SCHEMBL6561429

SCHEMBL6561429

CC(=O)O[SiH2]C(C#Cc1ccccc1)C#Cc1ccccc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPSR1 Q6W5P4 1/20 0.39
FFAR1 O14842 4/20 0.37
VCP P55072 1/20 0.36
APP P05067 1/20 0.35
ELANE P08246 1/20 0.35
ALDH1A1 P00352 3/20 0.35
KDM4E B2RXH2 2/20 0.35
LMNA P02545 2/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
MAPT P10636 2/20 0.35
HPGD P15428 2/20 0.35
CYP3A4 P08684 1/20 0.35
CYP2C9 P11712 1/20 0.35
CYP2C19 P33261 1/20 0.35
ALOX5 P09917 1/20 0.35
NPC1 O15118 2/20 0.34
RAB9A P51151 2/20 0.34
MTOR P42345 1/20 0.34
PAM P19021 1/20 0.34
POLB P06746 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7021794 0.72 FFAR1 (0.42) NPSR1FFAR1VCPAPPALDH1A1
SCHEMBL6564044 0.72 MAPT (0.43) NPSR1FFAR1VCPAPPALDH1A1
SCHEMBL706629 0.69 ALDH1A1 (0.44) ELANEALDH1A1KDM4ELMNAL3MBTL1
SCHEMBL6562936 0.69 FFAR1 (0.40) NPSR1FFAR1VCPAPPALDH1A1
Diphenylacetylene SCHEMBL27967498 0.69 APP (0.52) NPSR1FFAR1VCPAPPALDH1A1
SCHEMBL9364505 0.67 NPSR1 (0.46) NPSR1FFAR1VCPAPPALDH1A1
SCHEMBL10412818 0.67 FFAR1 (0.44) NPSR1FFAR1VCPAPPALDH1A1
SCHEMBL6562696 0.67 NPSR1 (0.42) NPSR1FFAR1VCPAPPALDH1A1
SCHEMBL7937064 0.66 ALDH1A1 (0.42) NPSR1FFAR1VCPAPPELANE
SCHEMBL28978986 0.66 ALDH1A1 (0.40) NPSR1FFAR1ALDH1A1MAPTCYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed