humid conditions ETHYL CORPORATION (US) 1991-02-26 US claimed
US-4956451-A FLUORINATED POLYIMIDES FOR USE IN SPIN COATED SEMICONDUCTOR WAFERS, SOLUTIONS IN SOLVENTS ETHYL CORPORATION (US) 1990-09-11 US claimed
US-4943682-A POLYIMIDATION OF A SOLUTION OF A POLYAMIC ACID DERIVED FROM A TETRACARBOXYLIC ACID AND A 2,2-BIS(4-(AMINOPHENOXY)PHENYL) HEXAFLUOROPROPYLENE IN A TWO-PHASE SOLVENT MIXTURE ETHYL CORPORATION (US) 1990-07-24 US claimed
EP-0373647-A2 Production of particulate polyimide polymers ETHYL CORPORATION (US) 1990-06-20 EP claimed
EP-0368044-A1 Method of coating carbon bodies ETHYL CORPORATION (US) 1990-05-16 EP claimed
US-4923954-A Production of particulate polyimide polymers ETHYL CORPORATION (US) 1990-05-08 US claimed
EP-0364791-A2 Compositions for production of electronic coatings ETHYL CORPORATION (US) 1990-04-25 EP claimed
US-4879182-A Method of coating carbon bodies ETHYL CORPORATION (US) 1989-11-07 US claimed
US-4859530-A High temperature adhesive for polymide films ETHYL CORPORATION (US) 1989-08-22 US claimed
EP-0298668-A2 High temperature adhesive for polyimide films and its use ETHYL CORPORATION (US) 1989-01-11 EP claimed