SCHEMBL6561415

SCHEMBL6561415

CC(C)CO[Si](C#Cc1ccccc1)(OCC(C)C)OCC(C)C

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTR2A P28223 1/20 0.41
APP P05067 1/20 0.38
SIGMAR1 Q99720 1/20 0.37
GRM5 P41594 3/20 0.36
HPGD P15428 3/20 0.36
ALDH1A1 P00352 3/20 0.36
NPC1 O15118 2/20 0.36
RAB9A P51151 2/20 0.36
SMN1; SMN2 Q16637 2/20 0.36
CYP1A2 P05177 2/20 0.36
CYP3A4 P08684 2/20 0.36
CYP2C9 P11712 2/20 0.36
CYP2C19 P33261 2/20 0.36
THPO P40225 2/20 0.36
KDM4E B2RXH2 1/20 0.36
MEN1 O00255 1/20 0.36
TP53 P04637 1/20 0.36
CYP2D6 P10635 1/20 0.36
PKM P14618 1/20 0.36
ALOX15 P16050 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6564296 0.87 HTR2A (0.42) HTR2AAPPSIGMAR1GRM5HPGD
SCHEMBL6564093 0.86 HTR2A (0.41) HTR2AAPPSIGMAR1GRM5HPGD
SCHEMBL6562820 0.79 APP (0.42) HTR2AAPPGRM5HPGDALDH1A1
SCHEMBL6564478 0.76 APP (0.39) HTR2AAPPGRM5HPGDALDH1A1
SCHEMBL6562608 0.76 APP (0.42) HTR2AAPPSIGMAR1GRM5HPGD
SCHEMBL6561472 0.75 APP (0.38) HTR2AAPPGRM5HPGDALDH1A1
SCHEMBL6562783 0.74 LTA4H (0.44) APPGRM5HPGDALDH1A1NPC1
SCHEMBL6562999 0.74 HTR2A (0.40) HTR2AAPPSIGMAR1GRM5HPGD
SCHEMBL6564378 0.73 APP (0.39) HTR2AAPPGRM5HPGDALDH1A1
SCHEMBL6562897 0.72 APP (0.48) APPGRM5HPGDALDH1A1NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed