Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PTPN1 | P18031 | 1/20 | 0.48 |
| ▸ | HTR6 | P50406 | 3/20 | 0.43 |
| ▸ | TSHR | P16473 | 2/20 | 0.43 |
| ▸ | LMNA | P02545 | 2/20 | 0.43 |
| ▸ | MPO | P05164 | 1/20 | 0.43 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.43 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.43 |
| ▸ | PLA2G7 | Q13093 | 1/20 | 0.43 |
| ▸ | GLA | P06280 | 1/20 | 0.42 |
| ▸ | POLB | P06746 | 1/20 | 0.42 |
| ▸ | GAA | P10253 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.39 |
| ▸ | PKM | P14618 | 1/20 | 0.39 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.39 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 3/20 | 0.38 |
| ▸ | RAB9A | P51151 | 1/20 | 0.38 |
| ▸ | FFAR4 | Q5NUL3 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 2/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29352455 | 0.87 | TSHR (0.53) | TSHRLMNACYP3A4CYP2C9GLA | |
| SCHEMBL649657 | 0.87 | TSHR (0.53) | TSHRLMNACYP3A4CYP2C9GLA | |
| SCHEMBL1352801 | 0.86 | TSHR (0.52) | TSHRLMNACYP3A4PLA2G7GLA | |
| SCHEMBL29448858 | 0.86 | TSHR (0.52) | TSHRLMNACYP3A4PLA2G7GLA | |
| SCHEMBL7187793 | 0.86 | TSHR (0.52) | TSHRLMNACYP3A4GLAPOLB | |
| SCHEMBL9680721 | 0.83 | TSHR (0.48) | TSHRLMNACYP3A4GLAPOLB | |
| SCHEMBL651384 | 0.83 | TSHR (0.48) | TSHRLMNACYP3A4GLAPOLB | |
| SCHEMBL24576233 | 0.82 | HTT (0.52) | PTPN1PLA2G7GAAPKMSLC6A4 | |
| SCHEMBL5583856 | 0.81 | L3MBTL1 (0.53) | TSHRLMNAGLAPOLBGAA | |
| SCHEMBL2791640 | 0.81 | TSHR (0.47) | TSHRLMNACYP3A4GLAPOLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 217 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7459047-B2 | Preparation of flexible copper foil/polyimide laminate | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-12-02 | — | — | US | claimed |
| US-5601905-A | Laminate for insulation protection of circuit boards | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1997-02-11 | — | — | US | claimed |
| US-5399655-A | Acid-labile poly(amic acetal ester) | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1995-03-21 | — | — | US | claimed |
| EP-4398289-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROCESSING LIQUID | FUJIFILM Corporation (JP) | 2024-07-10 | — | — | EP | disclosed |
| WO-2024071066-A1 | METAL-CLAD LAMINATED PLATE | 日鉄ケミカル＆マテリアル株式会社 | 2024-04-04 | — | — | WO | disclosed |
| WO-2024063025-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-28 | — | — | WO | disclosed |
| US-11934102-B2 | Manufacturing method for cured substance, manufacturing method for laminate, and manufacturing method for semiconductor device, and treatment liquid | FUJIFILM CORPORATION (JP) | 2024-03-19 | — | — | US | disclosed |
| WO-2024053655-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-14 | — | — | WO | disclosed |
| WO-2024048605-A1 | RESIN COMPOSITION, CURED PRODUCT, LAYERED BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAYERED BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048603-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048436-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| EP-0297139-A1 | FLEXIBLE PRINTED CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1989-01-04 | — | — | EP | disclosed |
| US-4792476-A | AROMATIC POLYIMIDES | HITACHI, LTD. (JP) | 1988-12-20 | — | — | US | disclosed |
| US-4760126-A | Fluorine-containing polyamide-acid derivative and polyimide | HITACHI, LTD. (JP) | 1988-07-26 | — | — | US | disclosed |
| US-4735492-A | POLYIMIDE-ISOIDOLOQUINAZOLINEDIONE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1988-04-05 | — | — | US | disclosed |
| US-4690999-A | MOLECULARLY-ORIENTED POLYIMIDES BASED ON PARA-AROMATIC DIAMINES; FILMS; PROTECTIVE COATINGS; INTEGRATED CIRCUITS | HITACHI, LTD. (JP) | 1987-09-01 | — | — | US | disclosed |
| EP-0219336-A2 | Liquid crystal orientation controlling film and liquid crystal device using the same | Hitachi Chemical Co., Ltd. (JP) | 1987-04-22 | — | — | EP | disclosed |
| US-4641924-A | Liquid crystal device | HITACHI, LTD. (JP) | 1987-02-10 | — | — | US | disclosed |
| EP-0142149-A2 | Use of fluorine containing polyimides for aligning layers of liquid crystal display devices. | HITACHI, LTD. (JP) | 1985-05-22 | — | — | EP | disclosed |
| EP-0133533-A2 | Low thermal expansion resin material for a wiring insulating film. | HITACHI, LTD. (JP) | 1985-02-27 | — | — | EP | disclosed |