SCHEMBL6561437

SCHEMBL6561437

CCO[SiH2]C(C#Cc1ccccc1)C#Cc1ccccc1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.38
HTR2A P28223 1/20 0.37
NPSR1 Q6W5P4 1/20 0.36
KCNH2 Q12809 1/20 0.35
CYP1A2 P05177 1/20 0.34
CYP3A4 P08684 1/20 0.34
CYP2C9 P11712 1/20 0.34
CYP2C19 P33261 1/20 0.34
THPO P40225 1/20 0.34
CHRNB2 P17787 1/20 0.34
CHRNB4 P30926 1/20 0.34
CHRNA3 P32297 1/20 0.34
CHRNA7 P36544 1/20 0.34
CHRNA4 P43681 1/20 0.34
BLM P54132 1/20 0.33
PMP22 Q01453 1/20 0.33
SIGMAR1 Q99720 1/20 0.33
GAA P10253 1/20 0.33
KMT2A Q03164 1/20 0.33
MMP2 P08253 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6561429 0.72 NPSR1 (0.39) APPNPSR1CYP3A4CYP2C9CYP2C19
SCHEMBL3901448 0.72 APP (0.42) APPHTR2ANPSR1CYP1A2CYP3A4
SCHEMBL6255376 0.71 APP (0.46) APPHTR2ANPSR1CYP1A2CYP3A4
SCHEMBL27702933 0.69 APP (0.48) APPHTR2ANPSR1KCNH2CYP1A2
SCHEMBL242576 0.67 LMNA (0.40) HTR2AKMT2A
SCHEMBL6562911 0.67 HTR2A (0.40) APPHTR2ANPSR1CYP1A2CYP3A4
SCHEMBL7326611 0.66 APP (0.50) APPHTR2ANPSR1KCNH2CYP1A2
Diphenylacetylene SCHEMBL27299894 0.66 APP (0.57) APPHTR2ANPSR1KCNH2CYP1A2
SCHEMBL2569114 0.66 LMNA (0.48) APPHTR2ANPSR1CYP1A2CYP3A4
SCHEMBL28242604 0.66 APP (0.44) APPHTR2ANPSR1CYP1A2CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed