SCHEMBL6541586

SCHEMBL6541586

C=CC(CCCCCCCOCCCCCCCC(C=C)Cc1ccccc1)Cc1ccccc1

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 2/20 0.35
CSNK1E P49674 1/20 0.35
HDAC3 O15379 1/20 0.35
HDAC4 P56524 1/20 0.35
HDAC1 Q13547 1/20 0.35
HDAC7 Q8WUI4 1/20 0.35
HDAC2 Q92769 1/20 0.35
HDAC10 Q969S8 1/20 0.35
HDAC11 Q96DB2 1/20 0.35
HDAC8 Q9BY41 1/20 0.35
HDAC6 Q9UBN7 1/20 0.35
HDAC9 Q9UKV0 1/20 0.35
HDAC5 Q9UQL6 1/20 0.35
MMP1 P03956 2/20 0.34
MMP3 P08254 2/20 0.34
MMP8 P22894 2/20 0.34
L3MBTL1 Q9Y468 2/20 0.34
TDP1 Q9NUW8 1/20 0.34
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6541327 1.00 EPHX1 (0.35) EPHX1CSNK1EHDAC3HDAC4HDAC1
SCHEMBL6540268 0.93 EPHX1 (0.37) EPHX1HDAC3HDAC4HDAC1HDAC7
SCHEMBL9804098 0.86 EPHX1 (0.39) EPHX1MEN1KMT2AMMP13SLC6A2
Ethylene SCHEMBL28202425 0.81 L3MBTL1 (0.39) CSNK1EMMP1MMP3MMP8L3MBTL1
SCHEMBL14690339 0.78 CSNK1E (0.44) CSNK1ESLC6A2TAAR1MAOASLC6A4
SCHEMBL28412522 0.75 EPHX1 (0.40) EPHX1MEN1KMT2AMMP13SLC6A2
SCHEMBL9278975 0.75 HDAC3 (0.33) EPHX1CSNK1EHDAC3HDAC4HDAC1
SCHEMBL28419255 0.75 LMNA (0.38) EPHX1CSNK1EHDAC3HDAC4HDAC1
SCHEMBL28990363 0.75 CSNK1E (0.37) EPHX1CSNK1EMMP1MMP3MMP8
SCHEMBL19153099 0.74 TDP1 (0.40) EPHX1TDP1MMP13SLC6A2TAAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023017854-A1 RESIN COMPOSITION AND METHOD FOR PRODUCING SAME, AND COMPOSITE MATERIAL 昭和電工株式会社 2023-02-16 WO disclosed
CN-114846032-A Radical polymerizable resin composition and cured product thereof 昭和电工株式会社 2022-08-02 CN disclosed
CN-114829432-A Radical polymerizable resin composition and cured product thereof 昭和电工株式会社 2022-07-29 CN disclosed
CN-114685745-A Urethane (meth) acrylate and method for producing urethane (meth) acrylate resin 昭和电工株式会社 2022-07-01 CN disclosed
CN-109071777-B Composition for carbon fiber-reinforced resin, carbon fiber-reinforced resin composition, and cured product 昭和电工株式会社 2022-06-10 CN disclosed
CN-109863179-B Radical polymerizable resin composition 昭和电工株式会社 2021-11-16 CN disclosed
CN-107531813-B Radically polymerizable aqueous resin composition, method for curing same, and method for producing radically polymerizable aqueous resin composition 昭和电工株式会社 2020-06-26 CN disclosed
CN-107663260-B Polymer, and ion exchange membrane and structure reinforced membrane material containing same 财团法人工业技术研究院 2020-06-09 CN disclosed
CN-110799558-A Radical polymerizable resin composition and structure repair material 昭和电工株式会社 2020-02-14 CN disclosed
CN-107663260-A Polymer, and ion exchange membrane and structure reinforced membrane material containing same 财团法人工业技术研究院 2018-02-06 CN disclosed
US-20180030187-A1 POLYMER, ION EXCHANGE MEMBRANE AND STRUCTURAL ENHANCED MEMBRANE EMPLOYING THE SAME INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2018-02-01 US disclosed
US-20040001961-A1 Curable resin composition useful for coating, multi-layer printed wiring board, printed wiring board and dry film TAMURA KAKEN CORPORATION (JP) 2004-01-01 US disclosed