Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 12/20 | 0.59 |
| ▸ | ESR2 | Q92731 | 9/20 | 0.59 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.50 |
| ▸ | MEN1 | O00255 | 1/20 | 0.50 |
| ▸ | CA2 | P00918 | 1/20 | 0.50 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.48 |
| ▸ | ADRA2A | P08913 | 2/20 | 0.48 |
| ▸ | SLC6A2 | P23975 | 2/20 | 0.48 |
| ▸ | HTR1A | P08908 | 1/20 | 0.48 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.48 |
| ▸ | HTR3A | P46098 | 1/20 | 0.48 |
| ▸ | BACE1 | P56817 | 1/20 | 0.48 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.48 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.48 |
| ▸ | BLM | P54132 | 1/20 | 0.46 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.46 |
| ▸ | LTA4H | P09960 | 1/20 | 0.46 |
| ▸ | IGF1R | P08069 | 1/20 | 0.45 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9415525 | 0.92 | ESR1 (0.52) | ESR1ESR2KMT2AMEN1CA2 | |
| SCHEMBL8994577 | 0.83 | ESR1 (0.62) | ESR1ESR2IGF1RALOX15 | |
| SCHEMBL8735323 | 0.82 | ESR1 (0.56) | ESR1ESR2KMT2AMEN1CA2 | |
| SCHEMBL219016 | 0.78 | ESR1 (0.56) | ESR1ESR2KMT2AMEN1CA2 | |
| SCHEMBL18481 | 0.78 | ESR1 (0.64) | ESR1ESR2KMT2AMEN1CA2 | |
| SCHEMBL14430263 | 0.78 | ESR1 (0.50) | ESR1ESR2KMT2AMEN1 | |
| SCHEMBL6842047 | 0.76 | ESR1 (0.61) | ESR1ESR2KMT2AMEN1SLC6A2 | |
| SCHEMBL2600042 | 0.74 | ESR1 (0.60) | ESR1ESR2KMT2AMEN1CA2 | |
| SCHEMBL16114597 | 0.74 | ESR1 (0.59) | ESR1ESR2KMT2AMEN1CA2 | |
| SCHEMBL2332824 | 0.74 | ESR1 (0.59) | ESR1ESR2KMT2AMEN1CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 125 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5650262-A | High-resolution negative photoresist with wide process latitude | OLIN MICROELECTRONIC CHEMICALS, INC. | 1997-07-22 | — | — | US | claimed |
| EP-0599779-A1 | High-resolution negative photoresist having extended processing latitude | OCG Microelectronic Materials AG (CH) | 1994-06-01 | — | — | EP | claimed |
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| US-20250264801-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-08-21 | — | — | US | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596608-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250236697-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-24 | — | — | US | disclosed |
| US-20250230283-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-17 | — | — | US | disclosed |
| WO-2024185652-A1 | RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-09-12 | — | — | WO | disclosed |
| WO-2024150700-A1 | RESIN COMPOSITION, CURED ARTICLE, MULTILAYER BODY, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2024-07-18 | — | — | WO | disclosed |
| US-5494785-A | High ortho-ortho bonded novolak binder resins and their use in a process for forming positive resist patterns | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-02-27 | — | — | US | disclosed |
| US-5473045-A | Two-step process; first noncatalyzed reaction of phenolic monomer with aldehyde source, then chain extension | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1995-12-05 | — | — | US | disclosed |
| US-5436098-A | Multilayer element with quinone diazide, resin and aromatic hydroxy compound for relief images | CIBA-GEIGY CORPORATION (US) | 1995-07-25 | — | — | US | disclosed |
| US-5413894-A | Positive-working photoresists also containing o-quinonediazide photosensitizers | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1995-05-09 | — | — | US | disclosed |
| EP-0623633-A2 | High ortho-ortho bonded novolak binder resins and their use in radiation-sensitive compositions | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1994-11-09 | — | — | EP | disclosed |
| US-5312720-A | Development of photosensitive images exposed photoresists | OCG MICROELECTRONIC MATERIALS INC. (US) | 1994-05-17 | — | — | US | disclosed |
| US-5296330-A | Resolution, amorphous | CIBA-GEIGY CORP. (US) | 1994-03-22 | — | — | US | disclosed |
| US-5278021-A | Photoactive compound | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1994-01-11 | — | — | US | disclosed |
| EP-0530148-A1 | Positive photo resist with increased dissolving power and reduced crystallisation tendency as well as new tetra(hydroxyphenyl)alkane | OCG Microelectronic Materials Inc. (US) | 1993-03-03 | — | — | EP | disclosed |