SCHEMBL6554159

SCHEMBL6554159

C=CC(O)(C(=O)C(O)(C=C)c1ccccc1)c1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.46
ALDH1A1 P00352 1/20 0.46
HTT P42858 1/20 0.43
CYP1A2 P05177 3/20 0.40
AKT1 P31749 1/20 0.40
KMT2A Q03164 2/20 0.38
MAPT P10636 2/20 0.38
NPSR1 Q6W5P4 1/20 0.37
CYP2C19 P33261 3/20 0.36
CYP2C9 P11712 2/20 0.36
KCNN4 O15554 1/20 0.36
TGM2 P21980 1/20 0.36
HIF1A Q16665 1/20 0.36
KEAP1 Q14145 1/20 0.36
NFE2L2 Q16236 1/20 0.36
HDAC3 O15379 1/20 0.35
HDAC4 P56524 1/20 0.35
HDAC1 Q13547 1/20 0.35
HDAC7 Q8WUI4 1/20 0.35
HDAC2 Q92769 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4888619 0.87 TSHR (0.50) TSHRALDH1A1HTTCYP1A2AKT1
SCHEMBL1123626 0.82 CES1 (0.46) TSHRALDH1A1HTTCYP1A2AKT1
SCHEMBL13765616 0.79 KCNN4 (0.56) TSHRALDH1A1HTTKMT2AMAPT
SCHEMBL13765701 0.79 KCNN4 (0.56) TSHRALDH1A1HTTKMT2AMAPT
SCHEMBL29163775 0.75 PIN1 (0.47) TSHRALDH1A1KMT2AMAPTNPSR1
SCHEMBL11043920 0.72 HTT (0.46) TSHRALDH1A1HTTCYP1A2AKT1
SCHEMBL17022732 0.72 MAPT (0.41) TSHRALDH1A1HTTCYP1A2AKT1
SCHEMBL902761 0.72 ALDH1A1 (0.42) TSHRALDH1A1HTTCYP1A2AKT1
SCHEMBL4887210 0.72 KDM4E (0.48) TSHRALDH1A1HTTCYP1A2AKT1
SCHEMBL10608360 0.72 ALDH1A1 (0.42) TSHRALDH1A1HTTCYP1A2AKT1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4317287-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2024-02-07 EP disclosed
CN-116253888-A Curable silicone composition and cured product thereof 杜邦东丽特殊材料株式会社 2023-06-13 CN disclosed
EP-1220823-B1 PROCESS FOR THE SYNTHESIS OF 2-HYDROXYPHENYL ALKYL KETONES ENDURA SPA (IT) 2004-02-25 EP disclosed
EP-1220823-A1 PROCESS FOR THE SYNTHESIS OF 2-HYDROXYPHENYL ALKYL KETONES ENDURA S.p.A. (IT) 2002-07-10 EP disclosed
EP-0740213-B1 Positive photoresist composition FUJI PHOTO FILM CO LTD (JP) 2001-08-08 EP disclosed
WO-2001023339-A1 PROCESS FOR THE SYNTHESIS OF 2-HYDROXYPHENYL ALKYL KETONES ENDURA S.P.A. (IT) 2001-04-05 WO disclosed
EP-0745575-B1 Method of synthesizing polyphenol compound and positive working photoresist composition comprising polyphenol compound FUJI PHOTO FILM CO LTD (JP) 2000-09-06 EP disclosed
EP-0753795-B1 Positive working photoresist composition FUJI PHOTO FILM CO LTD (JP) 1999-10-13 EP disclosed
EP-0764884-B1 Positive working photoresist composition FUJI PHOTO FILM CO LTD (JP) 1999-09-01 EP disclosed
US-5853949-A Method of synthesizing polyphenol compound and positive working photoresist composition comprising polyphenol compound FUJI PHOTO FILM CO., LTD. (JP) 1998-12-29 US disclosed
US-5747218-A NAPHTHOQUINONEDIAZIDE SULFONIC ACID TETRAESTER OF POLYHYDROXYPOLYPHENOLS FUJI PHOTO FILM CO., LTD. (JP) 1998-05-05 US disclosed
US-5709977-A Positive working photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1998-01-20 US disclosed
US-5667932-A NAPHTHOQUINONEDIAZIDE SULFONIC ESTER OF POLYHYDROXY COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 1997-09-16 US disclosed
US-5652081-A PHENOLIC RESIN FUJI PHOTO FILM CO., LTD. (JP) 1997-07-29 US disclosed
EP-0764884-A2 Positive working photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1997-03-26 EP disclosed
EP-0753795-A1 Positive working photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1997-01-15 EP disclosed
EP-0745575-A1 Method of synthesizing polyphenol compound and positive working photoresist composition comprising polyphenol compound FUJI PHOTO FILM CO., LTD. (JP) 1996-12-04 EP disclosed
EP-0744661-A1 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1996-11-27 EP disclosed
EP-0740213-A2 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1996-10-30 EP disclosed
US-4163098-A Coating compound based on epoxide resin, an amine curing agent, and a hydrazone modifier CIBA-GEIGY CORPORATION (US) 1979-07-31 US disclosed