SCHEMBL6561445

SCHEMBL6561445

CC(C#Cc1ccccc1)(C#Cc1ccccc1)CO[SiH3]

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.44
APP P05067 1/20 0.39
CYP1A2 P05177 1/20 0.35
CYP3A4 P08684 1/20 0.35
CYP2C9 P11712 1/20 0.35
CYP2C19 P33261 1/20 0.35
THPO P40225 1/20 0.35
BLM P54132 1/20 0.34
PMP22 Q01453 1/20 0.34
HTR2A P28223 1/20 0.34
FFAR1 O14842 3/20 0.33
NPSR1 Q6W5P4 2/20 0.33
NPC1 O15118 1/20 0.33
MTOR P42345 1/20 0.33
RAB9A P51151 1/20 0.33
KCNH2 Q12809 1/20 0.32
CHRNB2 P17787 1/20 0.32
CHRNB4 P30926 1/20 0.32
CHRNA3 P32297 1/20 0.32
CHRNA7 P36544 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6562562 0.82 MAPT (0.38) MAPTAPPCYP1A2CYP3A4CYP2C9
SCHEMBL6562881 0.81 APP (0.42) MAPTAPPCYP1A2CYP3A4CYP2C9
SCHEMBL6564437 0.76 APP (0.38) MAPTAPPCYP1A2CYP3A4CYP2C9
SCHEMBL6564064 0.75 APP (0.44) MAPTAPPCYP1A2CYP3A4CYP2C9
SCHEMBL6562532 0.72 MAPT (0.41) MAPTAPPCYP1A2CYP3A4CYP2C9
Diphenylacetylene SCHEMBL27299894 0.71 APP (0.57) MAPTAPPCYP1A2CYP3A4CYP2C9
SCHEMBL26208850 0.71 APP (0.44) MAPTAPPCYP1A2CYP3A4CYP2C9
SCHEMBL562815 0.71 APP (0.55) MAPTAPPCYP1A2CYP3A4CYP2C9
SCHEMBL2183993 0.71 APP (0.55) MAPTAPPCYP1A2CYP3A4CYP2C9
SCHEMBL6562626 0.70 MAPT (0.40) MAPTAPPCYP1A2CYP3A4CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed